Agata Skwarek
Agata Skwarek
Łukasiewicz Research Network -Institute of Electron Technology, Gdynia Maritime University
Verified email at ite.waw.pl
Title
Cited by
Cited by
Year
Voids investigation in solder joints performed with vapour phase soldering (VPS)
BK Synkiewicz, A Skwarek, K Witek
Soldering & Surface Mount Technology, 2014
622014
Surface analysis of polymeric substrates used for inkjet printing technology
A Pietrikova, P Lukacs, D Jakubeczyova, B Ballokova, J Potencki, ...
Circuit World, 2016
542016
Vapour phase soldering used for quality improvement of semiconductor thermogenerators (TEGs) assembly
B Synkiewicz, A Skwarek, K Witek
Materials science in semiconductor processing 38, 346-351, 2015
292015
Implementing Web 2.0 tools in organisations
GJ Baxter
The Learning Organization, 2014
222014
Analysis of tin whisker growth on lead-free alloys with Ni presence under thermal shock stress
A Skwarek, M Pluska, J Ratajczak, A Czerwinski, K Witek, ...
Materials Science and Engineering: B 176 (4), 352-357, 2011
212011
Effects of substrate thermal properties on the heat transfer coefficient of vapour phase soldering
B Illés, A Géczy, A Skwarek, D Busek
International Journal of Heat and Mass Transfer 101, 69-75, 2016
202016
Occurrence of tin pest on the surface of tin‐rich lead‐free alloys
A Skwarek, M Sroda, M Pluska, A Czerwinski, J Ratajczak, K Witek
Soldering & surface mount technology, 2011
202011
Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system
B Illés, A Skwarek, A Géczy, O Krammer, D Bušek
International Journal of heat and mass transfer 114, 613-620, 2017
192017
High temperature thermogenerators made on DBC substrate using vapour phase soldering
A Skwarek, B Synkiewicz, J Kulawik, P Guzdek, K Witek, J Tarasiuk
Soldering & Surface Mount Technology, 2015
182015
Application of vapor phase soldering (VPS) for joints reliability improvement
A Skwarek, B Synkiewicz, K Witek, S Wronski
International Journal of Modeling and Optimization 3 (5), 386, 2013
162013
Effect of Cu addition on whisker formation in tin-rich solder alloys under thermal shock stress
A Skwarek, J Ratajczak, A Czerwinski, K Witek, J Kulawik
Applied surface science 255 (15), 7100-7103, 2009
162009
Influence of laminate type on tin whisker growth in tin-rich lead-free solder alloys
A Skwarek, M Pluska, A Czerwinski, K Witek
Materials Science and Engineering: B 177 (15), 1286-1291, 2012
152012
Influence of processing on microstructure and electrical characteristics of multilayer varistors
D Szwagierczak, J Kulawik, A Skwarek
Journal of Advanced Ceramics 8 (3), 408-417, 2019
142019
Analysis of polymer foil heaters as infrared radiation sources
K Witek, T Piotrowski, A Skwarek
Materials Science and Engineering: B 177 (15), 1373-1377, 2012
142012
Inoculator dependent induced growth of α-Sn
A Skwarek, P Zachariasz, J Kulawik, K Witek
Materials Chemistry and Physics 166, 16-19, 2015
132015
Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system
B Illés, A Skwarek, A Géczy, L Jakab, D Bušek, K Dušek
Soldering & Surface Mount Technology, 2018
122018
Whisker growth from vacuum evaporated submicron Sn thin films
B Illés, A Skwarek, R Bátorfi, J Ratajczak, A Czerwinski, O Krammer, ...
Surface and Coatings Technology 311, 216-222, 2017
122017
Early stage detection of β→ α transition in Sn by Mössbauer spectroscopy
A Skwarek, P Zachariasz, J Żukrowski, B Synkiewicz, K Witek
Materials Chemistry and Physics 182, 10-14, 2016
122016
Risk of whiskers formation on the surface of commercially available tin-rich alloys under thermal shocks
A Skwarek, K Witek, J Ratajczak
Microelectronics reliability 49 (6), 569-572, 2009
122009
Comparison of diffused layer prepared using liquid dopant solutions and pastes for solar cell with screen printed electrodes
K Drabczyk, E Wróbel, G Kulesza-Matlak, W Filipowski, K Waczynski, ...
