Christopher M. Gourlay
Christopher M. Gourlay
Department of Materials, Imperial College London
E-mail megerősítve itt: imperial.ac.uk - Kezdőlap
Hivatkozott rá
Hivatkozott rá
Dilatant shear bands in solidifying metals
CM Gourlay, AK Dahle
Nature 445 (7123), 70-73, 2007
The role of side-branching in microstructure development in laser powder-bed fusion
MS Pham, B Dovgyy, PA Hooper, CM Gourlay, A Piglione
Nature communications 11 (1), 1-12, 2020
Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates
K Nogita, CM Gourlay, T Nishimura
Jom 61 (6), 45-51, 2009
Defect band characteristics in Mg-Al and Al-Si high-pressure die castings
CM Gourlay, HI Laukli, AK Dahle
Metallurgical and Materials Transactions A 38 (8), 1833-1844, 2007
Microstructure formation in AlSi4MgMn and AlMg5Si2Mn high-pressure die castings
S Otarawanna, CM Gourlay, HI Laukli, AK Dahle
Metallurgical and Materials Transactions A 40 (7), 1645-1659, 2009
Migration of crystals during the filling of semi-solid castings
HI Laukli, CM Gourlay, AK Dahle
Metallurgical and Materials Transactions A 36 (3), 805-818, 2005
Printability and microstructure of the CoCrFeMnNi high-entropy alloy fabricated by laser powder bed fusion
A Piglione, B Dovgyy, C Liu, CM Gourlay, PA Hooper, MS Pham
Materials Letters 224, 22-25, 2018
Granular deformation mechanisms in semi-solid alloys
CM Gourlay, AK Dahle, T Nagira, N Nakatsuka, K Nogita, K Uesugi, ...
Acta Materialia 59 (12), 4933-4943, 2011
Revealing the micromechanisms behind semi-solid metal deformation with time-resolved X-ray tomography
KM Kareh, PD Lee, RC Atwood, T Connolley, CM Gourlay
Nature communications 5 (1), 1-7, 2014
The influence of 0–0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7 Cu-xNi
T Ventura, CM Gourlay, K Nogita, T Nishimura, M Rappaz, AK Dahle
Journal of Electronic Materials 37 (1), 32-39, 2008
Direct observation of deformation in semi-solid carbon steel
T Nagira, CM Gourlay, A Sugiyama, M Uesugi, Y Kanzawa, M Yoshiya, ...
Scripta Materialia 64 (12), 1129-1132, 2011
Kinetics of the η–η′ transformation in Cu6Sn5
K Nogita, CM Gourlay, SD McDonald, YQ Wu, J Read, QF Gu
Scripta Materialia 65 (10), 922-925, 2011
The influence of Ni additions on the relative stability of and
U Schwingenschlögl, C Di Paola, K Nogita, CM Gourlay
Applied Physics Letters 96 (6), 061908, 2010
Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections
JW Xian, SA Belyakov, M Ollivier, K Nogita, H Yasuda, CM Gourlay
Acta Materialia 126, 540-551, 2017
In situ investigation of unidirectional solidification in Sn–0.7 Cu and Sn–0.7 Cu–0.06 Ni
CM Gourlay, K Nogita, AK Dahle, Y Yamamoto, K Uesugi, T Nagira, ...
Acta Materialia 59 (10), 4043-4054, 2011
Engineering the Mg–Mg2Ni eutectic transformation to produce improved hydrogen storage alloys
K Nogita, S Ockert, J Pierce, MC Greaves, CM Gourlay, AK Dahle
International Journal of Hydrogen Energy 34 (18), 7686-7691, 2009
Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles
MAAM Salleh, SD McDonald, CM Gourlay, H Yasuda, K Nogita
Materials & Design 108, 418-428, 2016
Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5 Cu solders
ZL Ma, SA Belyakov, CM Gourlay
Journal of Alloys and Compounds 682, 326-337, 2016
Evidence of the hydrogen release mechanism in bulk MgH2
K Nogita, XQ Tran, T Yamamoto, E Tanaka, SD McDonald, CM Gourlay, ...
Scientific reports 5 (1), 1-5, 2015
Effects of Si content on defect band formation in hypoeutectic Al–Si die castings
HI Laukli, CM Gourlay, AK Dahle, O Lohne
Materials Science and Engineering: A 413, 92-97, 2005
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Cikkek 1–20