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Attila Géczy
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Monitoring multi-respiratory indices via a smart nanofibrous mask filter based on a triboelectric nanogenerator
H He, J Guo, B Illés, A Géczy, B Istók, V Hliva, D Török, JG Kovács, ...
Nano Energy 89, 106418, 2021
572021
Multi-physics modelling of a vapour phase soldering (VPS) system
B Illés, A Géczy
Applied Thermal Engineering 48, 54-62, 2012
502012
Investigating the dynamic changes of the vapour concentration in a Vapour Phase Soldering oven by simplified condensation modelling
B Illés, A Géczy
Applied Thermal Engineering 59 (1-2), 94-100, 2013
402013
A review on current eCall systems for autonomous car accident detection
A Bonyár, A Géczy, O Krammer, H Sántha, B Illés, J Kámán, Z Szalay, ...
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-8, 2017
392017
Low temperature soldering on biopolymer (PLA) Printed Wiring Board substrate
A Géczy, V Léner, I Hajdu, Z Illyefalvi-Vitez
Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011
392011
Advances in producing functional circuits on biodegradable PCBs
B Kovács, A Géczy, G Horváth, I Hajdu, L Gál
Periodica Polytechnica Electrical Engineering and Computer Science 60 (4 …, 2016
382016
Investigations on vapor phase soldering process in an experimental soldering station
A Géczy, Z Illyefalvi-Vitéz, P Szoke
Micro and Nanosystems 2 (3), 170-177, 2010
382010
Investigating heat transfer coefficient differences on printed circuit boards during vapour phase reflow soldering
A Géczy
International Journal of Heat and Mass Transfer 109, 167-174, 2017
322017
Comparative study on proper thermocouple attachment for vapour phase soldering profiling
A Géczy, B Kvanduk, B Illes, G Harsányi
Soldering & Surface Mount Technology 28 (1), 7-12, 2016
312016
Modeling method of heat transfer during Vapour Phase Soldering based on filmwise condensation theory
A Géczy, B Illés, Z Illyefalvi-Vitéz
International Journal of Heat and Mass Transfer 67, 1145-1150, 2013
312013
Determination of soil density by cone index data
G Pillinger, A Géczy, Z Hudoba, P Kiss
Journal of Terramechanics 77, 69-74, 2018
302018
Effects of substrate thermal properties on the heat transfer coefficient of vapour phase soldering
B Illés, A Géczy, A Skwarek, D Busek
International Journal of Heat and Mass Transfer 101, 69-75, 2016
302016
Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system
B Illés, A Skwarek, A Géczy, O Krammer, D Bušek
International Journal of Heat and Mass Transfer 114, 613-620, 2017
292017
Conductive layer deposition and peel tests on biodegradable printed circuit boards
A Géczy, M Kovács, I Hajdu
2012 IEEE 18th International Symposium for Design and Technology in …, 2012
292012
Numerical simulation of condensate layer formation during vapour phase soldering
B Illés, A Géczy
Applied Thermal Engineering 70 (1), 421-429, 2014
272014
Reflow Soldering: Apparatus and Heat Transfer Processes
B Illés, O Krammer, A Geczy
Elsevier, 2020
252020
Characterization of vapour phase soldering process zone with pressure measurements
A Géczy, B Illés, Z Péter, Z Illyefalvi‐Vitéz
Soldering & Surface Mount Technology 25 (2), 99-106, 2013
242013
Can ChatGPT Help in Electronics Research and Development? A Case Study with Applied Sensors
Z Tafferner, B Illés, O Krammer, A Géczy
Sensors 23 (10), 4879, 2023
222023
Investigating the heat transfer on the top side of inclined printed circuit boards during vapour phase soldering