Microelectronics International, 2016
112016
Fabrication and characterization of bulk and thick film perovskite NTC thermistors
J Kulawik, D Szwagierczak, B Gröger, A Skwarek
Microelectronics international, 2007
112007
The influence of the crystallographic structure of the intermetallic grains on tin whisker growth
B Illés, A Skwarek, J Ratajczak, K Dušek, D Bušek
Journal of Alloys and Compounds 785, 774-780, 2019
102019
A new approach to construction of extended kit for M-Sequence UWB sensor system based on LTCC
K Ruman, A Pietrikova, P Galajda, I Vehec, T Rovensky, M Kmec
Microelectronics International, 2016
102016
Multilayer thick-film thermoelectric microgenerator based on LTCC technology
PM Markowski
Microelectronics International, 2016
92016
Printed HF antennas for RFID on-metal transponders
K Janeczek, A Arazna, B Salski, K Lipiec, M Jakubowska
Circuit World, 2016
92016
Copper deposition on screen printed electrical paths for solar cell application
K Drabczyk, RP Socha, A Skwarek
Circuit World, 2015
92015
Microstructure influence of SACX0307-TiO2 composite solder joints on thermal properties of power LED assemblies
A Skwarek, P Ptak, K Górecki, T Hurtony, B Illés
Materials 13 (7), 1563, 2020
82020
Identification and characterization of ß→ α-Sn transition in SnCu1 bulk alloy inoculated with InSb
A Skwarek, B Illés, B Horváth, A Géczy, P Zachariasz, D Bušek
Journal of Materials Science: Materials in Electronics 28 (21), 16329-16335, 2017
82017
Application of direct bonded copper substrates for prototyping of power electronic modules
W Grzesiak, P Maćków, T Maj, B Synkiewicz, K Witek, R Kisiel, ...
Circuit World, 2016
82016
Influence of various lanthanides on the properties of Sr0. 8Ce0. 1Ln0. 1MnO3− δ and Sr0. 9Ce0. 05Ln0. 05CoO3− δ ceramics and thick film electrodes
B Gröger, J Kulawik, D Szwagierczak, A Skwarek
Solid State Ionics 180 (11-13), 872-877, 2009
82009
Kinetics of Sn whisker growth from Sn thin-films on Cu substrate
B Illés, O Krammer, T Hurtony, K Dušek, D Bušek, A Skwarek
Journal of Materials Science: Materials in Electronics 31 (19), 16314-16323, 2020
72020
Mössbauer studies of β→ α phase transition in Sn-rich solder alloys
P Zachariasz, A Skwarek, B Illés, J Żukrowski, T Hurtony, K Witek
Microelectronics Reliability 82, 165-170, 2018
72018
Reduction of dielectric constant of LTCC substrates by introduction of controlled porosity
B Synkiewicz
Microelectronics International, 2016
72016
High resolution patterns on LTCC substrates for microwave applications obtained by screen printing and laser ablation
B Synkiewicz, J Kulawik, A Skwarek, Y Yashchyshyn, P Piasecki
2016 39th international spring seminar on electronics technology (ISSE), 17-21, 2016
72016
Electrical and microstructural characterization of doped ZnO based multilayer varistors
J Kulawik, D Szwagierczak, A Skwarek
Microelectronics International, 2017
62017
Characterization of solder joints made with VPS on DBC substrate
A Skwarek, B Illés, B Synkiewicz, S Wroński, J Tarasiuk, K Witek
Journal of Materials Science: Materials in Electronics 28 (2), 1769-1776, 2017
62017
Multilayer capacitors with bismuth copper tantalate dielectric fabricated in LTCC technology
D Szwagierczak, J Kulawik, B Synkiewicz, A Skwarek
Microelectronics International, 2016
62016
The utilization of LTCC-PDMS bonding technology for microfluidic system applications–a simple fluorescent sensor
K Malecha
Microelectronics International, 2016
62016
Environmental tests of embedded thin-and thick-film resistors in comparison to chip resistors
W Steplewski, A Dziedzic, J Borecki, G Koziol, T Serzysko
Circuit World, 2014
62014
Zastosowanie diod LED w systemach doświetlania roślin wyzwaniem na dzisiaj i na jutro
W Grzesiak, S Nowak, J Początek, A Skwarek, F Dubert, AM Skoczowski, ...
