| Reddit entity linking dataset N Botzer, Y Ding, T Weninger Information Processing & Management 58 (3), 102479, 2021 | 12 | 2021 |
| Equivalent inductance analysis and quantification for PCB PDN design Y Ding, B Zhao, S Liang, S Bai, S Connor, M Cocchini, B Achkir, ... 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019 | 8 | 2019 |
| H-EMD: A Hierarchical Earth Mover's Distance Method for Instance Segmentation P Liang, Y Zhang, Y Ding, J Chen, CS Madukoma, T Weninger, JD Shrout, ... IEEE Transactions on Medical Imaging 41 (10), 2022 | 6 | 2022 |
| Ask-and-Verify: Span Candidate Generation and Verification for Attribute Value Extraction Y Ding, Y Liang, N Zalmout, X Li, C Grant, T Weninger 2022 EMNLP, 2022 | 4 | 2022 |
| A Two-Port Measurement With Mechanically Robust Handhold Probes for Ultra Low PDN Impedance X Fang, S Bai, S Liang, Y Ding, Y Fan, B Zhao, H Deng, PK Vuppunutala, ... 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019 | 4 | 2019 |
| A Methodical Approach for PCB PDN Decoupling Minimizing Overdesign with Genetic Algorithm Optimization F De Paulis, Y Ding, M Cocchini, C Hwang, S Connor, M Doyle, ... 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2022 | 3 | 2022 |
| Posthoc Verification and the Fallibility of the Ground Truth Y Ding, N Botzer, T Weninger 2022 NAACL DADC workshop, 23-29, 2022 | 3 | 2022 |
| Extraction for Multilayer Ceramic Capacitor Vibration Induced Force Y Ding, J Zhang, M Xue, X Hua, B Leung, EA MacIntosh, C Hwang 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power …, 2023 | 1 | 2023 |
| On finding an equivalent force to mimic the multilayer ceramic capacitor vibration Y Ding, J Zhang, M Xue, S Ding, B Leung, EA MacIntosh, C Hwang 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power …, 2023 | 1 | 2023 |
| Physics-Based Modeling for Determining Transient Current Flow In Multi-layer PCB PI Designs Y Ding, MS Doyle, S Connor, D Becker, JL Drewniak 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2022 | 1 | 2022 |
| HetSeq: Distributed GPU Training on Heterogeneous Infrastructure Y Ding, N Botzer, T Weninger 2021 AAAI, 2021 | 1 | 2021 |
| Equivalent Force Extraction Methodology for Electrical Component Induced PCB Vibration Y Ding, J Zhang, MF Xue, X Hua, B Leung, EA MacIntosh, C Hwang IEEE Transactions on Electromagnetic Compatibility, 2023 | | 2023 |
| System Level PDN Impedance Optimization Utilizing the Zeros of the Decoupling Capacitors Y Ding, S Liang, F De Paulis, M Cocchini, S Connor, M Doyle, A Ruehli, ... 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power …, 2023 | | 2023 |
| Preserving Composition and Crystal Structures of Chemical Compounds in Atomic Embedding Y Ding, D Wang, T Weninger, M Jiang 2019 IEEE International Conference on Big Data (Big Data), 6037-6039, 2019 | | 2019 |
Tim WeningerFrank M. Freimann Collegiate Professor of Engineering at University of Notre DameVerified email at nd.edu