B Illés, A Géczy
Applied Thermal Engineering 103, 1398-1407, 2016
222016
Numerical simulation of electrochemical migration of Cu based on the Nernst-Plank equation
B Illés, B Medgyes, K Dušek, D Bušek, A Skwarek, A Géczy
International Journal of Heat and Mass Transfer 184, 122268, 2022
202022
Influence of vapor phase soldering fluid Galden on wetting forces (tombstone effect)
K Dušek, D Bušek, M Plaček, A Géczy, O Krammer, B Illés
Journal of Materials Processing Technology 251, 20-25, 2018
202018
Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering
A Geczy, M Fejos, L Tersztyánszky
Soldering & Surface Mount Technology 27 (2), 61-68, 2015
202015
Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards
A Géczy, B Illés, Z Péter, Z Illyefalvi-Vitéz
Heat and Mass Transfer 51, 335-342, 2015
202015
Soldering profile optimization for vapour phase reflow technology
A Geczy, P Szőke, Z Illyefalvi-Vitez, M Ruszinko, R Bunea
2011 IEEE 17th International Symposium for Design and Technology in …, 2011
202011
Modelling of temperature distribution along PCB thickness in different substrates during reflow
D Straubinger, I Bozsóki, D Bušek, B Illés, A Géczy
Circuit World 46 (2), 85-92, 2020
182020
Corrosion-induced tin whisker growth in electronic devices: A review
B Illés, B Horváth, A Géczy, O Krammer, K Dušek
Soldering & Surface Mount Technology 29 (1), 59-68, 2017
182017
Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly
P Mach, A Geczy, R Polanský, D Bušek
Journal of Materials Science: Materials in Electronics 30, 4895-4907, 2019
172019
Experimental 13.56 MHz RFID cards on biodegradable substrates
A Géczy, L Gál, L Dudás, G Horváth, B Kovács, D Nagy, I Hajdu
2015 38th International Spring Seminar on Electronics Technology (ISSE), 52-56, 2015
172015
Package–on–package–review on a promising packaging technology
A Geczy, Z Illyefalvi-Vitez
33rd International Spring Seminar on Electronics Technology, ISSE 2010, 117-122, 2010
172010
Biodegradable and nanocomposite materials as printed circuit substrates: a mini-review
A Géczy, C Farkas, R Kovács, D Froš, P Veselý, A Bonyár
IEEE Open Journal of Nanotechnology 3, 182-190, 2022
152022
Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components
D Straubinger, T Hurtony, A Géczy
Journal of Materials Research and Technology 21, 308-318, 2022
152022
Novel PLA/Flax Based Biodegradable Printed Circuit Boards
A Géczy, A Csiszár, E Rozs, I Hajdu, B Medgyes, O Krammer, ...
2022 45th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2022
152022
Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment
D Straubinger, B Illés, D Busek, N Codreanu, A Géczy
Case Studies in Thermal Engineering 33, 102001, 2022
152022
Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs
D Straubinger, A Géczy, A Sipos, A Kiss, D Gyarmati, O Krammer, ...
Circuit World 45 (1), 37-44, 2019
142019
Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system
B Illés, A Skwarek, A Géczy, L Jakab, D Bušek, K Dušek
Soldering & Surface Mount Technology 30 (2), 66-73, 2018
142018
Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing
O Krammer, B Gyarmati, A Szilágyi, R Storcz, L Jakab, B Illés, A Géczy, ...
Soldering & Surface Mount Technology 29 (1), 10-14, 2017
132017
Sustainable printed circuit board substrates based on flame-retarded PLA/flax composites to reduce environmental load of electronics: Quality, reliability, degradation and …
C Farkas, L Gál, A Csiszár, V Grennerat, PO Jeannin, P Xavier, D Rigler, ...