Elektronika: konstrukcje, technologie, zastosowania 50 (10), 73-76, 2009
62009
The LTCC device for miniature plasma generators characterization
J Macioszczyk, K Malecha, LJ Golonka
Microelectronics International, 2016
52016
Multilayer perovskite-based thermistors fabricated by ltcc technology
J Kulawik, D Szwagierczak, K Witek, A Skwarek, B Gröger
Acta Physica Polonica A 123 (2), 436-438, 2013
52013
Microstructural analysis of Sn-3.0 Ag-0.5 Cu-TiO2 composite solder alloy after selective electrochemical etching
MZ Yahaya, MFM Nazeri, S Kheawhom, B Illés, A Skwarek, AA Mohamad
Materials Research Express 7 (1), 016583, 2020
42020
The influence of a mounting manner of power MOS transistors on characteristics of the Totem-Pole circuit with RLC load
P Górecki, K Górecki
Microelectronics International, 2016
42016
Tin pest and tin oxidation on tin-rich lead-free alloys investigated by electron microscopy methods
A Czerwiński, A Skwarek, M Płuska, J Ratajczak, K Witek
Solid State Phenomena 186, 275-278, 2012
42012
Impact of light spectral composition and ozone fumigation on chlorophyll content changes and optical properties of broccoli leaves
A Skoczowski, I Czyczylo-Mysza, A Skwarek, J Pilarski, W Grzesiak, ...
Zeszyty Problemowe Postępów Nauk Rolniczych, 2010
42010
The influence of soldering process parameters on the optical and thermal properties of power LEDs
P Ptak, K Gorecki, A Skwarek, K Witek, J Tarasiuk
Soldering & Surface Mount Technology, 2020
32020
Void separation efficiency of vacuum VPS technology on FR4 and LTCC substrates
B Illés, A Skwarek, A Géczy, D Szwagierczak, K Witek
2017 IEEE 23rd International Symposium for Design and Technology in …, 2017
32017
Numerical study of vapour concentration reduction in a vacuum vapour phase soldering oven
B Illés, A Skwarek, A Géczy, K Witek
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017
32017
Embedding components in voltage converter PCB for size reduction and heat management
M Wojcik, D Witek, T Klej, E Ramotowski
Circuit World, 2016
32016
A method for the tin pest presence testing in SnCu solder alloys
A Skwarek, J Kulawik, A Czerwinski, M Pluska, K Witek
Soldering & Surface Mount Technology, 2014
32014
Dependence of Tin Whisker Growth on Copper and Oxygen Content on the Surface of Tin-Rich Lead Free Alloys
A Skwarek, K Witek, RJ Płuska М, A Czerwiński
Acta Physica Polonica A 123 (2), 430-431, 2013
32013
Whisker growth in Tin alloys on glass-epoxy laminate studied by scanning ion microscopy and energy-dispersive X-ray spectroscopy
A Czerwiński, A Skwarek, M Płuska, J Ratajczak, K Witek
Archives of Metallurgy and Materials 58, 2013
32013
Reliability studies of InnoLot and SnBi joints soldered on DBC substrate
A Skwarek, B Illés, K Witek, T Hurtony, J Tarasiuk, S Wronski, ...
Soldering & Surface Mount Technology, 2018
22018
Characterization of tin pest by electrical resistance measurement
A Skwarek, B Illés, A Géczy
2016 IEEE 22nd International Symposium for Design and Technology in …, 2016
22016
Influence of various multilayer LTCC systems on dielectric properties’ stability in GHz frequency range
T Rovensky, A Pietrikova, I Vehec, M Kmec
Microelectronics International, 2016
22016
Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties
M Baszynski, E Ramotowski, D Ostaszewski, T Klej, M Wojcik, ...
Circuit World, 2016
22016
Technological aspects of automated selective systems application in conformal coating processing
K Witek, A Skwarek, W Grzesiak, R Gara
Materiały Elektroniczne 36, 101-109, 2008
22008
Imapct of wettability on quality of conformal coating encapsulation
A Skwarek, K Witek, M Cież, W Grzesiak
Elektronika: konstrukcje, technologie, zastosowania 48 (12), 41-42, 2007
22007
Analysis of low temperature influence on Pb-free solder joints quality in aspect of tin pest occurrence
K Witek, A Skwarek, M Cież
Elektronika: konstrukcje, technologie, zastosowania 47 (12), 18-20, 2006
22006
Application of ZnO Nanoparticles in Sn99Ag0. 3 Cu0. 7-Based Composite Solder Alloys
A Skwarek, O Krammer, T Hurtony, P Ptak, K Górecki, S Wroński, ...
