Voids investigation in solder joints performed with vapour phase soldering (VPS) B Kinga Synkiewicz, A Skwarek, K Witek Soldering & Surface Mount Technology 26 (1), 8-11, 2014 | 68 | 2014 |
Vapour phase soldering used for quality improvement of semiconductor thermogenerators (TEGs) assembly B Synkiewicz, A Skwarek, K Witek Materials science in semiconductor processing 38, 346-351, 2015 | 34 | 2015 |
Influence of processing on microstructure and electrical characteristics of multilayer varistors D Szwagierczak, J Kulawik, A Skwarek Journal of Advanced Ceramics 8, 408-417, 2019 | 33 | 2019 |
Application of ZnO nanoparticles in Sn99Ag0. 3Cu0. 7-based composite solder alloys A Skwarek, O Krammer, T Hurtony, P Ptak, K Górecki, S Wroński, ... Nanomaterials 11 (6), 1545, 2021 | 29 | 2021 |
Effects of substrate thermal properties on the heat transfer coefficient of vapour phase soldering B Illés, A Géczy, A Skwarek, D Busek International Journal of Heat and Mass Transfer 101, 69-75, 2016 | 28 | 2016 |
Microstructure Influence of SACX0307-TiO2 Composite Solder Joints on Thermal Properties of Power LED Assemblies A Skwarek, P Ptak, K Górecki, T Hurtony, B Illés Materials 13 (7), 1563, 2020 | 27 | 2020 |
Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system B Illés, A Skwarek, A Géczy, O Krammer, D Bušek International Journal of heat and mass transfer 114, 613-620, 2017 | 27 | 2017 |
Analysis of tin whisker growth on lead-free alloys with Ni presence under thermal shock stress A Skwarek, M Pluska, J Ratajczak, A Czerwinski, K Witek, ... Materials Science and Engineering: B 176 (4), 352-357, 2011 | 24 | 2011 |
High temperature thermogenerators made on DBC substrate using vapour phase soldering A Skwarek, B Synkiewicz, J Kulawik, P Guzdek, K Witek, J Tarasiuk Soldering & Surface Mount Technology 27 (3), 125-128, 2015 | 22 | 2015 |
Fabrication and characterization of bulk and thick film perovskite NTC thermistors J Kulawik, D Szwagierczak, B Gröger, A Skwarek Microelectronics international 24 (2), 14-18, 2007 | 21 | 2007 |
Occurrence of tin pest on the surface of tin‐rich lead‐free alloys A Skwarek, M Sroda, M Pluska, A Czerwinski, J Ratajczak, K Witek Soldering & surface mount technology 23 (3), 184-190, 2011 | 20 | 2011 |
The influence of the crystallographic structure of the intermetallic grains on tin whisker growth B Illés, A Skwarek, J Ratajczak, K Dušek, D Bušek Journal of Alloys and Compounds 785, 774-780, 2019 | 19 | 2019 |
Effect of Cu addition on whisker formation in tin-rich solder alloys under thermal shock stress A Skwarek, J Ratajczak, A Czerwinski, K Witek, J Kulawik Applied surface science 255 (15), 7100-7103, 2009 | 19 | 2009 |
Application of vapor phase soldering (VPS) for joints reliability improvement A Skwarek, B Synkiewicz, K Witek, S Wronski International Journal of Modeling and Optimization 3 (5), 386, 2013 | 16 | 2013 |
Influence of laminate type on tin whisker growth in tin-rich lead-free solder alloys A Skwarek, M Pluska, A Czerwinski, K Witek Materials Science and Engineering: B 177 (15), 1286-1291, 2012 | 16 | 2012 |
Analysis of polymer foil heaters as infrared radiation sources K Witek, T Piotrowski, A Skwarek Materials Science and Engineering: B 177 (15), 1373-1377, 2012 | 16 | 2012 |