Sustainable Materials and Technologies 40, e00902, 2024
122024
Higher Education with Distance Learning during COVID-19 Pandemic-a Transitional Semester from the Viewpoint of Teachers
A Géczy, O Krammer, L Sujbert
2020 IEEE 26th International Symposium for Design and Technology in …, 2020
122020
Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach
I Bozsóki, A Géczy, B Illés
International Journal of Heat and Mass Transfer 128, 562-569, 2019
122019
Investigating mechanical performance of PLA and CA biodegradable printed circuit boards
A Géczy, D Nagy, I Hajdu, Á Kmetty, B Szolnoki
2015 IEEE 21st International Symposium for Design and Technology in …, 2015
122015
Applied Color Sensor Based Solution for Sorting in Food Industry Processing
MA Alaya, Z Tóth, A Géczy
Periodica Polytechnica Electrical Engineering and Computer Science 63 (1), 16-22, 2019
112019
Vapour phase soldering (VPS) technology: a review
B Illés, A Géczy, B Medgyes, G Harsányi
Soldering & Surface Mount Technology 31 (3), 146-156, 2018
112018
Soldering tests with biodegradable printed circuit boards
A Geczy, T Garami, B Kovacs, D Nagy, L Gal, M Ruszinko, I Hajdu
2013 IEEE 19th International Symposium for Design and Technology in …, 2013
112013
Investigating condensation heat transfer during vapour phase soldering on round-shaped PCB plates
A Géczy, B Illés, T Darnai
International Journal of Heat and Mass Transfer 86, 639-647, 2015
102015
Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints
K Dušek, P Veselý, D Bušek, A Petráč, A Géczy, B Illés, O Krammer
Materials 14 (24), 7909, 2021
92021
Challenges of SMT assembling on biodegradable PCB substrates
A Géczy, I Hajdu, L Gál, CN Barna, M Kovács, G Harsányi
2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019
92019
Evaluation of Cloud-based Open Educational Resources for Teaching Microelectronics
A Bonyár, P Martinek, O Krammer, A Géczy, Z Illyefalvi-Vitéz, S Tzanova
2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-5, 2018
92018
Identification and characterization of ß→ α-Sn transition in SnCu1 bulk alloy inoculated with InSb
A Skwarek, B Illés, B Horváth, A Géczy, P Zachariasz, D Bušek
Journal of Materials Science: Materials in Electronics 28, 16329-16335, 2017
92017
Studying heat transfer on inclined printed circuit boards during vapour phase soldering
A Geczy, D Nagy, B Illes, L Fazekas, O Krammer, D Busek
Soldering & Surface Mount Technology 29 (1), 34-41, 2017
92017
Optimizing laser soldering of SMD components: from theory to practice
R Bunea, P Svasta, Z Illyefalvi-Vitez, R Batorfi, A Geczy
2011 IEEE 17th International Symposium for Design and Technology in …, 2011
92011
Analysis of vapor phase soldering in comparison with conventional soldering technologies
Z Illyefalvi-Vitéz, A Geczy, R Batorfi, P Szöke
3rd Electronics System Integration Technology Conference ESTC, 1-5, 2010
92010
Compact numerical modelling of transient condensate layer formation on small components during vapour phase soldering
I Bozsóki, B Illés, A Géczy
International Communications in Heat and Mass Transfer 135, 106071, 2022
82022
Numerical Models of the Electrochemical Migration: a short review
A Gharaibeh, B Illés, A Géczy, B Medgyes
2020 IEEE 26th International Symposium for Design and Technology in …, 2020
82020
Passenger detection in cars with small form-factor IR sensors (Grid-eye)
A Géczy, RDJ Melgar, A Bonyár, G Harsányi
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-6, 2020
82020
Effect of different thermocouple constructions on heat-level vapour phase soldering profiles
MA Alaya, V Megyeri, D Bušek, G Harsányi, A Geczy
Soldering & Surface Mount Technology 32 (4), 253-259, 2020
82020
Introduction to Surface-Mount Technology
