| Multi-physics modelling of a vapour phase soldering (VPS) system B Illés, A Géczy Applied Thermal Engineering 48, 54-62, 2012 | 50 | 2012 |
| Monitoring multi-respiratory indices via a smart nanofibrous mask filter based on a triboelectric nanogenerator H He, J Guo, B Illés, A Géczy, B Istók, V Hliva, D Török, JG Kovács, ... Nano Energy 89, 106418, 2021 | 49 | 2021 |
| Investigating the dynamic changes of the vapour concentration in a Vapour Phase Soldering oven by simplified condensation modelling B Illés, A Géczy Applied Thermal Engineering 59 (1-2), 94-100, 2013 | 40 | 2013 |
| A review on current eCall systems for autonomous car accident detection A Bonyár, A Géczy, O Krammer, H Sántha, B Illés, J Kámán, Z Szalay, ... 2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-8, 2017 | 38 | 2017 |
| Investigations on vapor phase soldering process in an experimental soldering station A Géczy, Z Illyefalvi-Vitéz, P Szoke Micro and Nanosystems 2 (3), 170-177, 2010 | 37 | 2010 |
| Advances in producing functional circuits on biodegradable PCBs B Kovács, A Géczy, G Horváth, I Hajdu, L Gál Periodica Polytechnica Electrical Engineering and Computer Science 60 (4 …, 2016 | 35 | 2016 |
| Low temperature soldering on biopolymer (PLA) Printed Wiring Board substrate A Géczy, V Léner, I Hajdu, Z Illyefalvi-Vitez Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011 | 34 | 2011 |
| Determination of soil density by cone index data G Pillinger, A Géczy, Z Hudoba, P Kiss Journal of Terramechanics 77, 69-74, 2018 | 30 | 2018 |
| Investigating heat transfer coefficient differences on printed circuit boards during vapour phase reflow soldering A Géczy International Journal of Heat and Mass Transfer 109, 167-174, 2017 | 30 | 2017 |
| Comparative study on proper thermocouple attachment for vapour phase soldering profiling A Géczy, B Kvanduk, B Illes, G Harsányi Soldering & Surface Mount Technology 28 (1), 7-12, 2016 | 30 | 2016 |
| Modeling method of heat transfer during Vapour Phase Soldering based on filmwise condensation theory A Géczy, B Illés, Z Illyefalvi-Vitéz International Journal of Heat and Mass Transfer 67, 1145-1150, 2013 | 30 | 2013 |
| Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system B Illés, A Skwarek, A Géczy, O Krammer, D Bušek International Journal of Heat and Mass Transfer 114, 613-620, 2017 | 28 | 2017 |
| Effects of substrate thermal properties on the heat transfer coefficient of vapour phase soldering B Illés, A Géczy, A Skwarek, D Busek International Journal of Heat and Mass Transfer 101, 69-75, 2016 | 28 | 2016 |
| Conductive layer deposition and peel tests on biodegradable printed circuit boards A Géczy, M Kovács, I Hajdu 2012 IEEE 18th International Symposium for Design and Technology in …, 2012 | 28 | 2012 |
| Numerical simulation of condensate layer formation during vapour phase soldering B Illés, A Géczy Applied Thermal Engineering 70 (1), 421-429, 2014 | 27 | 2014 |
| Characterization of vapour phase soldering process zone with pressure measurements A Géczy, B Illés, Z Péter, Z Illyefalvi‐Vitéz Soldering & Surface Mount Technology 25 (2), 99-106, 2013 | 23 | 2013 |
| Investigating the heat transfer on the top side of inclined printed circuit boards during vapour phase soldering B Illés, A Géczy Applied Thermal Engineering 103, 1398-1407, 2016 | 22 | 2016 |
| Reflow Soldering: Apparatus and Heat Transfer Processes B Illés, O Krammer, A Geczy Elsevier, 2020 | 20 | 2020 |
| Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards A Géczy, B Illés, Z Péter, Z Illyefalvi-Vitéz Heat and Mass Transfer 51, 335-342, 2015 | 20 | 2015 |
| Soldering profile optimization for vapour phase reflow technology A Geczy, P Szőke, Z Illyefalvi-Vitez, M Ruszinko, R Bunea 2011 IEEE 17th International Symposium for Design and Technology in …, 2011 | 20 | 2011 |
| Influence of vapor phase soldering fluid Galden on wetting forces (tombstone effect) K Dušek, D Bušek, M Plaček, A Géczy, O Krammer, B Illés Journal of Materials Processing Technology 251, 20-25, 2018 | 19 | 2018 |
| Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering A Geczy, M Fejos, L Tersztyánszky Soldering & Surface Mount Technology 27 (2), 61-68, 2015 | 19 | 2015 |
| Modelling of temperature distribution along PCB thickness in different substrates during reflow D Straubinger, I Bozsóki, D Bušek, B Illés, A Géczy Circuit World 46 (2), 85-92, 2020 | 17 | 2020 |
| Corrosion-induced tin whisker growth in electronic devices: A review B Illés, B Horváth, A Géczy, O Krammer, K Dušek Soldering & Surface Mount Technology 29 (1), 59-68, 2017 | 17 | 2017 |
| Package–on–package–review on a promising packaging technology A Geczy, Z Illyefalvi-Vitez 33rd International Spring Seminar on Electronics Technology, ISSE 2010, 117-122, 2010 | 17 | 2010 |
| Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly P Mach, A Geczy, R Polanský, D Bušek Journal of Materials Science: Materials in Electronics 30, 4895-4907, 2019 | 16 | 2019 |
| Can ChatGPT Help in Electronics Research and Development? A Case Study with Applied Sensors Z Tafferner, B Illés, O Krammer, A Géczy Sensors 23 (10), 4879, 2023 | 15 | 2023 |
| Numerical simulation of electrochemical migration of Cu based on the Nernst-Plank equation B Illés, B Medgyes, K Dušek, D Bušek, A Skwarek, A Géczy International Journal of Heat and Mass Transfer 184, 122268, 2022 | 15 | 2022 |
| Experimental 13.56 MHz RFID cards on biodegradable substrates A Géczy, L Gál, L Dudás, G Horváth, B Kovács, D Nagy, I Hajdu 2015 38th International Spring Seminar on Electronics Technology (ISSE), 52-56, 2015 | 15 | 2015 |
| Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system B Illés, A Skwarek, A Géczy, L Jakab, D Bušek, K Dušek Soldering & Surface Mount Technology 30 (2), 66-73, 2018 | 13 | 2018 |
| Novel PLA/Flax Based Biodegradable Printed Circuit Boards A Géczy, A Csiszár, E Rozs, I Hajdu, B Medgyes, O Krammer, ... 2022 45th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2022 | 12 | 2022 |
| Higher Education with Distance Learning during COVID-19 Pandemic-a Transitional Semester from the Viewpoint of Teachers A Géczy, O Krammer, L Sujbert 2020 IEEE 26th International Symposium for Design and Technology in …, 2020 | 12 | 2020 |
| Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing O Krammer, B Gyarmati, A Szilágyi, R Storcz, L Jakab, B Illés, A Géczy, ... Soldering & Surface Mount Technology 29 (1), 10-14, 2017 | 12 | 2017 |
| Investigating mechanical performance of PLA and CA biodegradable printed circuit boards A Géczy, D Nagy, I Hajdu, Á Kmetty, B Szolnoki 2015 IEEE 21st International Symposium for Design and Technology in …, 2015 | 12 | 2015 |
| Biodegradable and nanocomposite materials as printed circuit substrates: a mini-review A Géczy, C Farkas, R Kovács, D Froš, P Veselý, A Bonyár IEEE Open Journal of Nanotechnology 3, 182-190, 2022 | 11 | 2022 |
| Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components D Straubinger, T Hurtony, A Géczy Journal of Materials Research and Technology 21, 308-318, 2022 | 11 | 2022 |
| Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs D Straubinger, A Géczy, A Sipos, A Kiss, D Gyarmati, O Krammer, ... Circuit World 45 (1), 37-44, 2019 | 11 | 2019 |
| Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach I Bozsóki, A Géczy, B Illés International Journal of Heat and Mass Transfer 128, 562-569, 2019 | 11 | 2019 |
| Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment D Straubinger, B Illés, D Busek, N Codreanu, A Géczy Case Studies in Thermal Engineering 33, 102001, 2022 | 10 | 2022 |
| Investigating condensation heat transfer during vapour phase soldering on round-shaped PCB plates A Géczy, B Illés, T Darnai International Journal of Heat and Mass Transfer 86, 639-647, 2015 | 10 | 2015 |
| Soldering tests with biodegradable printed circuit boards A Geczy, T Garami, B Kovacs, D Nagy, L Gal, M Ruszinko, I Hajdu 2013 IEEE 19th International Symposium for Design and Technology in …, 2013 | 10 | 2013 |
| Applied Color Sensor Based Solution for Sorting in Food Industry Processing MA Alaya, Z Tóth, A Géczy Periodica Polytechnica Electrical Engineering and Computer Science 63 (1), 16-22, 2019 | 9 | 2019 |
