Attila Géczy
Title
Cited by
Cited by
Year
Multi-physics modelling of a vapour phase soldering (VPS) system
B Illés, A Géczy
Applied Thermal Engineering 48, 54-62, 2012
472012
Investigating the dynamic changes of the vapour concentration in a Vapour Phase Soldering oven by simplified condensation modelling
B Illés, A Géczy
Applied Thermal Engineering 59 (1-2), 94-100, 2013
362013
Investigations on vapor phase soldering process in an experimental soldering station
A Géczy, Z Illyefalvi-Vitéz, P Szoke
Micro and Nanosystems 2 (3), 170-177, 2010
352010
Modeling method of heat transfer during Vapour Phase Soldering based on filmwise condensation theory
A Géczy, B Illés, Z Illyefalvi-Vitéz
International Journal of Heat and Mass Transfer 67, 1145-1150, 2013
272013
Determination of soil density by cone index data
G Pillinger, A Géczy, Z Hudoba, P Kiss
Journal of Terramechanics 77, 69-74, 2018
242018
Numerical simulation of condensate layer formation during vapour phase soldering
B Illés, A Géczy
Applied Thermal Engineering 70 (1), 421-429, 2014
242014
Low temperature soldering on biopolymer (PLA) Printed Wiring Board substrate
A Géczy, V Léner, I Hajdu, Z Illyefalvi-Vitez
Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011
232011
Effects of substrate thermal properties on the heat transfer coefficient of vapour phase soldering
B Illés, A Géczy, A Skwarek, D Busek
International Journal of Heat and Mass Transfer 101, 69-75, 2016
222016
Conductive layer deposition and peel tests on biodegradable printed circuit boards
A Géczy, M Kovács, I Hajdu
2012 IEEE 18th International Symposium for Design and Technology in …, 2012
212012
Comparative study on proper thermocouple attachment for vapour phase soldering profiling
A Géczy, B Kvanduk, B Illes, G Harsányi
Soldering & Surface Mount Technology 28 (1), 7-12, 2016
202016
Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards
A Géczy, B Illés, Z Péter, Z Illyefalvi-Vitéz
Heat and Mass Transfer 51 (3), 335-342, 2015
202015
Characterization of vapour phase soldering process zone with pressure measurements
A Géczy, B Illés, Z Péter, Z Illyefalvi‐Vitéz
Soldering & Surface Mount Technology, 2013
202013
Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system
B Illés, A Skwarek, A Géczy, O Krammer, D Bušek
International Journal of Heat and Mass Transfer 114, 613-620, 2017
192017
Investigating heat transfer coefficient differences on printed circuit boards during vapour phase reflow soldering
A Géczy
International Journal of Heat and Mass Transfer 109, 167-174, 2017
192017
Investigating the heat transfer on the top side of inclined printed circuit boards during vapour phase soldering
B Illés, A Géczy
Applied Thermal Engineering 103, 1398-1407, 2016
192016
Advances in producing functional circuits on biodegradable PCBs
B Kovács, A Géczy, G Horváth, I Hajdu, L Gál
Periodica Polytechnica Electrical Engineering and Computer Science 60 (4 …, 2016
182016
A review on current eCall systems for autonomous car accident detection
A Bonyár, A Géczy, O Krammer, H Sántha, B Illés, J Kámán, Z Szalay, ...
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-8, 2017
172017
Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering
A Geczy, M Fejos, L Tersztyánszky
Soldering & Surface Mount Technology, 2015
162015
Soldering profile optimization for vapour phase reflow technology
A Geczy, P Szőke, Z Illyefalvi-Vitez, M Ruszinko, R Bunea
2011 IEEE 17th International Symposium for Design and Technology in …, 2011
162011
Package–on–package–review on a promising packaging technology
A Geczy, Z Illyefalvi-Vitez
33rd International Spring Seminar on Electronics Technology, ISSE 2010, 117-122, 2010
152010
Influence of vapor phase soldering fluid Galden on wetting forces (tombstone effect)
K Dušek, D Bušek, M Plaček, A Géczy, O Krammer, B Illés
Journal of Materials Processing Technology 251, 20-25, 2018
132018
Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system
B Illés, A Skwarek, A Géczy, L Jakab, D Bušek, K Dušek
Soldering & Surface Mount Technology, 2018
122018
Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing
O Krammer, B Gyarmati, A Szilágyi, R Storcz, L Jakab, B Illés, A Géczy, ...