B Illés, O Krammer, A Géczy
Elsevier, 2020
82020
Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering
B Illés, A Géczy, O Krammer, K Dušek, D Bušek
International Journal of Heat and Mass Transfer 125, 202-209, 2018
82018
Effects of high current density on lead-free solder joints of chip-size passive SMD components
A Geczy, D Straubinger, A Kovacs, O Krammer, P Mach, G Harsányi
Soldering & Surface Mount Technology 30 (2), 74-80, 2018
82018
Investigations into the process of vapour phase soldering
A Géczy
PQDT-Global, 2014
8*2014
Late Shelf Life Saturation of Golden Delicious Apple Parameters: TSS, Weight, and Colorimetry
S Kassebi, C Farkas, L Székely, A Géczy, P Korzenszky
Applied Sciences 13 (1), 159, 2022
72022
Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces
D Straubinger, I Bozsóki, B Illes, O Krammer, D Bušek, A Geczy
Soldering & Surface Mount Technology 32 (4), 247-252, 2020
72020
Aspects of additive copper deposition on biodegradable and environmentally friendly PCB substrates (PLA, CA, GPTE-DETDA)
L Gal, A Geczy, G Horvath, D Rigler, I Hajdu
2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-6, 2018
72018
Investigating Printed Circuit Board shrinkage during reflow soldering
A Géczy, M Fejős, L Tersztyánszky, A Kemler, A Szabó
Proceedings of the 2014 37th International Spring Seminar on Electronics …, 2014
72014
Thermocouple attachment methods for PCB profiling during Vapour Phase Soldering
A Géczy, B Kvanduk, B Illés, Z Illyefalvi-Vitéz
2012 IEEE 18th International Symposium for Design and Technology in …, 2012
72012
Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors
MA Alaya, B Illés, D Bušek, A Géczy
Applied Sciences 11 (4), 1755, 2021
62021
Wearable Smart Prototype for Personal Air Quality Monitoring
A Géczy, L Kuglics, L Jakab, G Harsányi
2020 IEEE 26th International Symposium for Design and Technology in …, 2020
62020
Investigating the effect of large SMD components on heating during vapour phase soldering
A Géczy, A Nagy, B Illes, Z Gyorgy, D Busek
2017 IEEE 23rd International Symposium for Design and Technology in …, 2017
62017
Vapour phase soldering on flexible printed circuit boards
A Géczy, R Bátorfi, G Széles, Á Luhály, M Ruszinkó, R Berényi
2014 IEEE 20th International Symposium for Design and Technology in …, 2014
62014
Corrosion problems of SAC-SiC composite solder alloys
H Choi, B Illés, T Hurtony, J Byun, A Géczy, A Skwarek
Corrosion Science 224, 111488, 2023
52023
Filtering Efficiency of Sustainable Textile Materials Applied in Personal Protective Face Mask Production during Pandemic
A Géczy, G Havellant, R Bátorfi, A Skwarek, K Dušek, D Bušek, B Illés
Materials 16 (3), 903, 2023
52023
Thermal and RF Characterization of Novel PLA/Flax Based Biodegradable Printed Circuit Boards
A Géczy, A Csiszár, P Xavier, N Corrao, D Rauly, R Kovács, AÉ Fehér, ...
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 329-333, 2022
52022
Application of Grid-Eye IR sensor for enhanced HMI and OSH purposes in Industry 4.0 reflow soldering environment
A Géczy, TD Mátyás, J Kámán
2020 43rd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2020
52020
Simulation of reflow-based heat transfer on different thermocouple constructions
D Straubinger, B Illés, R Berényi, A Géczy
2020 43rd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2020
52020
Void separation efficiency of vacuum VPS technology on FR4 and LTCC substrates
B Illés, A Skwarek, A Géczy, D Szwagierczak, K Witek
2017 IEEE 23rd International Symposium for Design and Technology in …, 2017
52017
Building a cloud platform for education in microelectronics
P Martinek, Z Illyefalvi-Vitez, O Krammer, A Geczy, B Villanyi, B Illes, ...
