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Gábor Takács
Gábor Takács
associate professor, BME
Verified email at vik.bme.hu - Homepage
Title
Cited by
Cited by
Year
Enhanced thermal characterization method of microscale heatsink structures
G Takács, PG Szabó, G Bognár
Microelectronics Reliability 67, 21-28, 2016
172016
Thermal management in System-on-Package structures by applying microscale heat sink. Part I: Consideration of the appropriate channel length of microscale heat sink (s)
G Takács, PG Szabó, G Bognár
Microelectronics Journal 46 (12), 1202-1207, 2015
142015
Improved thermal characterization method of integrated microscale heat sinks
G Takács, PG Szabó, B Plesz, G Bognár
Microelectronics Journal 45 (12), 1740-1745, 2014
142014
Modelling of the flow-rate dependent partial thermal resistance of integrated microscale cooling structures
G Takács, PG Szabó, G Bognár
Microsystem Technologies 23 (9), 4001-4010, 2017
122017
Fabrication and characterization of microscale heat sinks
G Takács, G Bognár, E Bándy, G Rózsás, PG Szabó
Microelectronics Reliability 79, 480-487, 2017
112017
Thermal modelling of integrated microscale heatsink structures
G Bognár, G Takács, L Pohl, PG Szabó
Microsystem Technologies 24 (1), 433-444, 2018
92018
Compact modeling approach for microchannel cooling and its validation
M Németh, G Takács, L Jani, A Poppe
Microsystem Technologies 24 (1), 419-431, 2018
92018
Thermal modelling of integrated microscale heatsink structures
G Bognár, G Takács, L Pohl, PG Szabó
2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS …, 2016
92016
Integrated microscale cooling for concentrator solar cells
B Plesz, G Takács, PG Szabó, Z Kohári, M Németh, G Bognár
2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS …, 2017
52017
Improved process for the manufacturing of back contact integrated cooling channels for concentrator solar cells
G Rózsás, G Bognár, G Takács, B Plesz
2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS …, 2019
42019
Generalization of the thermal model of infrared radiation sensors
G Bognár, PG Szabó, G Takács
Microelectronics Journal 46 (6), 543-550, 2015
42015
Integrating chip-level microfluidics cooling into system level design of digital circuits
G Bognár, G Takács, L Pohl, L Jani, A Timár, P Horváth, M Németh, ...
2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2017
32017
Process and Measurement of Electroplated Back-Contact Integrated Microchannel Cooling Devices for CPV Cells
G Rózsás, G Bognár, G Takács, PG Szabó, B Plesz
2020 26th International Workshop on Thermal Investigations of ICs and …, 0
3
Integrated cooling solution for concentrator photovoltaic cells
G Rózsás, G Bognár, G Takács, B Plesz
Pollack Periodica 16 (2), 110-116, 2021
22021
A novel approach for cooling chiplets in heterogeneously integrated 2.5 D packages applying microchannel heatsink embedded in the interposer
G Bognár, G Takács, PG Szabó
IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023
12023
Thermal modelling of embedded microscale channel structures realized in heterogeneous packaging
G Bognár, G Takács, PG Szabó
2022 28th International Workshop on Thermal Investigations of ICs and …, 2022
2022
Optimized process for the manufacturing of integrated microchannel cooling devices in the back contact of concentrator solar cells
G Rózsás, G Bognár, G Takács, B Plesz
2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS …, 2022
2022
Integrated Thermal Management in System-on-Package Devices
G Bognár, G Takács, PG Szabó, G Rózsás, L Pohl, B Plesz
Periodica Polytechnica Electrical Engineering and Computer Science 64 (2 …, 2020
2020
Integrált mikrocsatornás hűtőeszközök modellezése és karakterizációja
G Takács
Villamosmérnöki Tudományok Doktori Iskola, 2017
2017
Investigation of the pre-heating process during thermosonic wire bonding by FEM simulation
T Garami, G Takács, O Krammer, A Szabó
2015 38th International Spring Seminar on Electronics Technology (ISSE), 333-338, 2015
2015
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