Coil design and measurements of automotive magnetic resonant wireless charging system for high-efficiency and low magnetic field leakage H Kim, C Song, DH Kim, DH Jung, IM Kim, YI Kim, J Kim, S Ahn, J Kim
IEEE Transactions on Microwave Theory and Techniques 64 (2), 383-400, 2016
227 2016 EMI reduction methods in wireless power transfer system for drone electrical charger using tightly coupled three-phase resonant magnetic field C Song, H Kim, Y Kim, D Kim, S Jeong, Y Cho, S Lee, S Ahn, J Kim
IEEE Transactions on Industrial Electronics 65 (9), 6839-6849, 2018
120 2018 Thin hybrid metamaterial slab with negative and zero permeability for high efficiency and low electromagnetic field in wireless power transfer systems Y Cho, S Lee, DH Kim, H Kim, C Song, S Kong, J Park, C Seo, J Kim
IEEE Transactions on Electromagnetic Compatibility 60 (4), 1001-1009, 2017
115 2017 MXene–Graphene Field-Effect Transistor Sensing of Influenza Virus and SARS-CoV-2 Y Li, Z Peng, NJ Holl, MR Hassan, JM Pappas, C Wei, OH Izadi, Y Wang, ...
ACS Omega, 2021
111 2021 Thin PCB-type metamaterials for improved efficiency and reduced EMF leakage in wireless power transfer systems Y Cho, JJ Kim, DH Kim, S Lee, H Kim, C Song, S Kong, H Kim, C Seo, ...
IEEE Transactions on Microwave Theory and Techniques 64 (2), 353-364, 2016
84 2016 Smartwatch Strap Wireless Power Transfer System With Flexible PCB Coil and Shielding Material S Jeong, DH Kim, J Song, H Kim, S Lee, C Song, J Lee, J Song, J Kim
IEEE Transactions on Industrial Electronics 66 (5), 4054-4064, 2018
77 2018 First demonstration of junctionless accumulation-mode bulk FinFETs with robust junction isolation TK Kim, DH Kim, YG Yoon, JM Moon, BW Hwang, DI Moon, GS Lee, ...
IEEE Electron Device Letters 34 (12), 1479-1481, 2013
77 2013 Origin of Device Performance Enhancement of Junctionless Accumulation-Mode (JAM) Bulk FinFETs With High- Gate Spacers JH Choi, TK Kim, JM Moon, YG Yoon, BW Hwang, DH Kim, SH Lee
IEEE Electron Device Letters 35 (12), 1182-1184, 2014
48 2014 Low Leakage Electromagnetic Field Level and High Efficiency Using a Novel Hybrid Loop-Array Design for Wireless High Power Transfer System S Lee, DH Kim, Y Cho, H Kim, C Song, S Jeong, J Song, G Park, S Hong, ...
IEEE Transactions on Industrial Electronics 66 (6), 4356-4367, 2018
39 2018 Modeling and analysis of TSV noise coupling effects on RF LC-VCO and shielding structures in 3D IC J Lim, J Cho, DH Jung, JJ Kim, S Choi, DH Kim, M Lee, J Kim
IEEE Transactions on Electromagnetic Compatibility 60 (6), 1939-1947, 2018
16 2018 Design of conductive shield for wireless power transfer system for electric vehicle considering automotive body H Kim, C Song, DH Kim, J Kim
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2015
16 2015 EMI reduction in wireless power transfer system using spread spectrum frequency dithering H Kim, J Kim, S Jeong, S Lee, Y Cho, DH Kim, J Kim
2016 IEEE Wireless Power Transfer Conference (WPTC), 1-3, 2016
15 2016 Polynomial Model-Based Eye Diagram Estimation Methods for LFSR-Based Bit Streams in PRBS Test and Scrambling J Park, S Park, Y Kim, G Park, H Park, D Lho, K Cho, S Lee, DH Kim, ...
IEEE Transactions on Electromagnetic Compatibility 61 (6), 1867-1875, 2019
14 2019 Measurement, Simulation and Mathematical Estimation of Magnetic Field Shielding Effectiveness of Sputtered Shielding Materials using Spiral Coils K Song, S Kim, S Jeong, DH Kim, K Son, J Heo, K Han, Y Jung, H Kim, ...
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018
14 2018 Modeling and analysis of return paths of common mode EMI noise currents from motor drive system in hybrid electric vehicle M Moon, H Kim, J Song, Y Kwack, DH Kim, B Kim, E Kim, J Kim
2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 82-85, 2015
12 2015 Limitations of First-Order Surface Impedance Boundary Condition and Its Effect on 2D Simulations for PCB Transmission Lines Y Guo, DH Kim, J He, S Yong, Y Liu, X Ye, J Fan
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020
11 2020 Through-Silicon Via Capacitance–Voltage Hysteresis Modeling for 2.5-D and 3-D IC DH Kim, Y Kim, J Cho, B Bae, J Park, H Lee, J Lim, JJ Kim, S Piersanti, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (6 …, 2017
11 2017 Selective harmonic elimination method of radiation noise from automotive wireless power transfer system using active rectifier H Kim, S Jeong, DH Kim, J Kim, YI Kim, IM Kim
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging …, 2016
11 2016 Algorithm for extracting parameters of the coupling capacitance hysteresis cycle for TSV transient modeling and robustness analysis S Piersanti, E Pellegrino, F De Paulis, A Orlandi, DH Jung, DH Kim, J Kim, ...
IEEE Transactions on Electromagnetic Compatibility 59 (4), 1329-1338, 2016
10 2016 Through silicon via time domain crosstalk modeling considering hysteretic coupling capacitance S Piersanti, F De Paulis, A Orlandi, DH Kim, J Cho, J Kim
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2015
10 2015