Whisker growth from vacuum evaporated submicron Sn thin films B Illés, A Skwarek, R Bátorfi, J Ratajczak, A Czerwinski, O Krammer, ... Surface and Coatings Technology 311, 216-222, 2017 | 15 | 2017 |
Inoculator dependent induced growth of α-Sn A Skwarek, P Zachariasz, J Kulawik, K Witek Materials Chemistry and Physics 166, 16-19, 2015 | 15 | 2015 |
Early stage detection of β→ α transition in Sn by Mössbauer spectroscopy A Skwarek, P Zachariasz, J Żukrowski, B Synkiewicz, K Witek Materials Chemistry and Physics 182, 10-14, 2016 | 14 | 2016 |
Numerical simulation of electrochemical migration of Cu based on the Nernst-Plank equation B Illés, B Medgyes, K Dušek, D Bušek, A Skwarek, A Géczy International Journal of Heat and Mass Transfer 184, 122268, 2022 | 13 | 2022 |
Microstructural analysis of Sn-3.0 Ag-0.5 Cu-TiO2 composite solder alloy after selective electrochemical etching MZ Yahaya, MFM Nazeri, S Kheawhom, B Illés, A Skwarek, AA Mohamad Materials Research Express 7 (1), 016583, 2020 | 13 | 2020 |
Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system B Illés, A Skwarek, A Géczy, L Jakab, D Bušek, K Dušek Soldering & Surface Mount Technology 30 (2), 66-73, 2018 | 13 | 2018 |
Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints A Skwarek, B Illés, P Górecki, A Pietruszka, J Tarasiuk, T Hurtony Journal of Materials Research and Technology 22, 403-412, 2023 | 12 | 2023 |
Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy B Illés, H Choi, T Hurtony, K Dušek, D Bušek, A Skwarek Journal of Materials Research and Technology 20, 4231-4240, 2022 | 12 | 2022 |
Risk of whiskers formation on the surface of commercially available tin-rich alloys under thermal shocks A Skwarek, K Witek, J Ratajczak Microelectronics reliability 49 (6), 569-572, 2009 | 12 | 2009 |
The influence of soldering profile on the thermal parameters of insulated gate bipolar transistors (IGBTs) A Pietruszka, P Górecki, S Wroński, B Illés, A Skwarek Applied Sciences 11 (12), 5583, 2021 | 11 | 2021 |
Kinetics of Sn whisker growth from Sn thin-films on Cu substrate B Illés, O Krammer, T Hurtony, K Dušek, D Bušek, A Skwarek Journal of Materials Science: Materials in Electronics 31, 16314-16323, 2020 | 10 | 2020 |
The influence of soldering process parameters on the optical and thermal properties of power LEDs P Ptak, K Gorecki, A Skwarek, K Witek, J Tarasiuk Soldering & Surface Mount Technology 32 (4), 191-199, 2020 | 10 | 2020 |
Electrical and microstructural characterization of doped ZnO based multilayer varistors J Kulawik, D Szwagierczak, A Skwarek Microelectronics International 34 (3), 116-120, 2017 | 10 | 2017 |
Identification and characterization of ß→ α-Sn transition in SnCu1 bulk alloy inoculated with InSb A Skwarek, B Illés, B Horváth, A Géczy, P Zachariasz, D Bušek Journal of Materials Science: Materials in Electronics 28, 16329-16335, 2017 | 9 | 2017 |
Copper deposition on screen printed electrical paths for solar cell application K Drabczyk, RP Socha, A Skwarek Circuit World 41 (3), 98-101, 2015 | 9 | 2015 |
Mössbauer studies of β→ α phase transition in Sn-rich solder alloys P Zachariasz, A Skwarek, B Illés, J Żukrowski, T Hurtony, K Witek Microelectronics Reliability 82, 165-170, 2018 | 8 | 2018 |
