Agata Skwarek
Agata Skwarek
Institute of Electron Technology
Verified email at ite.waw.pl
TitleCited byYear
Voids investigation in solder joints performed with vapour phase soldering (VPS)
BK Synkiewicz, A Skwarek, K Witek
Soldering & Surface Mount Technology 26 (1), 8-11, 2014
522014
Surface analysis of polymeric substrates used for inkjet printing technology
A Pietrikova, P Lukacs, D Jakubeczyova, B Ballokova, J Potencki, ...
Circuit World, 2016
382016
Electroluminescent structures printed on paper and textile elastic substrates
A Skwarek, M Sloma, D Janczak, G Wroblewski, A Mlozniak, ...
Circuit World, 2014
282014
Implementing Web 2.0 tools in organisations
GJ Baxter, GJ Baxter
The Learning Organization, 2014
252014
Vapour phase soldering used for quality improvement of semiconductor thermogenerators (TEGs) assembly
B Synkiewicz, A Skwarek, K Witek
Materials science in semiconductor processing 38, 346-351, 2015
242015
Analysis of tin whisker growth on lead-free alloys with Ni presence under thermal shock stress
A Skwarek, M Pluska, J Ratajczak, A Czerwinski, K Witek, ...
Materials Science and Engineering: B 176 (4), 352-357, 2011
202011
Occurrence of tin pest on the surface of tin‐rich lead‐free alloys
A Skwarek, M Sroda, M Pluska, A Czerwinski, J Ratajczak, K Witek
Soldering & surface mount technology, 2011
192011
High temperature thermogenerators made on DBC substrate using vapour phase soldering
A Skwarek, B Synkiewicz, J Kulawik, P Guzdek, K Witek, J Tarasiuk
Soldering & Surface Mount Technology, 2015
172015
Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system
B Illés, A Skwarek, A Géczy, O Krammer, D Bušek
International Journal of heat and mass transfer 114, 613-620, 2017
162017
Influence of screen printing parameters on the front metallic electrodes geometry of solar cells
A Skwarek, K Drabczyk, P Panek
Circuit World, 2014
162014
Influence of laminate type on tin whisker growth in tin-rich lead-free solder alloys
A Skwarek, M Pluska, A Czerwinski, K Witek
Materials Science and Engineering: B 177 (15), 1286-1291, 2012
162012
Comparative study on proper thermocouple attachment for vapour phase soldering profiling
A Skwarek, A Géczy, B Kvanduk, B Illes, G Harsányi
Soldering & Surface Mount Technology, 2016
142016
Effect of Cu addition on whisker formation in tin-rich solder alloys under thermal shock stress
A Skwarek, J Ratajczak, A Czerwinski, K Witek, J Kulawik
Applied surface science 255 (15), 7100-7103, 2009
142009
Thermoelectric energy harvester fabricated in thick-film/LTCC technology
A Skwarek, P Markowski
Microelectronics International, 2014
132014
Application of vapor phase soldering (VPS) for joints reliability improvement
A Skwarek, B Synkiewicz, K Witek, S Wronski
International Journal of Modeling and Optimization 3 (5), 386, 2013
132013
Inoculator dependent induced growth of α-Sn
A Skwarek, P Zachariasz, J Kulawik, K Witek
Materials Chemistry and Physics 166, 16-19, 2015
122015
Risk of whiskers formation on the surface of commercially available tin-rich alloys under thermal shocks
A Skwarek, K Witek, J Ratajczak
Microelectronics reliability 49 (6), 569-572, 2009
122009
Analysis of polymer foil heaters as infrared radiation sources
K Witek, T Piotrowski, A Skwarek
Materials Science and Engineering: B 177 (15), 1373-1377, 2012
112012
Fabrication and characterization of bulk and thick film perovskite NTC thermistors
J Kulawik, D Szwagierczak, B Gröger, A Skwarek
Microelectronics international, 2007
112007
Comparison of diffused layer prepared using liquid dopant solutions and pastes for solar cell with screen printed electrodes
K Drabczyk, E Wróbel, G Kulesza-Matlak, W Filipowski, K Waczynski, ...