Nanomaterials 11 (6), 1545, 2021
12021
Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3 Sn–0.7 Cu wt.% Solder Alloy Inoculated with InSb
A Skwarek, B Illés, T Hurtony, D Bušek, K Dušek
Materials 13 (4), 968, 2020
12020
Influence of ITO layer application on electrical parameters of silicon solar cells with screen printed front electrode
K Drabczyk, J Domaradzki, G Kulesza-Matlak, M Lipinski, D Kaczmarek
Microelectronics International, 2016
12016
Influence of the SiNx: H layer deposited by PECVD technique on the surface and grain boundary passivation of mc-Si
S Kluska, P Panek
Microelectronics International, 2016
12016
Tin whisker growth from tin thin film
B Illés, A Skwarek, O Krammer, B Medgyes, B Horváth, R Bátorfi
2016 39th International Spring Seminar on Electronics Technology (ISSE), 173-178, 2016
12016
IMAPS-CPMT 2014 Poland–Circuit World
A Skwarek
Circuit World, 2015
12015
Induction of tin pest transformation in solder joints in ceramic packages of sub-THz scanner
A Skwarek, J Kulawik, K Witek
2015 38th International Spring Seminar on Electronics Technology (ISSE), 47-51, 2015
12015
IMAPS-CPMT 2013 Poland
A Skwarek
Circuit World, 2014
12014
Technological Aspects of Semiconductor Thermogenerator (TEG) Assembly
K Witek, A Skwarek, B Synkiewicz, P Guzdek, A Arazna
International Journal of Modeling and Optimization 3 (5), 390, 2013
12013
Efektywne wartości współczynnika dyfuzji dla modelu domieszkowania dyfuzyjnego warstwy emiterowej ogniwa słonecznego
W Filipowski, K Waczyński, E Wróbel, A Skwarek, K Drabczyk
Elektronika: konstrukcje, technologie, zastosowania 52 (4), 57-59, 2011
12011
Properties of conductive strontium cerium manganate ceramics
B Groeger, A Skwarek, D Szwagierczak, J Kulawik, S Nowak
12005
Synthesis and resistance-temperature characteristics of perovskite ceramics of NTC thermistors
A Skwarek, D Szwagierczak, J Kulawik, B Groeger
12005
Preparation and characterization of of Sr 1-x Ce x MnO 3 thick films for electrode layers
D Szwagierczak, B Groeger, J Kulawik, A Skwarek
12005
Soldering with SACX0307-(TiO2/ZnO) nano-composite solder alloys
B Illés, A Skwarek, O Krammer, D Straubinger, B Lakó, G Harsányi, ...
2021 44th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2021
2021
The Influence of Soldering Profile on the Thermal Parameters of Insulated Gate Bipolar Transistors (IGBTs)
A Pietruszka, P Górecki, S Wroński, B Illés, A Skwarek
Applied Sciences 11 (12), 5583, 2021
2021
IMAPS 2019 Poland
A Skwarek
SOLDERING & SURFACE MOUNT TECHNOLOGY 32 (4), 189-189, 2020
2020
Whisker Development from SAC0307-Mn07 Solder Alloy
B Illés, R Bátorfi, T Hurtony, O Krammer, G Harsányi, A Pietrikova, ...
