| Increasing the accuracy of structure function based thermal material parameter measurements M Rencz, A Poppe, E Kollár, S Ress, V Székely IEEE Transactions on components and packaging technologies 28 (1), 51-57, 2005 | 71 | 2005 |
| Mapping of temperature distribution in pharmaceutical microwave vacuum drying A Kelen, S Ress, T Nagy, E Pallai, K Pintye-Hodi Powder Technology 162 (2), 133-137, 2006 | 59 | 2006 |
| New approaches in the transient thermal measurements V Székely, S Ress, A Poppe, S Török, D Magyari, Z Benedek, K Torki, ... Microelectronics Journal 31 (9-10), 727-733, 2000 | 41 | 2000 |
| A procedure to correct the error in the structure function based thermal measuring methods M Rencz, A Poppe, E Kollár, S Ress, V Székely, B Courtois Twentieth Annual IEEE Semiconductor Thermal Measurement and Management …, 2004 | 29 | 2004 |
| Thermal Simulations and Measurements–a Combined Approach for Package Characterization A Vass-Varnai, R Bornoff, S Ress, Y Luo, A Poppe, G Farkas, M Rencz ICEP, Jpn 76 (4), 886, 2000 | 24 | 2000 |
| Measurement based compact thermal model creation-accurate approach to neglect inaccurate TIM conductivity data A Vass-Varnai, R Bornoff, Z Sarkany, S Ress, M Rencz 2011 IEEE 13th Electronics Packaging Technology Conference, 67-72, 2011 | 22 | 2011 |
| Calculating effective board thermal parameters from transient measurements V Székely, W Rencz, S Torok, S Ress IEEE Transactions on Components and Packaging Technologies 24 (4), 605-610, 2001 | 22 | 2001 |
| “3D layered thermography” method to map the temperature distribution of a free flowing bulk in case of microwave drying A Kelen, S Ress, T Nagy, E Pallai-Varsanyi, K Pintye-Hodi International journal of heat and mass transfer 49 (5-6), 1015-1021, 2006 | 19 | 2006 |
| Practical method for choosing diluent that ensures the best temperature uniformity in the case of pharmaceutical microwave vacuum drying of a heat sensitive product A Kelen, E Pallai-Varsanyi, S Ress, T Nagy, K Pintye-Hodi European journal of pharmaceutics and biopharmaceutics 62 (1), 101-109, 2006 | 17 | 2006 |
| Measurement issues in LED characterization for Delphi4LED style combined electrical-optical-thermal LED modeling G Hantos, J Hegedüs, MC Bein, L Gaál, G Farkas, Z Sárkány, S Ress, ... 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-7, 2017 | 14 | 2017 |
| Chemical images by artificial olfactory epithelia J Mizsei, S Ress Sensors and Actuators B: Chemical 83 (1-3), 164-168, 2002 | 14 | 2002 |
| Issues of thermal transient testing on photovoltaic modules B Plesz, S Ress, PG Szabó, G Hantos, D Dudola 20th International Workshop on Thermal Investigations of ICs and Systems, 1-4, 2014 | 13 | 2014 |
| Accurate thermal characterization of power semiconductor packages by thermal simulation and measurements A Vass-Varnai, R Bornoff, S Ress, Z Sarkany, S Hodossy, M Rencz 2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP …, 2011 | 13 | 2011 |
| LED Characterization within the Delphi4LED Project G Farkas, L Gaál, M Bein, A Poppe, S Ress, M Rencz 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 12 | 2018 |
| Comparison of JEDEC dynamic and static test methods for the thermal characterization of power LEDs A Vass-Varnai, J Parry, G Toth, S Ress, G Farkas, A Poppe, M Rencz 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 594-597, 2012 | 11 | 2012 |
| Increasing the accuracy of structure function based evaluation of thermal transient measurements M Rencz, A Poppe, E Kollar, S Ress, V Szekely, B Courtois The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2004 | 7 | 2004 |
| Evaluation issues of thermal measurements based on the structure functions M Rencz, E Kollár, A Poppe, S Ress Proceedings of the 9th THERMINIC Workshop, 24-26, 2003 | 6 | 2003 |
| Experiments on effective board thermal conductivity measurements V Székely, M Rencz, S Török, S Ress, B Vizy 6th international workshop on THERmal INvestigations of ICs and Systems …, 2000 | 4 | 2000 |
| New solutions for thermal transient testing V Székely, G Farkas, É Nikodemusz, M Rencz, S Ress, S Török 6th international workshop on THERmal INvestigations of ICs and Systems …, 2000 | 4 | 2000 |
| Transient thermal measurements for dynamic package modeling: new approaches V Székely, S Ress, A Poppe, S Török, D Magyari, Z Benedek, K Torki, ... Proc. 5th THERMINIC Workshop, 7-11, 1999 | 3 | 1999 |
Márta RenczBudapest University of Technology and EconomicsVerified email at eet.bme.hu
