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Agata Skwarek
Agata Skwarek
Łukasiewicz - Institute of Microelectronics and Photonics, Gdynia Maritime University
Verified email at imif.lukasiewicz.gov.pl
Title
Cited by
Cited by
Year
Voids investigation in solder joints performed with vapour phase soldering (VPS)
B Kinga Synkiewicz, A Skwarek, K Witek
Soldering & Surface Mount Technology 26 (1), 8-11, 2014
692014
Vapour phase soldering used for quality improvement of semiconductor thermogenerators (TEGs) assembly
B Synkiewicz, A Skwarek, K Witek
Materials science in semiconductor processing 38, 346-351, 2015
352015
Influence of processing on microstructure and electrical characteristics of multilayer varistors
D Szwagierczak, J Kulawik, A Skwarek
Journal of Advanced Ceramics 8, 408-417, 2019
332019
Application of ZnO nanoparticles in Sn99Ag0. 3Cu0. 7-based composite solder alloys
A Skwarek, O Krammer, T Hurtony, P Ptak, K Górecki, S Wroński, ...
Nanomaterials 11 (6), 1545, 2021
312021
Effects of substrate thermal properties on the heat transfer coefficient of vapour phase soldering
B Illés, A Géczy, A Skwarek, D Busek
International Journal of Heat and Mass Transfer 101, 69-75, 2016
282016
Microstructure Influence of SACX0307-TiO2 Composite Solder Joints on Thermal Properties of Power LED Assemblies
A Skwarek, P Ptak, K Górecki, T Hurtony, B Illés
Materials 13 (7), 1563, 2020
272020
Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system
B Illés, A Skwarek, A Géczy, O Krammer, D Bušek
International Journal of heat and mass transfer 114, 613-620, 2017
272017
Analysis of tin whisker growth on lead-free alloys with Ni presence under thermal shock stress
A Skwarek, M Pluska, J Ratajczak, A Czerwinski, K Witek, ...
Materials Science and Engineering: B 176 (4), 352-357, 2011
242011
High temperature thermogenerators made on DBC substrate using vapour phase soldering
A Skwarek, B Synkiewicz, J Kulawik, P Guzdek, K Witek, J Tarasiuk
Soldering & Surface Mount Technology 27 (3), 125-128, 2015
222015
Fabrication and characterization of bulk and thick film perovskite NTC thermistors
J Kulawik, D Szwagierczak, B Gröger, A Skwarek
Microelectronics international 24 (2), 14-18, 2007
212007
Occurrence of tin pest on the surface of tin‐rich lead‐free alloys
A Skwarek, M Sroda, M Pluska, A Czerwinski, J Ratajczak, K Witek
Soldering & surface mount technology 23 (3), 184-190, 2011
202011
The influence of the crystallographic structure of the intermetallic grains on tin whisker growth
B Illés, A Skwarek, J Ratajczak, K Dušek, D Bušek
Journal of Alloys and Compounds 785, 774-780, 2019
192019
Effect of Cu addition on whisker formation in tin-rich solder alloys under thermal shock stress
A Skwarek, J Ratajczak, A Czerwinski, K Witek, J Kulawik
Applied surface science 255 (15), 7100-7103, 2009
192009
Analysis of polymer foil heaters as infrared radiation sources
K Witek, T Piotrowski, A Skwarek
Materials Science and Engineering: B 177 (15), 1373-1377, 2012
172012
Application of vapor phase soldering (VPS) for joints reliability improvement
A Skwarek, B Synkiewicz, K Witek, S Wronski
International Journal of Modeling and Optimization 3 (5), 386, 2013
162013
Influence of laminate type on tin whisker growth in tin-rich lead-free solder alloys
A Skwarek, M Pluska, A Czerwinski, K Witek
Materials Science and Engineering: B 177 (15), 1286-1291, 2012
162012
Whisker growth from vacuum evaporated submicron Sn thin films
B Illés, A Skwarek, R Bátorfi, J Ratajczak, A Czerwinski, O Krammer, ...
Surface and Coatings Technology 311, 216-222, 2017
152017
Inoculator dependent induced growth of α-Sn
A Skwarek, P Zachariasz, J Kulawik, K Witek
Materials Chemistry and Physics 166, 16-19, 2015
152015
Numerical simulation of electrochemical migration of Cu based on the Nernst-Plank equation
B Illés, B Medgyes, K Dušek, D Bušek, A Skwarek, A Géczy
International Journal of Heat and Mass Transfer 184, 122268, 2022
142022
Microstructural analysis of Sn-3.0 Ag-0.5 Cu-TiO2 composite solder alloy after selective electrochemical etching
MZ Yahaya, MFM Nazeri, S Kheawhom, B Illés, A Skwarek, AA Mohamad
Materials Research Express 7 (1), 016583, 2020
142020
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