| Vapour phase soldering (VPS) technology: a review B Illés, A Géczy, B Medgyes, G Harsányi Soldering & Surface Mount Technology 31 (3), 146-156, 2018 | 9 | 2018 |
| Identification and characterization of ß→ α-Sn transition in SnCu1 bulk alloy inoculated with InSb A Skwarek, B Illés, B Horváth, A Géczy, P Zachariasz, D Bušek Journal of Materials Science: Materials in Electronics 28, 16329-16335, 2017 | 9 | 2017 |
| Studying heat transfer on inclined printed circuit boards during vapour phase soldering A Geczy, D Nagy, B Illes, L Fazekas, O Krammer, D Busek Soldering & Surface Mount Technology 29 (1), 34-41, 2017 | 9 | 2017 |
| Optimizing laser soldering of SMD components: from theory to practice R Bunea, P Svasta, Z Illyefalvi-Vitez, R Batorfi, A Geczy 2011 IEEE 17th International Symposium for Design and Technology in …, 2011 | 9 | 2011 |
| Analysis of vapor phase soldering in comparison with conventional soldering technologies Z Illyefalvi-Vitéz, A Geczy, R Batorfi, P Szöke 3rd Electronics System Integration Technology Conference ESTC, 1-5, 2010 | 9 | 2010 |
| Challenges of SMT assembling on biodegradable PCB substrates A Géczy, I Hajdu, L Gál, CN Barna, M Kovács, G Harsányi 2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019 | 8 | 2019 |
| Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering B Illés, A Géczy, O Krammer, K Dušek, D Bušek International Journal of Heat and Mass Transfer 125, 202-209, 2018 | 8 | 2018 |
| Evaluation of Cloud-based Open Educational Resources for Teaching Microelectronics A Bonyár, P Martinek, O Krammer, A Géczy, Z Illyefalvi-Vitéz, S Tzanova 2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-5, 2018 | 8 | 2018 |
| Effects of high current density on lead-free solder joints of chip-size passive SMD components A Geczy, D Straubinger, A Kovacs, O Krammer, P Mach, G Harsányi Soldering & Surface Mount Technology 30 (2), 74-80, 2018 | 8 | 2018 |
| Investigations into the process of vapour phase soldering A Géczy PQDT-Global, 2014 | 8* | 2014 |
| Numerical Models of the Electrochemical Migration: a short review A Gharaibeh, B Illés, A Géczy, B Medgyes 2020 IEEE 26th International Symposium for Design and Technology in …, 2020 | 7 | 2020 |
| Passenger detection in cars with small form-factor IR sensors (Grid-eye) A Géczy, RDJ Melgar, A Bonyár, G Harsányi 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-6, 2020 | 7 | 2020 |
| Introduction to Surface-Mount Technology B Illés, O Krammer, A Géczy Elsevier, 2020 | 7 | 2020 |
| Aspects of additive copper deposition on biodegradable and environmentally friendly PCB substrates (PLA, CA, GPTE-DETDA) L Gal, A Geczy, G Horvath, D Rigler, I Hajdu 2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-6, 2018 | 7 | 2018 |
| Investigating Printed Circuit Board shrinkage during reflow soldering A Géczy, M Fejős, L Tersztyánszky, A Kemler, A Szabó Proceedings of the 2014 37th International Spring Seminar on Electronics …, 2014 | 7 | 2014 |
| Compact numerical modelling of transient condensate layer formation on small components during vapour phase soldering I Bozsóki, B Illés, A Géczy International Communications in Heat and Mass Transfer 135, 106071, 2022 | 6 | 2022 |
| Wearable Smart Prototype for Personal Air Quality Monitoring A Géczy, L Kuglics, L Jakab, G Harsányi 2020 IEEE 26th International Symposium for Design and Technology in …, 2020 | 6 | 2020 |
| Effect of different thermocouple constructions on heat-level vapour phase soldering profiles MA Alaya, V Megyeri, D Bušek, G Harsányi, A Geczy Soldering & Surface Mount Technology 32 (4), 253-259, 2020 | 6 | 2020 |
| Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces D Straubinger, I Bozsóki, B Illes, O Krammer, D Bušek, A Geczy Soldering & Surface Mount Technology 32 (4), 247-252, 2020 | 6 | 2020 |
| Investigating the effect of large SMD components on heating during vapour phase soldering A Géczy, A Nagy, B Illes, Z Gyorgy, D Busek 2017 IEEE 23rd International Symposium for Design and Technology in …, 2017 | 6 | 2017 |