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017
52017
Numerical study of vapour concentration reduction in a vacuum vapour phase soldering oven
B Illés, A Skwarek, A Géczy, K Witek
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017
52017
Toward producing commercial electronics on biodegradable PCB substrates
A Géczy, L Gál, B Kovács, I Hajdu
2016 39th International Spring Seminar on Electronics Technology (ISSE), 37-42, 2016
52016
3D thermal profiling of an experimental Vapour Phase Soldering Station
A Géczy, Z Péter, Z Illyefalvi-Vitéz
Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011
52011
Investigating PCB traces for fine pitch applications
A Geczy, Z Illyefalvi-Vitez
2010 IEEE 16th International Symposium for Design and Technology in …, 2010
52010
Overview of Different Approaches in Numerical Modelling of Reflow Soldering Applications
I Bozsóki, A Géczy, B Illés
Energies 16 (16), 5856, 2023
42023
High-Speed Digital Electronics Board on a Novel Biobased and Biodegradable Substrate
V Grennerat, P Xavier, PO Jeannin, N Corrao, A Géczy
2023 46th International Spring Seminar on Electronics Technology (ISSE), 1-5, 2023
42023
Sensor-based IoT monitoring of Electronics Manufacturing in University Lab Environment
A Géczy, L Kuglics, I Megyeri, R Gelbmann, G Harsányi
2021 IEEE 27th International Symposium for Design and Technology in …, 2021
42021
Effect of PCB Thickness and Height Position During Heat Level Type Vapour Phase Reflow Soldering
MA Alaya, A Géczy
2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2019
42019
Optimizing solder joints on biodegradable PCBs with vapour phase soldering
A Géczy, L Gál, I Hajdu, B Kovács, D Nagy, M Ruszinkó
Proceedings of the 2014 37th International Spring Seminar on Electronics …, 2014
42014
Reducing lead-free soldering failures caused by printed circuit board shrinkage
A Geczy, L Tersztyanszky, B Illes, A Kemler, A Szabo
2013 IEEE 19th International Symposium for Design and Technology in …, 2013
42013
Evaluating vapor phase soldering for fine pitch BGA
A Géczy, R Batorfi, L Gal, Z Illyefalvi-Vitéz, P Szoke
33rd International Spring Seminar on Electronics Technology, ISSE 2010, 482-487, 2010
42010
Decomposition study of sustainable biodegradable Printed Circuit Boards
C Farkas, O Krammer, A Csiszár, I Hajdu, L Gál, A Géczy
2023 46th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2023
32023
Soldering problems of large size SMD PET capacitors during vapour phase soldering process
B Illés, A Géczy, O Krammer, A Skwarek, K Witek
2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-6, 2018
32018
Alternative Inspection Methods of Vapour Phase Soldering Work Zone
A Geczy, MA Alaya, G Hantos, B Illes
2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-6, 2018
32018
Investigating current density in the lead free solder joints of surface mounted resistors with experimental approach
A Géczy, D Straubinger, T Hurtony, O Krammer, A Kovács
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017
32017
Investigations on heat transfer with different PCB substrates during vapour phase soldering
L Fazekas, D Nagy, A Géczy, D Busek
2016 IEEE 22nd International Symposium for Design and Technology in …, 2016
32016
Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes
B Illés, O Krammer, A Géczy, T Garami
Soldering & Surface Mount Technology 28 (1), 2-6, 2016
32016
Modeling of condensation heating during Vapour Phase Soldering
A Geczy, B Illes, Z Illyefalvi-Vitez
Proceedings of the 36th International Spring Seminar on Electronics …, 2013
32013
Pressure sensing: a novel method for characterizing the processing zone in vapour phase soldering systems
A Geczy, Z Peter, B Illes, Z Illyefalvi-Vitez
2012 35th International Spring Seminar on Electronics Technology, 55-58, 2012
32012
Experimental investigations on the vapor phase soldering process
Z Illyefalvi-Vitéz, A Géczy, P Szöke, R Bátorfi, I Törzsök
2010 IEEE 16th International Symposium for Design and Technology in …, 2010
32010
Board design optimization for fine pitch BGA components
A Geczy, Z Illyefalvi-Vitez
3rd Electronics System Integration Technology Conference ESTC, 1-6, 2010
32010
Bumping technologies of fine-pitch BGA components
R Bátorfi, P Szöke, Z Oláh, A Géczy, M Ruszinkó, Z Illyefalvi-Vitéz
33rd International Spring Seminar on Electronics Technology, ISSE 2010, 107-112, 2010
32010
Improving efficiency of vapour phase soldering ovens with pressure and temperature-based process monitoring
G Havellant, B Illés, D Bušek, A Géczy
Case Studies in Thermal Engineering 57, 104315, 2024
22024
Personal Air-Quality Monitoring with Sensor-Based Wireless Internet-of-Things Electronics Embedded in Protective Face Masks
L Kuglics, A Géczy, K Dusek, D Busek, B Illés
Sensors 24 (8), 2601, 2024
22024
Numerical modelling approaches to current reflow soldering applications: a brief overview
I Bozsóki, A Géczy, B Illés
2023 46th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2023
22023
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