Microelectronics International, 2016
102016
Influence of assembly parameters on lead-free solder joints reliability in package-on-package (PoP) technology
A Skwarek, J Sitek, W Stęplewski, K Janeczek, M Kościelski, K Lipiec, ...
Soldering & Surface Mount Technology, 2015
102015
Influence of firing process quality on dielectric constant of microwave LTCC substrates
A Skwarek, B Barteczka, P Slobodzian, A Dabrowski, L Golonka
Microelectronics International, 2014
102014
Reliability investigations for high temperature interconnects
A Skwarek, R Dudek, P Sommer, A Fix, J Trodler, S Rzepka, B Michel
Soldering & Surface Mount Technology, 2014
102014
Early stage detection of β→ α transition in Sn by Mössbauer spectroscopy
A Skwarek, P Zachariasz, J Żukrowski, B Synkiewicz, K Witek
Materials Chemistry and Physics 182, 10-14, 2016
92016
Effects of substrate thermal properties on the heat transfer coefficient of vapour phase soldering
B Illés, A Géczy, A Skwarek, D Busek
International Journal of Heat and Mass Transfer 101, 69-75, 2016
92016
Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system
B Illés, A Skwarek, A Géczy, L Jakab, D Bušek, K Dušek
Soldering & Surface Mount Technology, 2018
82018
Application of direct bonded copper substrates for prototyping of power electronic modules
W Grzesiak, P Maćków, T Maj, B Synkiewicz, K Witek, R Kisiel, ...
Circuit World, 2016
82016
Copper deposition on screen printed electrical paths for solar cell application
A Skwarek, K Drabczyk, RP Socha
Circuit World, 2015
82015
Tape casting and properties of Pr2O3-doped ZnO multilayer varistors
A Skwarek, J Kulawik, D Szwagierczak, B Synkiewicz
Microelectronics International, 2014
82014
Identification and characterization of ß→ α-Sn transition in SnCu1 bulk alloy inoculated with InSb
A Skwarek, B Illés, B Horváth, A Géczy, P Zachariasz, D Bušek
Journal of Materials Science: Materials in Electronics 28 (21), 16329-16335, 2017
72017
Method for validating CT length measurement of cracks inside solder joints
A Skwarek, T Garami, O Krammer, G Harsányi, P Martinek
Soldering & Surface Mount Technology, 2016
72016
Influence of the fluxes properties on quality and the microstructure of lead-free solder joints executed by selective soldering
A Skwarek, M Koscielski, J Sitek
Soldering & Surface Mount Technology, 2014
72014
Whisker growth from vacuum evaporated submicron Sn thin films
B Illés, A Skwarek, R Bátorfi, J Ratajczak, A Czerwinski, O Krammer, ...
Surface and Coatings Technology 311, 216-222, 2017
62017
Multilayer thick-film thermoelectric microgenerator based on LTCC technology
PM Markowski
Microelectronics International, 2016
62016
Printed HF antennas for RFID on-metal transponders
K Janeczek, A Arazna, B Salski, K Lipiec, M Jakubowska
Circuit World, 2016
62016
Zastosowanie diod LED w systemach doświetlania roślin wyzwaniem na dzisiaj i na jutro
W Grzesiak, S Nowak, J Początek, A Skwarek, F Dubert, AM Skoczowski, ...
