| Challenges associated with implementing 5G in manufacturing E O’Connell, D Moore, T Newe Telecom 1 (1), 5, 2020 | 122 | 2020 |
| Digital twins: Enabling interoperability in smart manufacturing networks E O’Connell, W O’Brien, M Bhattacharya, D Moore, M Penica Telecom 4 (2), 265-278, 2023 | 11 | 2023 |
| Enabling communications for industry 4.0: Private 5g in smart manufacturing W O’Brien, M Hayes, M Penica, J McCann, D Moore, E O’Connell 2023 34th Irish Signals and Systems Conference (ISSC), 1-7, 2023 | 1 | 2023 |
| Evaluation of Private 5G in Smart Automation Applications W O'Brien, M Hayes, M Penica, J McCann, D Moore, E O'Connell 2022 IEEE 8th World Forum on Internet of Things (WF-IoT), 1-2, 2022 | | 2022 |
| Bonder design meets telecom challenges D Moore Laser Focus World(USA) 37 (5), 271-272, 2001 | | 2001 |
| Diode bonding evolves to meet telecom demand: Optoelectronics World: Packaging EF Stephens, D Moore Laser focus world 35 (11), S5-S9, 1999 | | 1999 |
| 3rd international workshop on practical issues in building sensor network applications-SENSEAPP 2008 A Hoskins, J McCann, A Reinhardt, M Kropff, M Hollick, R Steinmetz, ... | | |