Characterization of solder joints made with VPS on DBC substrate A Skwarek, B Illés, B Synkiewicz, S Wroński, J Tarasiuk, K Witek Journal of Materials Science: Materials in Electronics 28, 1769-1776, 2017 | 8 | 2017 |
Selective etching of lead-free solder alloys: A brief review MZ Yahaya, MFM Nazeri, NA Salleh, A Kurt, S Kheawhom, B Illes, ... Materials Today Communications 33, 104520, 2022 | 7 | 2022 |
High resolution patterns on LTCC substrates for microwave applications obtained by screen printing and laser ablation B Synkiewicz, J Kulawik, A Skwarek, Y Yashchyshyn, P Piasecki 2016 39th international spring seminar on electronics technology (ISSE), 17-21, 2016 | 7 | 2016 |
Influence of various lanthanides on the properties of Sr0. 8Ce0. 1Ln0. 1MnO3− δ and Sr0. 9Ce0. 05Ln0. 05CoO3− δ ceramics and thick film electrodes B Gröger, J Kulawik, D Szwagierczak, A Skwarek Solid State Ionics 180 (11-13), 872-877, 2009 | 7 | 2009 |
Zastosowanie diod LED w systemach doświetlania roślin wyzwaniem na dzisiaj i na jutro W Grzesiak, S Nowak, J Początek, A Skwarek, F Dubert, AM Skoczowski, ... Elektronika: konstrukcje, technologie, zastosowania 50 (10), 73-76, 2009 | 7 | 2009 |
Multilayer capacitors with bismuth copper tantalate dielectric fabricated in LTCC technology D Szwagierczak, J Kulawik, B Synkiewicz, A Skwarek Microelectronics International 33 (3), 118-123, 2016 | 6 | 2016 |
Incorporation and corrosion protection mechanism of TiO2 nano-particles in SnAgCu composite alloys: Experimental and density functional theory study B Illés, H Choi, J Byun, K Dušek, D Bušek, A Skwarek Ceramics International 49 (14), 23765-23774, 2023 | 5 | 2023 |
Void separation efficiency of vacuum VPS technology on FR4 and LTCC substrates B Illés, A Skwarek, A Géczy, D Szwagierczak, K Witek 2017 IEEE 23rd International Symposium for Design and Technology in …, 2017 | 5 | 2017 |
Numerical study of vapour concentration reduction in a vacuum vapour phase soldering oven B Illés, A Skwarek, A Géczy, K Witek 2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017 | 5 | 2017 |
Multilayer perovskite-based thermistors fabricated by ltcc technology J Kulawik, D Szwagierczak, K Witek, A Skwarek, B Gröger Acta Physica Polonica A 123 (2), 436-438, 2013 | 5 | 2013 |
Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3 Sn–0.7 Cu wt.% Solder Alloy Inoculated with InSb A Skwarek, B Illés, T Hurtony, D Bušek, K Dušek Materials 13 (4), 968, 2020 | 4 | 2020 |
Reliability studies of InnoLot and SnBi joints soldered on DBC substrate A Skwarek, B Illés, K Witek, T Hurtony, J Tarasiuk, S Wronski, ... Soldering & Surface Mount Technology 30 (4), 205-212, 2018 | 4 | 2018 |
Tin pest and tin oxidation on tin-rich lead-free alloys investigated by electron microscopy methods A Czerwiński, A Skwarek, M Płuska, J Ratajczak, K Witek Solid State Phenomena 186, 275-278, 2012 | 4 | 2012 |
Impact of light spectral composition and ozone fumigation on chlorophyll content changes and optical properties of broccoli leaves A Skoczowski, I Czyczylo-Mysza, A Skwarek, J Pilarski, W Grzesiak, ... Zeszyty Problemowe Postępów Nauk Rolniczych, 2010 | 4 | 2010 |
The influence of SACX0307-ZnO nanocomposite solder alloys on the optical and thermal properties of power LEDs A Skwarek, PP Ptak, K Górecki, K Witek, B Illés Soldering & Surface Mount Technology 34 (4), 222-229, 2022 | 3 | 2022 |