Elektronika: konstrukcje, technologie, zastosowania 50 (10), 73-76, 2009
62009
Electrical and microstructural characterization of doped ZnO based multilayer varistors
J Kulawik, D Szwagierczak, A Skwarek
Microelectronics International, 2017
52017
Characterization of solder joints made with VPS on DBC substrate
A Skwarek, B Illés, B Synkiewicz, S Wroński, J Tarasiuk, K Witek
Journal of Materials Science: Materials in Electronics 28 (2), 1769-1776, 2017
52017
Reduction of dielectric constant of LTCC substrates by introduction of controlled porosity
B Synkiewicz
Microelectronics International, 2016
52016
High resolution patterns on LTCC substrates for microwave applications obtained by screen printing and laser ablation
B Synkiewicz, J Kulawik, A Skwarek, Y Yashchyshyn, P Piasecki
2016 39th International Spring Seminar on Electronics Technology (ISSE), 17-21, 2016
52016
Mechanical reliability of solder joints in PCBs assembled in surface mount technology
A Skwarek, J Borecki, T Serzysko
Soldering & Surface Mount Technology, 2016
52016
Influence of mechanical exposures on electrical properties of thin and thick-film flexible resistors and conductors
A Skwarek, P Osypiuk, A Dziedzic, W Stęplewski
Soldering & Surface Mount Technology, 2016
52016
Magnetoelectric properties in bulk and layered composites
A Skwarek, P Guzdek, M Wzorek
Microelectronics International, 2015
52015
Material and technological aspects of high-temperature SiC device packages reliability
A Skwarek, M Myśliwiec, R Kisiel, M Guziewicz
Microelectronics International, 2015
52015
An interactive system for remote modelling and design validation of hybrid photovoltaic systems
A Skwarek, W Grzesiak, K Witek, E Klugmann-Radziemska, P Grzesiak
Microelectronics International, 2014
52014
Combined loading and failure analysis of lead-free solder joints due to creep and fatigue phenomena
A Skwarek, K Jankowski, A Wymyslowski, D Chicot
Soldering & Surface Mount Technology, 2014
52014
Multilayer perovskite-based thermistors fabricated by ltcc technology
J Kulawik, D Szwagierczak, K Witek, A Skwarek, B Gröger
Acta Physica Polonica A 123 (2), 436-438, 2013
52013
Influence of various lanthanides on the properties of Sr0. 8Ce0. 1Ln0. 1MnO3− δ and Sr0. 9Ce0. 05Ln0. 05CoO3− δ ceramics and thick film electrodes
B Gröger, J Kulawik, D Szwagierczak, A Skwarek
Solid State Ionics 180 (11-13), 872-877, 2009
52009
The utilization of LTCC-PDMS bonding technology for microfluidic system applications–a simple fluorescent sensor
K Malecha
Microelectronics International, 2016
42016
A new approach to construction of extended kit for M-Sequence UWB sensor system based on LTCC
K Ruman, A Pietrikova, P Galajda, I Vehec, T Rovensky, M Kmec
Microelectronics International, 2016
42016
Influence of thermal cycling on reliability of solder joints executed on long and metal core PCBs
A Skwarek, J Sitek, A Araźna, K Janeczek, W Stęplewski, K Lipiec, ...
Soldering & Surface Mount Technology, 2015
42015
Inkjet printed microwave circuits on flexible substrates using heterophase graphene based inks
A Skwarek, K Futera, K Kielbasinski, A Młozniak, M Jakubowska
Soldering & Surface Mount Technology, 2015
42015
Changes in TCR of amorphous Ni–P resistive films as a function of thermal stabilization parameters
A Skwarek, P Kowalik, Z Pruszowski, J Kulawik, A Czerwiński, M Pluska
Microelectronics International, 2014
42014
Influence of micro additives on printing and electric parameters of conductive adhesives for printing electronic applications
A Skwarek, J Sitek, M Koscielski
Circuit World, 2014
42014
Environmental tests of embedded thin-and thick-film resistors in comparison to chip resistors
W Steplewski, A Dziedzic, J Borecki, G Koziol, T Serzysko
Circuit World 40 (1), 7-12, 2014
42014
Characterization of nano-enhanced interconnect materials for fine pitch assembly
A Skwarek, Y Zhang, J Sitek, J Fan, S Ma, M Koscielski, L Ye, J Liu
Soldering & Surface Mount Technology, 2014
42014
Tin pest and tin oxidation on tin-rich lead-free alloys investigated by electron microscopy methods
A Czerwiński, A Skwarek, M Płuska, J Ratajczak, K Witek
Solid State Phenomena 186, 275-278, 2012
42012
Impact of light spectral composition and ozone fumigation on chlorophyll content changes and optical properties of broccoli leaves
A Skoczowski, I Czyczylo-Mysza, A Skwarek, J Pilarski, W Grzesiak, ...
