Annealing temperature effect on the Cu-Cu bonding energy for 3D-IC integration EJ Jang, JW Kim, B Kim, T Matthias, YB Park
Metals and Materials International 17, 105-109, 2011
47 2011 Effects of annealing and current stressing on the intermetallic compounds growth kinetics of Cu/thin Sn/Cu bump MH Jeong, JW Kim, BH Kwak, YB Park
Microelectronic Engineering 89, 50-54, 2012
45 2012 Significant enhancement of antimicrobial activity in oxygen-deficient zinc oxide nanowires A Elbourne, S Cheeseman, P Wainer, J Kim, AE Medvedev, KJ Boyce, ...
ACS Applied Bio Materials 3 (5), 2997-3004, 2020
37 2020 Correlations between interfacial reactions and bonding strengths of Cu/Sn/Cu pillar bump BH Kwak, MH Jeong, JW Kim, B Lee, HJ Lee, YB Park
Microelectronic Engineering 89, 65-69, 2012
33 2012 Ultrasonic Spray Pyrolysis of Antimony‐Doped Tin Oxide Transparent Conductive Coatings J Kim, BJ Murdoch, JG Partridge, K Xing, DC Qi, J Lipton‐Duffin, ...
Advanced Materials Interfaces, 2000655, 2020
26 2020 Transparent electrodes based on spray coated fluorine-doped tin oxide with enhanced optical, electrical and mechanical properties J Kim, S Wong, G Kim, YB Park, J van Embden, E Della Gaspera
Journal of Materials Chemistry C 8 (41), 14531-14539, 2020
21 2020 Highly Conductive and Visibly Transparent p-Type CuCrO2 Films by Ultrasonic Spray Pyrolysis J Kim, O Kendall, J Ren, BJ Murdoch, CF McConville, J van Embden, ...
ACS Applied Materials & Interfaces 14 (9), 11768-11778, 2022
17 2022 Effect of HF & H2SO4 pretreatment on interfacial adhesion energy of Cu–Cu direct bonds JW Kim, MH Jeong, YB Park
Microelectronic engineering 89, 42-45, 2012
17 2012 Improvement of wafer-level Cu-to-Cu bonding quality using wet chemical pretreatment JW Kim, SJ Jeon, HJ Lee, S Hyun, YB Park
Journal of Nanoscience and Nanotechnology 12 (4), 3577-3581, 2012
16 2012 Characterization and observation of Cu-Cu Thermo-Compression Bonding using 4-point bending test system JW Kim, KS Kim, HJ Lee, HY Kim, YB Park, SM Hyun
Journal of the Microelectronics and Packaging Society 18 (4), 11-18, 2011
15 2011 Interfacial properties of Cu-Cu direct bonds for TSV integration B Kim, T Matthias, E Cakmak, EJ Jang, JW Kim, YB Park
Solid State Technology 53 (8), 18-22, 2010
12 2010 The effect of plasma pre-cleaning on the Cu-Cu direct bonding for 3D chip stacking. JW Kim, KS Kim, HJ Lee, H Kim, YB Park, S Hyun
18th IEEE International Symposium on the Physical and Failure Analysis of …, 2011
11 2011 Effect of Forming Gas Annealing on the Interfacial Bonding Strength of Cu-Cu thermo-compression Bonded Interfaces EJ Jang, JW Kim, B Kim, T Matthias, SM Hyun, HJ Lee, YB Park
Journal of the Microelectronics and Packaging Society 16 (3), 31-37, 2009
10 2009 Wet Etching Characteristics of Cu Surface for Cu-Cu Pattern Direct Bonds JM Park, YR Kim, SD Kim, JW Kim, YB Park
Journal of the Microelectronics and Packaging Society 19 (1), 39-45, 2012
8 2012 Copper nanoparticle paste on different metallic substrates for low temperature bonded interconnection CLG Jaewon Kim, Byunghoon Lee, Ja-Myeong Koo
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017
6 2017 Characterization of copper conductive ink for low temperature sintering processing on flexible polymer substrate J Kim, B Lee, JY Lek, RI Made, B Salam, CL Gan
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 27-30, 2014
5 2014 Effects of wet treatment conditions and pattern densities on interfacial bonding characteristics of Cu–Cu direct bonds JM Park, JW Kim, YB Park
Japanese Journal of Applied Physics 53 (5S3), 05HB07, 2014
5 2014 Cu thickness effects on bonding characteristics in Cu-Cu direct bonds JW Kim, MH Jeong, E Carmak, B Kim, T Matthias, HJ Lee, SM Hyun, ...
Journal of the Microelectronics and Packaging Society 17 (4), 61-66, 2010
4 2010 Sublimation-based wafer-scale monolayer WS 2 formation via self-limited thinning of few-layer WS 2 M Chen, J Chai, J Wu, H Zheng, WY Wu, J Lourembam, M Lin, JY Kim, ...
Nanoscale Horizons 9 (1), 132-142, 2024
3 2024 Strong (110) Texturing and Heteroepitaxial Growth of Thin Mo Films on MoS2 Monolayer J Kim, M Chen, WD Wang, PC Lim, J Kim, J Chai, M Zhang, SL Teo, M Lin, ...
ACS Applied Electronic Materials 4 (10), 5026-5033, 2022
2 2022