Soldering & Surface Mount Technology, 2017
112017
Corrosion-induced tin whisker growth in electronic devices: a review
B Illes, B Horváth, A Géczy, O Krammer, K Dušek
Soldering & Surface Mount Technology, 2017
102017
Analysis of vapor phase soldering in comparison with conventional soldering technologies
Z Illyefalvi-Vitéz, A Geczy, R Batorfi, P Szöke
3rd Electronics System Integration Technology Conference ESTC, 1-5, 2010
92010
Identification and characterization of ß→ α-Sn transition in SnCu1 bulk alloy inoculated with InSb
A Skwarek, B Illés, B Horváth, A Géczy, P Zachariasz, D Bušek
Journal of Materials Science: Materials in Electronics 28 (21), 16329-16335, 2017
82017
Studying heat transfer on inclined printed circuit boards during vapour phase soldering
A Geczy, D Nagy, B Illes, L Fazekas, O Krammer, D Busek
Soldering & Surface Mount Technology, 2017
82017
Investigating condensation heat transfer during vapour phase soldering on round-shaped PCB plates
A Géczy, B Illés, T Darnai
International Journal of Heat and Mass Transfer 86, 639-647, 2015
82015
Experimental 13.56 MHz RFID cards on biodegradable substrates
A Géczy, L Gál, L Dudás, G Horváth, B Kovács, D Nagy, I Hajdu
2015 38th International Spring Seminar on Electronics Technology (ISSE), 52-56, 2015
82015
Soldering tests with biodegradable printed circuit boards
A Geczy, T Garami, B Kovacs, D Nagy, L Gál, M Ruszinko, I Hajdu
2013 IEEE 19th International Symposium for Design and Technology in …, 2013
82013
Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly
P Mach, A Geczy, R Polanský, D Bušek
Journal of Materials Science: Materials in Electronics 30 (5), 4895-4907, 2019
72019
Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach
I Bozsóki, A Géczy, B Illés
International Journal of Heat and Mass Transfer 128, 562-569, 2019
72019
Investigations into the process of vapour phase soldering
A Géczy
Budapesti Műszaki és Gazdaságtudományi Egyetem, 2014
62014
Modelling of temperature distribution along PCB thickness in different substrates during reflow
D Straubinger, I Bozsóki, D Bušek, B Illés, A Géczy
Circuit World, 2019
52019
Vapour phase soldering (VPS) technology: a review
B Illés, A Géczy, B Medgyes, G Harsányi
Soldering & Surface Mount Technology, 2019
52019
Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering
B Illés, A Géczy, O Krammer, K Dušek, D Bušek
International Journal of Heat and Mass Transfer 125, 202-209, 2018
52018
Investigating the effect of large SMD components on heating during vapour phase soldering
A Géczy, A Nagy, B Illes, Z Gyorgy, D Busek
2017 IEEE 23rd International Symposium for Design and Technology in …, 2017
52017
Pressure sensing: a novel method for characterizing the processing zone in vapour phase soldering systems
A Geczy, Z Peter, B Illes, Z Illyefalvi-Vitez
2012 35th International Spring Seminar on Electronics Technology, 55-58, 2012
52012
3D thermal profiling of an experimental Vapour Phase Soldering Station
A Géczy, Z Péter, Z Illyefalvi-Vitéz
Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011
52011
Investigating PCB traces for fine pitch applications
A Geczy, Z Illyefalvi-Vitez
2010 IEEE 16th International Symposium for Design and Technology in …, 2010
52010
Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs
D Straubinger, A Géczy, A Sipos, A Kiss, D Gyarmati, O Krammer, ...
