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Paragkumar Thadesar
Paragkumar Thadesar
Verified email at qti.qualcomm.com
Title
Cited by
Cited by
Year
Electrical, Optical and Fluidic Through-Silicon Vias for Silicon Interposer Applications
MS Parekh, PA Thadesar, MS Bakir
61st IEEE Electronic Components and Technology Conference (ECTC), 1992-1998, 2011
542011
Through-silicon vias: drivers, performance, and innovations
PA Thadesar, X Gu, R Alapati, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (7 …, 2016
492016
Embedded cooling technologies for densely integrated electronic systems
TE Sarvey, Y Zhang, L Zheng, P Thadesar, R Gutala, C Cheung, ...
2015 IEEE Custom Integrated Circuits Conference (CICC), 1-8, 2015
442015
Novel Photo-Defined Polymer-Enhanced Through-Silicon Vias for Silicon Interposers
PA Thadesar, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (7 …, 2013
282013
In-situ microscale through-silicon via strain measurements by synchrotron x-ray microdiffraction exploring the physics behind data interpretation
X Liu, PA Thadesar, CL Taylor, H Oh, M Kunz, N Tamura, MS Bakir, ...
Applied Physics Letters 105 (11), 2014
262014
Thermomechanical Strain Measurements by Synchrotron X-ray Diffraction and Data Interpretation for Through-Silicon Vias
X Liu, PA Thadesar, CL Taylor, M Kunz, N Tamura, MS Bakir, ...
Applied Physics Letters 103 (2), 022107-022107-5, 2013
262013
Fabrication and characterization of polymer-enhanced TSVs, inductors, and antennas for mixed-signal silicon interposer platforms
PA Thadesar, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (3 …, 2016
232016
Dimension and liner dependent thermomechanical strain characterization of through-silicon vias using synchrotron X-ray diffraction
X Liu, PA Thadesar, CL Taylor, M Kunz, N Tamura, MS Bakir, ...
Journal of Applied Physics 114 (6), 2013
212013
Low-loss air-isolated through-silicon vias for silicon interposers
H Oh, PA Thadesar, GS May, MS Bakir
IEEE Microwave and Wireless Components Letters 26 (3), 168-170, 2016
132016
Endpoint detection in low open area TSV fabrication using optical emission spectroscopy
JM Gu, PA Thadesar, A Dembla, MS Bakir, GS May, SJ Hong
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (7 …, 2014
132014
Low-loss silicon interposer for three-dimensional system integration with embedded microfluidic cooling
PA Thadesar, L Zheng, MS Bakir
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical …, 2014
112014
Silicon interposer featuring novel electrical and optical TSVs
PA Thadesar, MS Bakir
ASME International Mechanical Engineering Congress and Exposition 45257, 405-412, 2012
102012
Experimental Stress Characterization and Numerical Simulation for Copper Pumping Analysis of Through-Silicon Vias
X Liu, PA Thadesar, CL Taylor, M Kunz, N Tamura, MS Bakir, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (7 …, 2016
82016
Fabrication and characterization of mixed-signal polymer-enhanced silicon interposer featuring photodefined coax TSVs and high-Q inductors
PA Thadesar, MS Bakir
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 281-286, 2015
62015
Novel through-silicon via technologies for 3D system integration
PA Thadesar, A Dembla, D Brown, MS Bakir
2013 IEEE International Interconnect Technology Conference-IITC, 1-3, 2013
62013
Mixed-signal substrate with integrated through-substrate vias
P Thadesar, MS Bakir
US Patent 10,330,874, 2019
52019
A microfabricated electronic microplate platform for low-cost repeatable biosensing applications
M Zia, T Chi, C Zhang, P Thadesar, T Hookway, J Gonzalez, T McDevitt, ...
2015 IEEE International Electron Devices Meeting (IEDM), 29.4. 1-29.4. 4, 2015
52015
Novel Photodefined Polymer-Embedded Vias for Silicon Interposers
PA Thadesar, MS Bakir
Journal of Micromechanics and Microengineering 23 (3), 035003, 2013
52013
Au-NiW mechanically flexible interconnects (MFIs) and TSV integration for 3D interconnects
C Zhang, P Thadesar, M Zia, T Sarvey, MS Bakir
2014 International 3D Systems Integration Conference (3DIC), 1-4, 2014
42014
Integrated filter technology with embedded devices
CH Yun, MF Velez, N Park, NS Mudakatte, WC Chen, PA Thadesar, ...
US Patent App. 16/132,323, 2020
32020
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