Fabrication of porogen residues free and mechanically robust low-k materials AM Urbanowicz, P Verdonck, D Shamiryan, K Vanstreels, M Baklanov, ...
US Patent App. 12/831,935, 2011
463 2011 Metal-organic framework ZIF-8 films as low-κ dielectrics in microelectronics S Eslava, L Zhang, S Esconjauregui, J Yang, K Vanstreels, MR Baklanov, ...
Chemistry of Materials 25 (1), 27-33, 2012
273 2012 Soft, comfortable polymer dry electrodes for high quality ECG and EEG recording YH Chen, MO de Beeck, L Vanderheyden, E Carrette, V Mihajlović, ...
Sensors 14 (12), 23758-23780, 2014
256 2014 Cu pumping in TSVs: Effect of pre-CMP thermal budget I De Wolf, K Croes, OV Pedreira, R Labie, A Redolfi, M Van De Peer, ...
Microelectronics Reliability 51 (9-11), 1856-1859, 2011
141 2011 Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV C Okoro, K Vanstreels, R Labie, O Lühn, B Vandevelde, B Verlinden, ...
Journal of Micromechanics and Microengineering 20 (4), 045032, 2010
121 2010 Atomic layer deposition of ruthenium with TiN interface for sub-10 nm advanced interconnects beyond copper LG Wen, P Roussel, OV Pedreira, B Briggs, B Groven, S Dutta, ...
ACS applied materials & interfaces 8 (39), 26119-26125, 2016
116 2016 Improving mechanical robustness of ultralow- AM Urbanowicz, K Vanstreels, P Verdonck, D Shamiryan, S De Gendt, ...
Journal of Applied Physics 107 (10), 104122, 2010
99 2010 Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu C Okoro, R Labie, K Vanstreels, A Franquet, M Gonzalez, B Vandevelde, ...
Journal of Materials Science 46 (11), 3868-3882, 2011
90 2011 Ruthenium metallization for advanced interconnects LG Wen, C Adelmann, OV Pedreira, S Dutta, M Popovici, B Briggs, ...
Interconnect Technology Conference/Advanced Metallization Conference (IITC …, 2016
79 2016 Effect of porogen residue on chemical, optical, and mechanical properties of CVD SiCOH low-k materials AM Urbanowicz, K Vanstreels, D Shamiryan, S De Gendt, MR Baklanov
Electrochemical and Solid-State Letters 12 (8), H292-H295, 2009
63 2009 Mechanical stability of porous low-k dielectrics K Vanstreels, C Wu, MR Baklanov
ECS Journal of Solid State Science and Technology 4 (1), N3058-N3064, 2015
59 2015 Ultra-low-k cyclic carbon-bridged PMO films with a high chemical resistance F Goethals, I Ciofi, O Madia, K Vanstreels, MR Baklanov, C Detavernier, ...
Journal of Materials Chemistry 22 (17), 8281-8286, 2012
58 2012 Atomic Layer Deposition of Ruthenium Thin Films from (Ethylbenzyl)(1-Ethyl-1, 4-cyclohexadienyl) Ru: Process Characteristics, Surface Chemistry, and Film Properties M Popovici, B Groven, K Marcoen¶, QM Phung, S Dutta, J Swerts, ...
Chemistry of Materials 29 (11), 4654-4666, 2017
56 2017 Effect of pore structure of nanometer scale porous films on the measured elastic modulus K Vanstreels, C Wu, M Gonzalez, D Schneider, D Gidley, P Verdonck, ...
Langmuir 29 (38), 12025-12035, 2013
55 2013 Analysis and modeling of the high vacuum scanning spreading resistance microscopy nanocontact on silicon P Eyben, F Clemente, K Vanstreels, G Pourtois, T Clarysse, E Duriau, ...
Journal of Vacuum Science & Technology B, Nanotechnology and …, 2010
51 2010 Degradation of 248 nm deep UV photoresist by ion implantation D Tsvetanova, R Vos, G Vereecke, TN Parac-Vogt, F Clemente, ...
Journal of The Electrochemical Society 158 (8), H785-H794, 2011
46 2011 Effect of UV wavelength on the hardening process of porogen-containing and porogen-free ultralow- AM Urbanowicz, K Vanstreels, P Verdonck, E Van Besien, T Christos, ...
Journal of Vacuum Science & Technology B, Nanotechnology and …, 2011
45 2011 Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects G Vakanas, O Minho, B Dimcic, K Vanstreels, B Vandecasteele, ...
Microelectronic Engineering 140, 72-80, 2015
42 2015 3D stacking induced mechanical stress effects V Cherman, G Van der Plas, J De Vos, A Ivankovic, M Lofrano, V Simons, ...
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 309-315, 2014
36 2014 Intrinsic effect of porosity on mechanical and fracture properties of nanoporous ultralow-k dielectrics K Vanstreels, C Wu, P Verdonck, MR Baklanov
Applied Physics Letters 101 (12), 123109, 2012
35 2012 