Követés
Katsuyuki Sakuma
Katsuyuki Sakuma
Manager, Principal Research Staff Member, IBM Thomas J. Watson Research Center
E-mail megerősítve itt: us.ibm.com - Kezdőlap
Cím
Hivatkozott rá
Hivatkozott rá
Év
Three-dimensional silicon integration
JU Knickerbocker, PS Andry, B Dang, RR Horton, MJ Interrante, CS Patel, ...
IBM Journal of Research and Development 52 (6), 553-569, 2008
5572008
Future system-on-silicon LSI chips
M Koyanagi, H Kurino, KW Lee, K Sakuma, N Miyakawa, H Itani
IEEE micro 18 (4), 17-22, 1998
4231998
3D silicon integration
JU Knickerbocker, PS Andry, B Dang, RR Horton, CS Patel, RJ Polastre, ...
2008 58th Electronic Components and Technology Conference, 538-543, 2008
3022008
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
K Sakuma, PS Andry, CK Tsang, SL Wright, B Dang, CS Patel, BC Webb, ...
IBM Journal of Research and Development 52 (6), 611-622, 2008
2022008
Intelligent image sensor chip with three dimensional structure
H Kurino, KW Lee, T Nakamura, K Sakuma, KT Park, N Miyakawa, ...
International Electron Devices Meeting 1999. Technical Digest (Cat. No …, 1999
1791999
New three-dimensional wafer bonding technology using the adhesive injection method
TMT Matsumoto, MSM Satoh, KSK Sakuma, HKH Kurino, NMN Miyakawa, ...
Japanese journal of applied physics 37 (3S), 1217, 1998
1261998
3D chip stacking technology with low-volume lead-free interconnections
K Sakuma, PS Andry, B Dang, J Maria, CK Tsang, C Patel, SL Wright, ...
2007 Proceedings 57th Electronic Components and Technology Conference, 627-632, 2007
1192007
Development of three-dimensional integration technology for highly parallel image-processing chip
KW Lee, TNT Park, HSY Kim, HKH Kurino, MKM Koyanagi
Japanese Journal of Applied Physics 39 (4S), 2473, 2000
762000
IMC bonding for 3D interconnection
K Sakuma, K Sueoka, S Kohara, K Matsumoto, H Noma, T Aoki, Y Oyama, ...
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
732010
Heterogeneous integration technology demonstrations for future healthcare, IoT, and AI computing solutions
JU Knickerbocker, R Budd, B Dang, Q Chen, E Colgan, LW Hung, ...
2018 IEEE 68th electronic components and technology conference (ECTC), 1519-1528, 2018
572018
10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack
Y Ohara, A Noriki, K Sakuma, KW Lee, M Murugesan, J Bea, F Yamada, ...
2009 IEEE International Conference on 3D System Integration, 1-6, 2009
572009
Characterization of stacked die using die-to-wafer integration for high yield and throughput
K Sakuma, PS Andry, CK Tsang, K Sueoka, Y Oyama, C Patel, B Dang, ...
2008 58th Electronic Components and Technology Conference, 18-23, 2008
572008
Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack
K Matsumoto, S Ibaraki, K Sueoka, K Sakuma, H Kikuchi, Y Orii, ...
2011 27th Annual IEEE Semiconductor Thermal Measurement and Management …, 2011
53*2011
3D chip stacking with C4 technology
B Dang, SL Wright, PS Andry, EJ Sprogis, CK Tsang, MJ Interrante, ...
IBM Journal of Research and Development 52 (6), 599-609, 2008
482008
Liquid crystal display
K Sakuma, Y Sakaguchi
US Patent 6,937,233, 2005
432005
Structure for establishing interconnects in packages using thin interposers
BV Fasano, MS Cranmer, RF Indyk, H Cox, K Sakuma, ED Perfecto
US Patent 10,002,835, 2018
422018
Wearable nail deformation sensing for behavioral and biomechanical monitoring and human-computer interaction
K Sakuma, A Abrami, G Blumrosen, S Lukashov, R Narayanan, ...
Scientific reports 8 (1), 18031, 2018
382018
An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates
K Sakuma, K Tunga, B Webb, K Ramachandran, M Interrante, H Liu, ...
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 318-324, 2015
372015
Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections
K Sakuma, K Toriyama, H Noma, K Sueoka, N Unami, J Mizuno, S Shoji, ...
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 7-13, 2011
342011
A new wafer scale chip-on-chip (W-CoC) packaging technology using adhesive injection method
H Kurino, KW Lee, K Sakuma, T Nakamura, M Koyanagi
Japanese journal of applied physics 38 (4S), 2406, 1999
321999
A rendszer jelenleg nem tudja elvégezni a műveletet. Próbálkozzon újra később.
Cikkek 1–20