Zeszyty Problemowe Postępów Nauk Rolniczych, 2010
42010
The influence of the crystallographic structure of the intermetallic grains on tin whisker growth
B Illés, A Skwarek, J Ratajczak, K Dušek, D Bušek
Journal of Alloys and Compounds 785, 774-780, 2019
32019
Mössbauer studies of β→ α phase transition in sn-rich solder alloys
P Zachariasz, A Skwarek, B Illés, J Żukrowski, T Hurtony, K Witek
Microelectronics Reliability 82, 165-170, 2018
32018
Numerical study of vapour concentration reduction in a vacuum vapour phase soldering oven
B Illés, A Skwarek, A Géczy, K Witek
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017
32017
Multilayer capacitors with bismuth copper tantalate dielectric fabricated in LTCC technology
D Szwagierczak, J Kulawik, B Synkiewicz, A Skwarek
Microelectronics International, 2016
32016
The influence of a mounting manner of power MOS transistors on characteristics of the Totem-Pole circuit with RLC load
P Górecki, K Górecki
Microelectronics International, 2016
32016
Mechanical properties of SMD interconnections on flexible and rigid substrates
A Skwarek, D Nowak, A Dziedzic, Z Żaluk, H Roguszczak, M Węglarski
Soldering & Surface Mount Technology, 2016
32016
Electrical properties of thin-film resistors in a wide temperature range
A Skwarek, P Winiarski, A Kłossowicz, J Wróblewski, A Dziedzic, ...
Circuit World, 2015
32015
Investigation of electrical performance of silicon solar cells with transparent counter electrode
A Skwarek, K Drabczyk, J Domaradzki, P Panek, D Kaczmarek
Microelectronics International, 2015
32015
Technology and application of the LTCC-based microfluidic module for urea determination
A Skwarek, K Malecha, E Remiszewska, DG Pijanowska
Microelectronics International, 2015
32015
A method for the tin pest presence testing in SnCu solder alloys
A Skwarek, J Kulawik, A Czerwinski, M Pluska, K Witek
Soldering & Surface Mount Technology, 2014
32014
Whisker growth in Tin alloys on glass-epoxy laminate studied by scanning ion microscopy and energy-dispersive X-ray spectroscopy
A Czerwiński, A Skwarek, M Płuska, J Ratajczak, K Witek
Archives of Metallurgy and Materials 58 (2), 413-417, 2013
32013
Dependence of Tin Whisker Growth on Copper and Oxygen Content on the Surface of Tin-Rich Lead Free Alloys
A Skwarek, K Witek, RJ Płuska М, A Czerwiński
Acta Physica Polonica A 123 (2), 430-431, 2013
32013
Void separation efficiency of vacuum VPS technology on FR4 and LTCC substrates
B Illés, A Skwarek, A Géczy, D Szwagierczak, K Witek
2017 IEEE 23rd International Symposium for Design and Technology in …, 2017
22017
Characterization of tin pest by electrical resistance measurement
A Skwarek, B Illés, A Géczy
2016 IEEE 22nd International Symposium for Design and Technology in …, 2016
22016
Influence of various multilayer LTCC systems on dielectric properties’ stability in GHz frequency range
T Rovensky, A Pietrikova, I Vehec, M Kmec
Microelectronics International, 2016
22016
Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes
A Skwarek, B Illés, O Krammer, A Géczy, T Garami
Soldering & Surface Mount Technology, 2016
22016
Embedding components in voltage converter PCB for size reduction and heat management
M Wojcik, D Witek, T Klej, E Ramotowski
Circuit World, 2016
22016
Dielectric properties of high-permittivity A2/3CuTa4O12 ceramics
A Skwarek, D Szwagierczak
Microelectronics International, 2014
22014
In situ polymerised polypyrrole films for sensors application
A Skwarek, M Zawadzka, J Kulawik, D Szwagierczak, K Zaraska
Microelectronics International, 2014
22014
Technological aspects of automated selective systems application in conformal coating processing
K Witek, A Skwarek, W Grzesiak, R Gara
Materiały Elektroniczne 36, 101-109, 2008
22008
Imapct of wettability on quality of conformal coating encapsulation
A Skwarek, K Witek, M Cież, W Grzesiak
Elektronika: konstrukcje, technologie, zastosowania 48 (nr12), 41-42, 2007
22007
Analysis of low temperature influence on Pb-free solder joints quality in aspect of tin pest occurrence
K Witek, A Skwarek, M Cież
Elektronika: konstrukcje, technologie, zastosowania 47 (12), 18-20, 2006
22006
Influence of processing on microstructure and electrical characteristics of multilayer varistors
D Szwagierczak, J Kulawik, A Skwarek
Journal of Advanced Ceramics 8 (3), 408-417, 2019
12019
Reliability studies of InnoLot and SnBi joints soldered on DBC substrate
A Skwarek, B Illés, K Witek, T Hurtony, J Tarasiuk, S Wronski, ...