A method for the tin pest presence testing in SnCu solder alloys A Skwarek, J Kulawik, A Czerwinski, M Pluska, K Witek Soldering & Surface Mount Technology 26 (3), 110-116, 2014 | 3 | 2014 |
Technological aspects of Semiconductor Thermogenerator (TEG) assembly K Witek, A Skwarek, B Synkiewicz, P Guzdek, A Arazna International Journal of Modeling and Optimization 3 (5), 390, 2013 | 3 | 2013 |
Dependence of Tin Whisker Growth on Copper and Oxygen Content on the Surface of Tin-Rich Lead Free Alloys A Skwarek, K Witek, M Pluska, A Czerwinski Acta Physica Polonica A 123 (2), 430-431, 2013 | 3 | 2013 |
Whisker growth in Tin alloys on glass-epoxy laminate studied by scanning ion microscopy and energy-dispersive X-ray spectroscopy A Czerwiński, A Skwarek, M Płuska, J Ratajczak, K Witek Archives of Metallurgy and Materials 58, 2013 | 3 | 2013 |
Properties of nano-composite SACX0307-(ZnO, TiO2) solders B Illés, A Skwarek, O Krammer, T Hurtony, D Straubinger, J Ratajczak, ... 2021 23rd European Microelectronics and Packaging Conference & Exhibition …, 2021 | 2 | 2021 |
Soldering with SACX0307-(TiO2/ZnO) nano-composite solder alloys B Illés, A Skwarek, O Krammer, D Straubinger, B Lakó, G Harsányi, ... 2021 44th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2021 | 2 | 2021 |
Investigation of the microstructure and chemical composition of CaCu3Ti4O12 multilayer elements using SEM, EDS, and XPS A Skwarek, RP Socha, D Szwagierczak, P Zachariasz Acta Phys. Pol. A 134, 318-321, 2018 | 2 | 2018 |
Soldering problems of large size SMD PET capacitors during vapour phase soldering process B Illés, A Géczy, O Krammer, A Skwarek, K Witek 2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-6, 2018 | 2 | 2018 |
Characterization of tin pest by electrical resistance measurement A Skwarek, B Illés, A Géczy 2016 IEEE 22nd International Symposium for Design and Technology in …, 2016 | 2 | 2016 |
Induction of tin pest transformation in solder joints in ceramic packages of sub-THz scanner A Skwarek, J Kulawik, K Witek 2015 38th International Spring Seminar on Electronics Technology (ISSE), 47-51, 2015 | 2 | 2015 |
Technological aspects of automated selective systems application in conformal coating processing K Witek, A Skwarek, W Grzesiak, R Gara Materiały Elektroniczne 36 (3), 101-109, 2008 | 2 | 2008 |
Imapct of wettability on quality of conformal coating encapsulation A Skwarek, K Witek, M Cież, W Grzesiak Elektronika: konstrukcje, technologie, zastosowania 48 (12), 41-42, 2007 | 2 | 2007 |
Analysis of low temperature influence on Pb-free solder joints quality in aspect of tin pest occurrence K Witek, A Skwarek, M Cież Elektronika: konstrukcje, technologie, zastosowania 47 (12), 18-20, 2006 | 2 | 2006 |
Influence of SAC0307-TiO2 Composite Solder Joint on Thermal Parameters of MOSFETs A Pietruszka, P Górecki, A Skwarek 2023 46th International Spring Seminar on Electronics Technology (ISSE), 1-5, 2023 | 1 | 2023 |
Filtering Efficiency of Sustainable Textile Materials Applied in Personal Protective Face Mask Production during Pandemic A Géczy, G Havellant, R Bátorfi, A Skwarek, K Dušek, D Bušek, B Illés Materials 16 (3), 903, 2023 | 1 | 2023 |