Circuit World, 2019
42019
Applied Color Sensor Based Solution for Sorting in Food Industry Processing
MA Alaya, Z Tóth, A Géczy
Periodica Polytechnica Electrical Engineering and Computer Science 63 (1), 16-22, 2019
42019
Effects of high current density on lead-free solder joints of chip-size passive SMD components
A Geczy, D Straubinger, A Kovacs, O Krammer, P Mach, G Harsányi
Soldering & Surface Mount Technology, 2018
42018
Building a cloud platform for education in microelectronics
P Martinek, Z Illyefalvi-Vitez, O Krammer, A Geczy, B Villanyi, B Illes, ...
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017
42017
Investigating mechanical performance of PLA and CA biodegradable printed circuit boards
A Géczy, D Nagy, I Hajdu, Á Kmetty, B Szolnoki
2015 IEEE 21st International Symposium for Design and Technology in …, 2015
42015
Vapour phase soldering on flexible printed circuit boards
A Géczy, R Bátorfi, G Széles, Á Luhály, M Ruszinkó, R Berényi
2014 IEEE 20th International Symposium for Design and Technology in …, 2014
42014
Optimizing solder joints on biodegradable PCBs with vapour phase soldering
A Géczy, L Gál, I Hajdu, B Kovács, D Nagy, M Ruszinkó
Proceedings of the 2014 37th International Spring Seminar on Electronics …, 2014
42014
Investigating Printed Circuit Board shrinkage during reflow soldering
A Géczy, M Fejős, L Tersztyánszky, A Kemler, A Szabó
Proceedings of the 2014 37th International Spring Seminar on Electronics …, 2014
42014
Optimizing laser soldering of SMD components: from theory to practice
R Bunea, P Svasta, Z Illyefalvi-Vitez, R Batorfi, A Geczy
2011 IEEE 17th International Symposium for Design and Technology in …, 2011
42011
Bumping technologies of fine-pitch BGA components
R Bátorfi, P Szöke, Z Oláh, A Géczy, M Ruszinkó, Z Illyefalvi-Vitéz
33rd International Spring Seminar on Electronics Technology, ISSE 2010, 107-112, 2010
42010
Evaluating vapor phase soldering for fine pitch BGA
A Géczy, R Batorfi, L Gal, Z Illyefalvi-Vitéz, P Szoke
33rd International Spring Seminar on Electronics Technology, ISSE 2010, 482-487, 2010
42010
Reflow Soldering: Apparatus and Heat Transfer Processes
B Illés, O Krammer, A Geczy
Elsevier, 2020
32020
Void separation efficiency of vacuum VPS technology on FR4 and LTCC substrates
B Illés, A Skwarek, A Géczy, D Szwagierczak, K Witek
2017 IEEE 23rd International Symposium for Design and Technology in …, 2017
32017
Numerical study of vapour concentration reduction in a vacuum vapour phase soldering oven
B Illés, A Skwarek, A Géczy, K Witek
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017
32017
Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes
B Illés, O Krammer, A Géczy, T Garami
Soldering & Surface Mount Technology 28 (1), 2-6, 2016
32016
Reducing lead-free soldering failures caused by printed circuit board shrinkage
A Géczy, L Tersztyánszky, B Illes, A Kemler, A Szabó
2013 IEEE 19th International Symposium for Design and Technology in …, 2013
32013
Experimental investigations on the vapor phase soldering process
Z Illyefalvi-Vitéz, A Géczy, P Szöke, R Bátorfi, I Törzsök
2010 IEEE 16th International Symposium for Design and Technology in …, 2010
32010
Higher Education with Distance Learning during COVID-19 Pandemic-a Transitional Semester from the Viewpoint of Teachers
A Géczy, O Krammer, L Sujbert
2020 IEEE 26th International Symposium for Design and Technology in …, 2020
22020
Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces
D Straubinger, I Bozsóki, B Illes, O Krammer, D Bušek, A Geczy
Soldering & Surface Mount Technology, 2020
22020
Scaling of Components for Explicit Modelling of Heat Transfer during Vapour Phase Reflow Soldering
D Straubinger, I Bozsóki, L Gál, A Géczy
2019 IEEE 25th International Symposium for Design and Technology in …, 2019
22019