| Vapour phase soldering on flexible printed circuit boards A Géczy, R Bátorfi, G Széles, Á Luhály, M Ruszinkó, R Berényi 2014 IEEE 20th International Symposium for Design and Technology in …, 2014 | 6 | 2014 |
| Thermocouple attachment methods for PCB profiling during Vapour Phase Soldering A Géczy, B Kvanduk, B Illés, Z Illyefalvi-Vitéz 2012 IEEE 18th International Symposium for Design and Technology in …, 2012 | 6 | 2012 |
| Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors MA Alaya, B Illés, D Bušek, A Géczy Applied Sciences 11 (4), 1755, 2021 | 5 | 2021 |
| Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints K Dušek, P Veselý, D Bušek, A Petráč, A Géczy, B Illés, O Krammer Materials 14 (24), 7909, 2021 | 5 | 2021 |
| Simulation of reflow-based heat transfer on different thermocouple constructions D Straubinger, B Illés, R Berényi, A Géczy 2020 43rd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2020 | 5 | 2020 |
| Void separation efficiency of vacuum VPS technology on FR4 and LTCC substrates B Illés, A Skwarek, A Géczy, D Szwagierczak, K Witek 2017 IEEE 23rd International Symposium for Design and Technology in …, 2017 | 5 | 2017 |
| Numerical study of vapour concentration reduction in a vacuum vapour phase soldering oven B Illés, A Skwarek, A Géczy, K Witek 2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017 | 5 | 2017 |
| 3D thermal profiling of an experimental Vapour Phase Soldering Station A Géczy, Z Péter, Z Illyefalvi-Vitéz Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011 | 5 | 2011 |
| Investigating PCB traces for fine pitch applications A Geczy, Z Illyefalvi-Vitez 2010 IEEE 16th International Symposium for Design and Technology in …, 2010 | 5 | 2010 |
| Sensor-based IoT monitoring of Electronics Manufacturing in University Lab Environment A Géczy, L Kuglics, I Megyeri, R Gelbmann, G Harsányi 2021 IEEE 27th International Symposium for Design and Technology in …, 2021 | 4 | 2021 |
| Application of Grid-Eye IR sensor for enhanced HMI and OSH purposes in Industry 4.0 reflow soldering environment A Géczy, TD Mátyás, J Kámán 2020 43rd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2020 | 4 | 2020 |
| Building a cloud platform for education in microelectronics P Martinek, Z Illyefalvi-Vitez, O Krammer, A Geczy, B Villanyi, B Illes, ... 2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017 | 4 | 2017 |
| Toward producing commercial electronics on biodegradable PCB substrates A Géczy, L Gál, B Kovács, I Hajdu 2016 39th International Spring Seminar on Electronics Technology (ISSE), 37-42, 2016 | 4 | 2016 |
| Optimizing solder joints on biodegradable PCBs with vapour phase soldering A Géczy, L Gál, I Hajdu, B Kovács, D Nagy, M Ruszinkó Proceedings of the 2014 37th International Spring Seminar on Electronics …, 2014 | 4 | 2014 |
| Reducing lead-free soldering failures caused by printed circuit board shrinkage A Geczy, L Tersztyanszky, B Illes, A Kemler, A Szabo 2013 IEEE 19th International Symposium for Design and Technology in …, 2013 | 4 | 2013 |
| Evaluating vapor phase soldering for fine pitch BGA A Géczy, R Batorfi, L Gal, Z Illyefalvi-Vitéz, P Szoke 33rd International Spring Seminar on Electronics Technology, ISSE 2010, 482-487, 2010 | 4 | 2010 |
| Sustainable printed circuit board substrates based on flame-retarded PLA/flax composites to reduce environmental load of electronics: Quality, reliability, degradation and … C Farkas, L Gál, A Csiszár, V Grennerat, PO Jeannin, P Xavier, D Rigler, ... Sustainable Materials and Technologies 40, e00902, 2024 | 3 | 2024 |
| Corrosion problems of SAC-SiC composite solder alloys H Choi, B Illés, T Hurtony, J Byun, A Géczy, A Skwarek Corrosion Science 224, 111488, 2023 | 3 | 2023 |
| High-Speed Digital Electronics Board on a Novel Biobased and Biodegradable Substrate V Grennerat, P Xavier, PO Jeannin, N Corrao, A Géczy 2023 46th International Spring Seminar on Electronics Technology (ISSE), 1-5, 2023 | 3 | 2023 |
