| Flux effect on void quantity and size in soldered joints D Bušek, K Dušek, D Růžička, M Plaček, P Mach, J Urbánek, J Starý Microelectronics Reliability 60, 135-140, 2016 | 74 | 2016 |
| Solder joint quality evaluation based on heating factor P Veselý, E Horynová, J Starý, D Bušek, K Dušek, V Zahradník, M Plaček, ... Circuit World 44 (1), 37-44, 2018 | 39 | 2018 |
| The ontology based FMEA of lead free soldering process M Molhanec, O Zhuravskaya, E Povolotskaya, L Tarba Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011 | 31 | 2011 |
| Montáž v elektronice P MACH, V SKOČIL, J URBÁNEK ČVUT, Praha, 2001 | 28 | 2001 |
| Vlastimil SKOČIL a Jan URBÁNEK P MACH Montáž v elektrotechnice: Pouzdření aktivních součástek, plošné spoje, 2001 | 23 | 2001 |
| Jan URBÁNEK a Vlastimil SKOČIL P MACH Montáž v elektronice: pouzdření aktivních součástek, plošné spoje, 0 | 19 | |
| Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly P Mach, A Geczy, R Polanský, D Bušek Journal of Materials Science: Materials in Electronics 30, 4895-4907, 2019 | 16 | 2019 |
| Analýza investičních pobídek v České republice J SCHWARZ, P BARTOŇ, P BOLCHA, P HEŘMANSKÝ, P MACH Praha: Národohospodářská fakulta, VŠE Praha, 2007 | 15 | 2007 |
| Montáž v elektronice: pouzdření aktivních součástek, plošné spoje P Mach, J Urbánek, V Skočil Vydavatelství ČVUT, 2001 | 15 | 2001 |
| Montáž v elektrotechnice P Mach, V Skočil, J Urbánek ČVUT Praha, 2001 | 14 | 2001 |
| Voltage nonlinearity of carbon black/polyesterimide thick resistive films A Dziedzic, J Kita, P Mach Vacuum 50 (1-2), 125-130, 1998 | 14 | 1998 |
| Study of thermal ageing of polypropylene film capacitors M Horák, P Mach 2015 IEEE 21st International Symposium for Design and Technology in …, 2015 | 13 | 2015 |
| Electrically conductive adhesive filled with mixture of silver nano and microparticles P Mach, R Radev, A Pietrikova 2008 2nd Electronics System-Integration Technology Conference, 1141-1146, 2008 | 13 | 2008 |
| Microstructure analysis and measurement of nonlinearity of vapour phase reflowed solder joints A Pietrikova, P Mach, J Durisin, E Livovsky, J Urbancik 2008 31st International Spring Seminar on Electronics Technology, 363-366, 2008 | 12 | 2008 |
| Modifikovaná elektricky vodivá lepidla P Mach Západočeská univerzita v Plzni, Fakulta elektrotechnická, 2009 | 11 | 2009 |
| Correlations between mechanical and electrical parameters of modified electrically conductive adhesives D Bušek, J Šelepová, P Mach Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011 | 10 | 2011 |
| FMEA and FTA analyses of the adhesive joining process using electrically conductive adhesives E Povolotskaya, P Mach Acta Polytechnica 52 (2), 2012 | 9 | 2012 |
| Success case-study Lean production in electronics manufacturing workshop O Zhuravskaya, M Michajlec, P Mach Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011 | 9 | 2011 |
| Thermal lifetime calculation of capacitor insulation using the activation energy method C Stancu, M Horák, PV Notingher, K Dusek, P Mach, P Veselý, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 8 | 2020 |
| Effects of high current density on lead-free solder joints of chip-size passive SMD components A Geczy, D Straubinger, A Kovacs, O Krammer, P Mach, G Harsányi Soldering & Surface Mount Technology 30 (2), 74-80, 2018 | 8 | 2018 |