Alternative Inspection Methods of Vapour Phase Soldering Work Zone
A Geczy, MA Alaya, G Hantos, B Illes
2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-6, 2018
22018
Evaluation of Cloud-based Open Educational Resources for Teaching Microelectronics
A Bonyár, P Martinek, O Krammer, A Géczy, Z Illyefalvi-Vitéz, S Tzanova
2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-5, 2018
22018
Investigating current density in the lead free solder joints of surface mounted resistors with experimental approach
A Géczy, D Straubinger, T Hurtony, O Krammer, A Kovács
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017
22017
Characterization of tin pest by electrical resistance measurement
A Skwarek, B Illés, A Géczy
2016 IEEE 22nd International Symposium for Design and Technology in …, 2016
22016
Investigations on heat transfer with different PCB substrates during vapour phase soldering
L Fazekas, D Nagy, A Géczy, D Busek
2016 IEEE 22nd International Symposium for Design and Technology in …, 2016
22016
Substrate influence on temperature distribution along the PCB during vapor phase soldering
D Bušek, L Fazekas, A Geczy, M Plaček
2016 39th International Spring Seminar on Electronics Technology (ISSE), 267-272, 2016
22016
Thermocouple attachment methods for PCB profiling during Vapour Phase Soldering
A Géczy, B Kvanduk, B Illés, Z Illyefalvi-Vitéz
2012 IEEE 18th International Symposium for Design and Technology in …, 2012
22012
Investigating whisker growth on immersion tin surface finishing
B Illés, B Horváth, B Lipák, A Géczy
2012 35th International Spring Seminar on Electronics Technology, 242-247, 2012
22012
Board design optimization for fine pitch BGA components
A Geczy, Z Illyefalvi-Vitez
3rd Electronics System Integration Technology Conference ESTC, 1-6, 2010
22010
Numerical Models of the Electrochemical Migration: a short review
A Gharaibeh, B Illés, A Géczy, B Medgyes
2020 IEEE 26th International Symposium for Design and Technology in …, 2020
12020
Introduction to Surface-Mount Technology
B Illés, O Krammer, A Géczy
Elsevier, 2020
12020
Effect of different thermocouple constructions on heat-level vapour phase soldering profiles
MA Alaya, V Megyeri, D Bušek, G Harsányi, A Geczy
Soldering & Surface Mount Technology, 2020
12020
Investigating shadowing and possible tombstoning caused by large SMD components during vapour phase reflow soldering
A Géczy, D Szalmási, D Straubinger, B Illés
2019 IEEE 25th International Symposium for Design and Technology in …, 2019
12019
Challenges of SMT assembling on biodegradable PCB substrates
A Géczy, I Hajdu, L Gál, CN Barna, M Kovács, G Harsányi
2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019
12019
Effect of PCB Thickness and Height Position During Heat Level Type Vapour Phase Reflow Soldering
MA Alaya, A Géczy
2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2019
12019
Analytical Solution of Heat Distribution Inside a Printed Circuit Board During Vapour Phase Soldering
D Straubinger, I Bozsóki, B Illés, A Géczy
2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-5, 2019
12019
Wetting of different lead free solder alloys during vapour phase soldering
MA Alaya, L Gál, T Hurtony, B Medgyes, D Straubinger, AM Tareq, B Illés, ...
2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2019
12019
Refined Approach on Controlling Heat Transfer in a Vapour Phase Soldering Oven
A Géczy, BP Kiss, AM Alaya, Z Illyefalvi-Vitéz
2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-5, 2019
12019
Aspects of additive copper deposition on biodegradable and environmentally friendly PCB substrates (PLA, CA, GPTE-DETDA)
L Gal, A Geczy, G Horvath, D Rigler, I Hajdu
2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-6, 2018
12018
Microelectronics education in Europe in 21stcentury
S Tzanova, A Géczy, O Krammer, P Martinek, Z Lyefalvi-Vitéz, ...