| Filtering Efficiency of Sustainable Textile Materials Applied in Personal Protective Face Mask Production during Pandemic A Géczy, G Havellant, R Bátorfi, A Skwarek, K Dušek, D Bušek, B Illés Materials 16 (3), 903, 2023 | 3 | 2023 |
| Late Shelf Life Saturation of Golden Delicious Apple Parameters: TSS, Weight, and Colorimetry S Kassebi, C Farkas, L Székely, A Géczy, P Korzenszky Applied Sciences 13 (1), 159, 2022 | 3 | 2022 |
| Thermal and RF Characterization of Novel PLA/Flax Based Biodegradable Printed Circuit Boards A Géczy, A Csiszár, P Xavier, N Corrao, D Rauly, R Kovács, AÉ Fehér, ... 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 329-333, 2022 | 3 | 2022 |
| Effect of PCB Thickness and Height Position During Heat Level Type Vapour Phase Reflow Soldering MA Alaya, A Géczy 2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2019 | 3 | 2019 |
| Investigating current density in the lead free solder joints of surface mounted resistors with experimental approach A Géczy, D Straubinger, T Hurtony, O Krammer, A Kovács 2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017 | 3 | 2017 |
| Investigations on heat transfer with different PCB substrates during vapour phase soldering L Fazekas, D Nagy, A Géczy, D Busek 2016 IEEE 22nd International Symposium for Design and Technology in …, 2016 | 3 | 2016 |
| Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes B Illés, O Krammer, A Géczy, T Garami Soldering & Surface Mount Technology 28 (1), 2-6, 2016 | 3 | 2016 |
| Modeling of condensation heating during Vapour Phase Soldering A Geczy, B Illes, Z Illyefalvi-Vitez Proceedings of the 36th International Spring Seminar on Electronics …, 2013 | 3 | 2013 |
| Pressure sensing: a novel method for characterizing the processing zone in vapour phase soldering systems A Geczy, Z Peter, B Illes, Z Illyefalvi-Vitez 2012 35th International Spring Seminar on Electronics Technology, 55-58, 2012 | 3 | 2012 |
| Experimental investigations on the vapor phase soldering process Z Illyefalvi-Vitéz, A Géczy, P Szöke, R Bátorfi, I Törzsök 2010 IEEE 16th International Symposium for Design and Technology in …, 2010 | 3 | 2010 |
| Bumping technologies of fine-pitch BGA components R Bátorfi, P Szöke, Z Oláh, A Géczy, M Ruszinkó, Z Illyefalvi-Vitéz 33rd International Spring Seminar on Electronics Technology, ISSE 2010, 107-112, 2010 | 3 | 2010 |
| Overview of Different Approaches in Numerical Modelling of Reflow Soldering Applications I Bozsóki, A Géczy, B Illés Energies 16 (16), 5856, 2023 | 2 | 2023 |
| Investigation of solder beading phenomenon under surface-mounted electrolytic capacitors D Straubinger, A Toth, V Kerek, Z Czeczei, A Szabo, A Geczy Soldering & Surface Mount Technology 34 (4), 203-211, 2022 | 2 | 2022 |
| Biodegradable and nanocomposite substrates: new prospects for sustainable electronics packaging C Farkas, A Géczy, R Kovács, A Bonyár IEEE EPS eNews 9, 1-9, 2022 | 2 | 2022 |
| Investigating shadowing and possible tombstoning caused by large SMD components during vapour phase reflow soldering A Géczy, D Szalmási, D Straubinger, B Illés 2019 IEEE 25th International Symposium for Design and Technology in …, 2019 | 2 | 2019 |
| Investigating the Component Shift during Reflow Soldering at Large Scale Capacitors O Krammer, R Szilágyi, A Géczy 2019 IEEE 25th International Symposium for Design and Technology in …, 2019 | 2 | 2019 |
| Scaling of Components for Explicit Modelling of Heat Transfer during Vapour Phase Reflow Soldering D Straubinger, I Bozsóki, L Gál, A Géczy 2019 IEEE 25th International Symposium for Design and Technology in …, 2019 | 2 | 2019 |
| Analytical Solution of Heat Distribution Inside a Printed Circuit Board During Vapour Phase Soldering D Straubinger, I Bozsóki, B Illés, A Géczy 2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-5, 2019 | 2 | 2019 |
| Soldering problems of large size SMD PET capacitors during vapour phase soldering process B Illés, A Géczy, O Krammer, A Skwarek, K Witek 2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-6, 2018 | 2 | 2018 |
Balazs IllesFull Professor of Budapest University of Technology and EconomicsVerified email at ett.bme.hu
