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Andras Vass-Varnai
Andras Vass-Varnai
Siemens Digital Industries Software
Verified email at mentor.com
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Cited by
Cited by
Year
Usage of Porous Al2O3 Layers for RH Sensing
V Timár-Horváth, L Juhász, A Vass-Várnai, G Perlaky
Proceedings of the Symposium on Design, Test, Integration and Packaging of …, 2007
30*2007
A detailed IC package numerical model calibration methodology
R Bornoff, A Vass-Varnai
29th IEEE Semiconductor Thermal Measurement and Management Symposium, 65-70, 2013
292013
Characterization method for thermal interface materials imitating an in-situ environment
A Vass-Várnai, Z Sárkány, M Rencz
Microelectronics Journal 43 (9), 661-668, 2012
282012
Thermal Simulations and Measurements–a Combined Approach for Package Characterization
A Vass-Varnai, R Bornoff, S Ress, Y Luo, A Poppe, G Farkas, M Rencz
ICEP, Jpn 76 (4), 886, 2000
242000
Measurement based compact thermal model creation-accurate approach to neglect inaccurate TIM conductivity data
A Vass-Varnai, R Bornoff, Z Sarkany, S Ress, M Rencz
2011 IEEE 13th Electronics Packaging Technology Conference, 67-72, 2011
222011
Issues in junction-to-case thermal characterization of power packages with large surface area
A Vass-Varnai, S Gao, Z Sarkany, J Kim, S Choi, G Farkas, A Poppe, ...
2010 26th Annual IEEE Semiconductor Thermal Measurement and Management …, 2010
222010
Package characterization: simulations or measurements?
A Poppe, A Vass-Varnai, G Farkas, M Rencz
2008 10th Electronics Packaging Technology Conference, 155-160, 2008
152008
Failure prediction of IGBT modules based on power cycling tests
Z Sarkany, A Vass-Varnai, G Hantos, M Rencz
19th International Workshop on Thermal Investigations of ICs and Systems …, 2013
142013
Comparison of different power cycling strategies for accelerated lifetime testing of power devices
Z Sarkany, A Vass-Varnai, M Rencz
Proceedings of the 5th Electronics System-integration Technology Conference …, 2014
132014
Thermal transient analysis of semiconductor device degradation in power cycling reliability tests with variable control strategies
Z Sarkany, A Vass-Varnai, S Laky, M Rencz
2014 semiconductor thermal measurement and management symposium (SEMI-THERM …, 2014
132014
Investigation of die-attach degradation using power cycling tests
Z Sarkany, A Vass-Varnai, M Rencz
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 780-784, 2013
132013
Accurate thermal characterization of power semiconductor packages by thermal simulation and measurements
A Vass-Varnai, R Bornoff, S Ress, Z Sarkany, S Hodossy, M Rencz
2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP …, 2011
132011
Suggestions for extending the scope of the transient dual interface method
A Poppe, A Vass-Varnai, Z Sarkany, M Rencz, G Hantos, G Farkas
2021 27th International Workshop on Thermal Investigations of ICs and …, 2021
122021
Analysis of concurrent failure mechanisms in IGBT structures during active power cycling tests
Z Sarkany, A Vass-Varnai, M Rencz
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 650-654, 2014
122014
Lifetime estimation of power electronics modules considering the target application
A Szel, Z Sarkany, M Bein, R Bornoff, A Vass-Varnai, M Rencz
2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2015
112015
Effect of power cycling parameters on predicted IGBT lifetime
Z Sarkany, A Vass-Varnai, M Rencz
2015 IEEE Aerospace Conference, 1-9, 2015
112015
Comparison of JEDEC dynamic and static test methods for the thermal characterization of power LEDs
A Vass-Varnai, J Parry, G Toth, S Ress, G Farkas, A Poppe, M Rencz
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 594-597, 2012
112012
An alternative method to accurately determine the thermal resistance of SiC MOSFET structures with discrete diodes
A Vass-Varnai, YJ Cho, G Farkas, M Rencz
2018 International Power Electronics Conference (IPEC-Niigata 2018-ECCE Asia …, 2018
102018
Detailed analysis of IC packages using thermal transient testing and CFD modelling for communication device applications
F Yake, W Gang, X Chen, WV Hon, X Fu, VV Andras
2016 22nd International Workshop on Thermal Investigations of ICs and …, 2016
92016
Method for in-situ reliability testing of TIM samples
A Vass-Varnai, Z Sarkany, M Rencz
2009 15th International Workshop on Thermal Investigations of ICs and …, 2009
82009
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