2018 IEEE Global Engineering Education Conference (EDUCON), 2025-2030, 2018
12018
Toward producing commercial electronics on biodegradable PCB substrates
A Géczy, L Gál, B Kovács, I Hajdu
2016 39th International Spring Seminar on Electronics Technology (ISSE), 37-42, 2016
12016
RFID cards on biodegradable substrates–Realization aspects and future trends
A Géczy, G Horváth, L Dudás, L Gál, I Hajdu, G Harsányi
2015 38th International Spring Seminar on Electronics Technology (ISSE) 1 (1 …, 2014
12014
Modeling of condensation heating during Vapour Phase Soldering
A Geczy, B Illes, Z Illyefalvi-Vitez
Proceedings of the 36th International Spring Seminar on Electronics …, 2013
12013
Condensation model of vapour phase soldering
B Illés, A Géczy
2012 IEEE 18th International Symposium for Design and Technology in …, 2012
12012
Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors
MA Alaya, B Illés, B David, A Géczy
Applied Sciences 11 (4), 1755, 2021
2021
Wearable Smart Prototype for Personal Air Quality Monitoring
A Géczy, L Kuglics, L Jakab, G Harsányi
2020 IEEE 26th International Symposium for Design and Technology in …, 2020
2020
Electromigration in lead-free solder joints on ceramic PCB substrates
D Straubinger, D Rigler, A Géczy, B Synkiewicz-Musialska
2020 IEEE 26th International Symposium for Design and Technology in …, 2020
2020
Passenger detection in cars with small form-factor IR sensors (Grid-eye)
A Géczy, RDJ Melgar, A Bonyár, G Harsányi
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-6, 2020
2020
Application of Grid-Eye IR sensor for enhanced HMI and OSH purposes in Industry 4.0 reflow soldering environment
A Géczy, TD Mátyás, J Kámán
2020 43rd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2020
2020
Simulation of reflow-based heat transfer on different thermocouple constructions
D Straubinger, B Illés, R Berényi, A Géczy
2020 43rd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2020
2020
Applicability of gage type pressure sensors in vapour phase soldering for process evaluation
MA Alaya, L Gál, A Géczy
2020 43rd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2020
2020
Measurement, Modeling and Control of Different Electronic Systems
A Géczy
Periodica Polytechnica. Electrical Engineering and Computer Science 64 (1), 1, 2020
2020
Investigating the Component Shift during Reflow Soldering at Large Scale Capacitors
O Krammer, R Szilágyi, A Géczy
2019 IEEE 25th International Symposium for Design and Technology in …, 2019
2019
Effect of PCB Thickness and Height Position During Heat Level Type Vapour Phase Reflow Soldering
M Amine Alaya, A Geczy
2019
Effect of Large SMDs on Tombstoning during Vapour Phase Reflow Soldering
A Géczy, D Szalmási, B Illés
2019
Soldering problems of large size SMD PET capacitors during vapour phase soldering process
B Illés, A Géczy, O Krammer, A Skwarek, K Witek
2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-6, 2018
2018
A gőzfázisú újraömlesztéses forrasztás megfigyelése újszerű alkalmazott szenzorikai módszerekkel
A Géczy, AA Mohamed, D Straubinger, G Hantos, I Bozsóki
Elektronikai Technológia és Gyártásinformatika 1 (2), 15-18, 2018
2018
Mechanical analysis of experimental sugar-based bioepoxy printed circuit boards
L Gál, A Géczy, I Hajdu
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017
2017
Book of Abstracts: ISSE 2015, 38th International Spring Seminar on Electonics Technology
G Harsanyi, H Wohlrabe, M Franz, O Krammer, A Geczy, B Illes, J Nicolics
38th International Spring Seminar on Electronics Technology, 2015
2015
Evaluation of solder joints formed by different Vapour Phase Soldering systems
Z Péter, A Géczy, D Rigler, M Ruszinkó, Z Illyefalvi-Vitéz
Proceedings of the 36th International Spring Seminar on Electronics …, 2013
2013
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