Whisker Development from SAC0307-Mn07 Solder Alloy B Illés, R Bátorfi, T Hurtony, O Krammer, G Harsányi, A Pietrikova, ... 2020 43rd International Spring Seminar on Electronics Technology (ISSE), 1-5, 2020 | 1 | 2020 |
Characterization of Tin Pest Phenomenon in a Low Ag Content SAC Solder Alloy B Illés, A Skwarek, T Hurtony, O Krammer, G Harsányi, K Witek 2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019 | 1 | 2019 |
Tin whisker growth from tin thin film B Illés, A Skwarek, O Krammer, B Medgyes, B Horváth, R Bátorfi 2016 39th International Spring Seminar on Electronics Technology (ISSE), 173-178, 2016 | 1 | 2016 |
IMAPS-CPMT 2014 Poland–Circuit World A Skwarek Circuit World 41 (3), 2015 | 1 | 2015 |
Efektywne wartości współczynnika dyfuzji dla modelu domieszkowania dyfuzyjnego warstwy emiterowej ogniwa słonecznego W Filipowski, K Waczyński, E Wróbel, A Skwarek, K Drabczyk Elektronika: konstrukcje, technologie, zastosowania 52 (4), 57-59, 2011 | 1 | 2011 |
Properties of conductive strontium cerium manganate ceramics B Groeger, A Skwarek, D Szwagierczak, J Kulawik, S Nowak | 1 | 2005 |
Synthesis and resistance-temperature characteristics of perovskite ceramics of NTC thermistors A Skwarek, D Szwagierczak, J Kulawik, B Groeger | 1 | 2005 |
Preparation and characterization of of Sr 1-x Ce x MnO 3 thick films for electrode layers D Szwagierczak, B Groeger, J Kulawik, A Skwarek | 1 | 2005 |
Dispersion and incorporation of TiO2 and SiC nano-particles in SAC alloy: SIMS and DFT study B Illés, PP Michałowski, A Skwarek, H Choi, J Byun, K Dušek, D Bušek, ... Scripta Materialia 243, 115987, 2024 | | 2024 |
Development and Characterization of Sn99Ag0.3Cu0.7 -(ZrO2/CuO/TiO2) Nano-Composite Solder Alloys B Illés, H Choi, A Skwarek 2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific), 1-8, 2024 | | 2024 |
Corrosion problems of SAC-SiC composite solder alloys H Choi, B Illés, T Hurtony, J Byun, A Géczy, A Skwarek Corrosion Science 224, 111488, 2023 | | 2023 |
Reliability tests of the surface-mounted power MOSFETs soldered using SAC0307-TiO2 composite solder paste P Górecki, A Pietruszka, A Skwarek, B Illés 2023 29th International Workshop on Thermal Investigations of ICs and …, 2023 | | 2023 |
Comparing the Solderability of Different SA C0307 Composite Solder Pastes B Illés, H Choi, A Skwarek 2023 24th European Microelectronics and Packaging Conference & Exhibition …, 2023 | | 2023 |
Study of Whisker Growth from SAC0307-SiC Composite Solder Alloy H Choi, A Skwarek, T Hurtony, J Byun, B Illés 2023 46th International Spring Seminar on Electronics Technology (ISSE), 1-4, 2023 | | 2023 |
Measuring the Filtering Efficiency of Sustainable Textiles Applied in Personal Protective Face Mask Production During Pandemic A Géczy, G Havellant, R Bátorfi, A Skwarek, B Illés Available at SSRN 4199905, 2022 | | 2022 |
Wpływ rozmieszczenia pustek lutowniczych na parametry cieplne tranzystorów MOSFET A Pietruszka, P Górecki, J Tarasiuk, A Skwarek Przegląd Elektrotechniczny 98, 2022 | | 2022 |
Tin Whisker Susceptibility of SAC0307-ZnO Composite Solder Joints H Choi, B Illés, A Skwarek, T Hurtony 2022 45th International Spring Seminar on Electronics Technology (ISSE), 1-5, 2022 | | 2022 |
Investigation of Allotropic β→ α-Sn Transition in High Tin Content Solder Alloys with Different Microscopy and Spectroscopy Techniques B ILLÉS, A SKWAREK, T HURTONY, P ZACHARİASZ, G HARSÁNYİ Acta Materialia Turcica 4 (1), 20-28, 2020 | | 2020 |