Soldering & Surface Mount Technology, 2018
12018
Influence of ITO layer application on electrical parameters of silicon solar cells with screen printed front electrode
K Drabczyk, J Domaradzki, G Kulesza-Matlak, M Lipinski, D Kaczmarek
Microelectronics International, 2016
12016
Influence of the SiNx: H layer deposited by PECVD technique on the surface and grain boundary passivation of mc-Si
S Kluska, P Panek
Microelectronics International, 2016
12016
The LTCC device for miniature plasma generators characterization
J Macioszczyk, K Malecha, LJ Golonka
Microelectronics International, 2016
12016
Tin whisker growth from tin thin film
B Illés, A Skwarek, O Krammer, B Medgyes, B Horváth, R Bátorfi
2016 39th International Spring Seminar on Electronics Technology (ISSE), 173-178, 2016
12016
Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties
M Baszynski, E Ramotowski, D Ostaszewski, T Klej, M Wojcik, ...
Circuit World, 2016
12016
Influence of electric field on separation and orientation of carbon nanotubes in spray coated layers
A Skwarek, G Wroblewski, M Słoma, D Janczak, M Jakubowska
Circuit World, 2015
12015
Induction of tin pest transformation in solder joints in ceramic packages of sub-THz scanner
A Skwarek, J Kulawik, K Witek
2015 38th International Spring Seminar on Electronics Technology (ISSE), 47-51, 2015
12015
IMAPS-CPMT 2013 Poland
A Skwarek
Circuit World, 2014
12014
Technological Aspects of Semiconductor Thermogenerator (TEG) Assembly
K Witek, A Skwarek, B Synkiewicz, P Guzdek, A Arazna
International Journal of Modeling and Optimization 3 (5), 390, 2013
12013
Efektywne wartości współczynnika dyfuzji dla modelu domieszkowania dyfuzyjnego warstwy emiterowej ogniwa słonecznego
W Filipowski, K Waczyński, E Wróbel, A Skwarek, K Drabczyk
Elektronika: konstrukcje, technologie, zastosowania 52 (4), 57-59, 2011
12011
Properties of conductive strontium cerium manganate ceramics
B Groeger, A Skwarek, D Szwagierczak, J Kulawik, S Nowak
Proc. of 29th Int. Conf. of IMAPS Poland. Koszalin-Darłówko, 19-21.09, 2005
12005
Synthesis and resistance-temperature characteristics of perovskite ceramics of NTC thermistors
A Skwarek, D Szwagierczak, J Kulawik, B Groeger
12005
Preparation and characterization of of Sr 1-x Ce x MnO 3 thick films for electrode layers
D Szwagierczak, B Groeger, J Kulawik, A Skwarek
12005
Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching
MZ Yahaya, MFM Nazeri, S Kheawhom, B Illés, A Skwarek, AA Mohamad
Materials Research Express, 2020
2020
Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3 Sn–0.7 Cu wt.% Solder Alloy Inoculated with InSb
A Skwarek, B Illés, T Hurtony, D Bušek, K Dušek
Materials 13 (4), 968, 2020
2020
Characterization of Tin Pest Phenomenon in a Low Ag Content SAC Solder Alloy
B Illés, A Skwarek, T Hurtony, O Krammer, G Harsányi, K Witek
2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019
2019
ELECTRICAL CHARACTERIZATION OF ß→ α-Sn TRANSITION IN HIGH TIN CONTNET SOLDER ALLOYS WITH DIFFERENT INOCULATORS
B Illés, A Skwarek, R Bátorfi, T Hurtony, G Harsányi
ACTA PHYSICA POLONICA A 134 (5), 935-937, 2019
2019
Sintering Aids for LTCC Electronic Elements—Heating Microscope Studies and Microstructure Analysis
B Synkiewicz, A Skwarek, D Szwagierczak, J Kulawik
Acta Physica Polonica, A. 135 (4), 2019
2019
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