2020 43rd International Spring Seminar on Electronics Technology (ISSE), 1-5, 2020
2020
Characterization of Tin Pest Phenomenon in a Low Ag Content SAC Solder Alloy
B Illés, A Skwarek, T Hurtony, O Krammer, G Harsányi, K Witek
2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019
2019
ELECTRICAL CHARACTERIZATION OF ß→ α-Sn TRANSITION IN HIGH TIN CONTNET SOLDER ALLOYS WITH DIFFERENT INOCULATORS
B Illés, A Skwarek, R Bátorfi, T Hurtony, G Harsányi
Acta Physica Polonica A 134 (5), 935-937, 2019
2019
Sintering Aids for LTCC Electronic Elements—Heating Microscope Studies and Microstructure Analysis
B Synkiewicz, A Skwarek, D Szwagierczak, J Kulawik
Acta Physica Polonica, A. 135 (4), 2019
2019
IMAPS 2018 Poland
A Skwarek
CIRCUIT WORLD 45 (1), 1-1, 2019
2019
Publication Techniques for Young Scientists in the Field of Microelectronic Engineering
B Illés, D Busek, A Fodor, A Skwarek, O Krammer, A Géczy, K Dusek
2018 IEEE 24th International Symposium for Design and Technology in …, 2018
2018
Investigation of the Microstructure and Chemical Composition of CaCu3Ti4O12 Multilayer Elements using SEM, EDS, and XPS
A Skwarek, RP Socha, D Szwagierczak, P Zachariasz
Acta Physica Polonica, A. 134 (1), 2018
2018
Soldering problems of large size SMD PET capacitors during vapour phase soldering process
B Illés, A Géczy, O Krammer, A Skwarek, K Witek
2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-6, 2018
2018
EMPC/IMAPS 2017 Poland
A Skwarek
Emerald Publishing Limited, 2018
2018
Microstructural and compositional studies on multilayer elements based on low temperature cofired CaCu3Ti4O12-type ceramics
A Skwarek, B Illés, RP Socha, D Szwagierczak
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017
2017
2017 40th International Spring Seminar on Electronics Technology, ISSE 2017.-Сер. 2017 40th International Spring Seminar on Electronics Technology, ISSE 2017
A Skwarek, D Szwagierczak, B Illes, RP Socha, K Shtereva, V Tvarozek, ...
2017
IMAPS 2016 Poland
A Skwarek
SOLDERING & SURFACE MOUNT TECHNOLOGY 29 (1), 1-1, 2017
2017
VINMES Special Issue-Novel Trends in Electronics Technology
B Illés, A Skwarek
Periodica Polytechnica. Electrical Engineering and Computer Science 60 (4), 194, 2016
2016
Recent progress in direct exposure of interconnects on PCBs
R Barbucha, J Mizeraczyk
Circuit World, 2016
2016
Thermal properties of modified carbon films
J Kalenik, K Kielbasinski, P Firek, E Czerwosz, J Szmidt
Circuit World, 2016
2016
IMAPS 2015 Poland
A Skwarek
Circuit World, 2016
2016
IMAPS-CPMT 2014 Poland
A Skwarek
Soldering & Surface Mount Technology, 2015
2015
Том. 2015-September. ISSE 2015-38th International Spring Seminar on Electronics Technology, Proceedings.-Сер. ISSE 2015-38th International Spring Seminar on Electronics …
I Kharabet, I Patsora, H Heuer, D Joneit, D Tatarchuk, A Skwarek, ...
Relation 57, 60, 2015
2015
Implementing web 2.0 tools in organisations
M Goosey, A Skwarek
Emeral, 2014
2014
Ograniczenie zjawiska pustek w spoinach lutowniczych wykonanych metodą próżniowego lutowania kondensacyjnego
B Synkiewicz, K Witek, A Skwarek
Elektronika: konstrukcje, technologie, zastosowania 55 (9), 67-69, 2014
2014
Lutowanie kondensacyjne: wybrane aspekty
A Skwarek, K Witek
Elektronika: konstrukcje, technologie, zastosowania 52 (10), 65-68, 2011
2011
Analiza występowania wiskerów na powierzchni wysokocynowych stopów lutowniczych poddanych działaniu skrajnych warunków środowiskowych
A Skwarek, K Witek, M Płuska, A Czerwiński, W Filipowski
Elektronika: konstrukcje, technologie, zastosowania 51 (9), 103-106, 2010
2010
Influence of ozone stress and light spectrum on optical properties of broccoli leaves
A Skwarek, I Czyczylo-Mysza, A Skoczowski, J Pilarski, W Grzesiak, ...
Acta Physiologiae Plantarum 31 (1 Suppl.), 2009
2009
Influence of various lanthanides on the properties of Sr0. 8Ce0. 1Ln0. 1MnO3?? and Sr0. 9Ce0. 05Ln0. 05CoO3?? ceramics and thick film electrodes
B Grďż ˝ger, J Kulawik, D Szwagierczak, A Skwarek
Solid State Ionics 180 (11-13), 872-877, 2009
2009
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