IMAPS 2019 Poland A Skwarek Soldering & Surface Mount Technology 32 (4), 189-189, 2020 | | 2020 |
ELECTRICAL CHARACTERIZATION OF ß→ α-Sn TRANSITION IN HIGH TIN CONTNET SOLDER ALLOYS WITH DIFFERENT INOCULATORS B Illés, A Skwarek, R Bátorfi, T Hurtony, G Harsányi Acta Physica Polonica A 134 (5), 935-937, 2019 | | 2019 |
Sintering Aids for LTCC Electronic Elements—Heating Microscope Studies and Microstructure Analysis B Synkiewicz, A Skwarek, D Szwagierczak, J Kulawik Acta Physica Polonica, A. 135 (4), 2019 | | 2019 |
IMAPS 2018 Poland A Skwarek Circuit World 45 (1), 1-1, 2019 | | 2019 |
Publication Techniques for Young Scientists in the Field of Microelectronic Engineering B Illés, D Busek, A Fodor, A Skwarek, O Krammer, A Géczy, K Dusek 2018 IEEE 24th International Symposium for Design and Technology in …, 2018 | | 2018 |
EMPC/IMAPS 2017 Poland A Skwarek Emerald Publishing Limited, 2018 | | 2018 |
Microstructural and compositional studies on multilayer elements based on low temperature cofired CaCu3Ti4O12-type ceramics A Skwarek, B Illés, RP Socha, D Szwagierczak 2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017 | | 2017 |
IMAPS 2016 Poland A Skwarek SOLDERING & SURFACE MOUNT TECHNOLOGY 29 (1), 1-1, 2017 | | 2017 |
VINMES Special Issue-Novel Trends in Electronics Technology B Illés, A Skwarek Periodica Polytechnica. Electrical Engineering and Computer Science 60 (4), 194, 2016 | | 2016 |
IMAPS 2015 Poland A Skwarek Circuit World 42 (1), 2016 | | 2016 |
IMAPS-CPMT 2014 Poland A Skwarek Soldering & Surface Mount Technology 27 (3), 2015 | | 2015 |
IMAPS-CPMT 2013 Poland A Skwarek Circuit World 40 (1), 2014 | | 2014 |
Implementing web 2.0 tools in organisations M Goosey, A Skwarek Emeral, 2014 | | 2014 |
Ograniczenie zjawiska pustek w spoinach lutowniczych wykonanych metodą próżniowego lutowania kondensacyjnego B Synkiewicz, K Witek, A Skwarek Elektronika: konstrukcje, technologie, zastosowania 55 (9), 67-69, 2014 | | 2014 |
Lutowanie kondensacyjne: wybrane aspekty A Skwarek, K Witek Elektronika: konstrukcje, technologie, zastosowania 52 (10), 65-68, 2011 | | 2011 |
Analiza występowania wiskerów na powierzchni wysokocynowych stopów lutowniczych poddanych działaniu skrajnych warunków środowiskowych A Skwarek, K Witek, M Płuska, A Czerwiński, W Filipowski Elektronika: konstrukcje, technologie, zastosowania 51 (9), 103-106, 2010 | | 2010 |
Influence of ozone stress and light spectrum on optical properties of broccoli leaves A Skwarek, I Czyczylo-Mysza, A Skoczowski, J Pilarski, W Grzesiak, ... Acta Physiologiae Plantarum 31 (1 Suppl.), 2009 | | 2009 |
Influence of various lanthanides on the properties of Sr0. 8Ce0. 1Ln0. 1MnO3?? and Sr0. 9Ce0. 05Ln0. 05CoO3?? ceramics and thick film electrodes B Grďż ˝ger, J Kulawik, D Szwagierczak, A Skwarek Solid State Ionics 180 (11-13), 872-877, 2009 | | 2009 |
Wybrane aspekty zastosowania powłok konforemnych w ochronie układów elektronicznych A Skwarek, K Witek, S Nowak Elektronika: konstrukcje, technologie, zastosowania 49 (11), 216-219, 2008 | | 2008 |
Charakterystyka porównawcza powłok konforemnych A Skwarek, K Witek Materiały Elektroniczne 35 (2), 54-65, 2007 | | 2007 |