Follow
Attila Géczy
Title
Cited by
Cited by
Year
Multi-physics modelling of a vapour phase soldering (VPS) system
B Illés, A Géczy
Applied Thermal Engineering 48, 54-62, 2012
492012
Monitoring multi-respiratory indices via a smart nanofibrous mask filter based on a triboelectric nanogenerator
H He, J Guo, B Illés, A Géczy, B Istók, V Hliva, D Török, JG Kovács, ...
Nano Energy 89, 106418, 2021
442021
Investigating the dynamic changes of the vapour concentration in a Vapour Phase Soldering oven by simplified condensation modelling
B Illés, A Géczy
Applied Thermal Engineering 59 (1-2), 94-100, 2013
372013
Investigations on vapor phase soldering process in an experimental soldering station
A Géczy, Z Illyefalvi-Vitéz, P Szoke
Micro and Nanosystems 2 (3), 170-177, 2010
362010
A review on current eCall systems for autonomous car accident detection
A Bonyár, A Géczy, O Krammer, H Sántha, B Illés, J Kámán, Z Szalay, ...
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-8, 2017
352017
Low temperature soldering on biopolymer (PLA) Printed Wiring Board substrate
A Géczy, V Léner, I Hajdu, Z Illyefalvi-Vitez
Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011
332011
Investigating heat transfer coefficient differences on printed circuit boards during vapour phase reflow soldering
A Géczy
International Journal of Heat and Mass Transfer 109, 167-174, 2017
302017
Effects of substrate thermal properties on the heat transfer coefficient of vapour phase soldering
B Illés, A Géczy, A Skwarek, D Busek
International Journal of Heat and Mass Transfer 101, 69-75, 2016
292016
Modeling method of heat transfer during Vapour Phase Soldering based on filmwise condensation theory
A Géczy, B Illés, Z Illyefalvi-Vitéz
International Journal of Heat and Mass Transfer 67, 1145-1150, 2013
292013
Determination of soil density by cone index data
G Pillinger, A Géczy, Z Hudoba, P Kiss
Journal of Terramechanics 77, 69-74, 2018
282018
Advances in producing functional circuits on biodegradable PCBs
B Kovács, A Géczy, G Horváth, I Hajdu, L Gál
Periodica Polytechnica Electrical Engineering and Computer Science 60 (4 …, 2016
282016
Comparative study on proper thermocouple attachment for vapour phase soldering profiling
A Géczy, B Kvanduk, B Illes, G Harsányi
Soldering & Surface Mount Technology 28 (1), 7-12, 2016
272016
Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system
B Illés, A Skwarek, A Géczy, O Krammer, D Bušek
International Journal of Heat and Mass Transfer 114, 613-620, 2017
252017
Numerical simulation of condensate layer formation during vapour phase soldering
B Illés, A Géczy
Applied Thermal Engineering 70 (1), 421-429, 2014
252014
Conductive layer deposition and peel tests on biodegradable printed circuit boards
A Géczy, M Kovács, I Hajdu
2012 IEEE 18th International Symposium for Design and Technology in …, 2012
252012
Investigating the heat transfer on the top side of inclined printed circuit boards during vapour phase soldering
B Illés, A Géczy
Applied Thermal Engineering 103, 1398-1407, 2016
222016
Characterization of vapour phase soldering process zone with pressure measurements
A Géczy, B Illés, Z Péter, Z Illyefalvi‐Vitéz
Soldering & Surface Mount Technology 25 (2), 99-106, 2013
222013
Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards
A Géczy, B Illés, Z Péter, Z Illyefalvi-Vitéz
Heat and Mass Transfer 51, 335-342, 2015
202015
Soldering profile optimization for vapour phase reflow technology
A Geczy, P Szőke, Z Illyefalvi-Vitez, M Ruszinko, R Bunea
2011 IEEE 17th International Symposium for Design and Technology in …, 2011
202011
Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering
A Geczy, M Fejos, L Tersztyánszky
Soldering & Surface Mount Technology 27 (2), 61-68, 2015
192015
Corrosion-induced tin whisker growth in electronic devices: A review
B Illes, B Horváth, A Géczy, O Krammer, K Dušek
Soldering & Surface Mount Technology 29 (1), 59-68, 2017
172017
Reflow Soldering: Apparatus and Heat Transfer Processes
B Illés, O Krammer, A Geczy
Elsevier, 2020
162020
Modelling of temperature distribution along PCB thickness in different substrates during reflow
D Straubinger, I Bozsóki, D Bušek, B Illés, A Géczy
Circuit World 46 (2), 85-92, 2020
162020
Package–on–package–review on a promising packaging technology
A Geczy, Z Illyefalvi-Vitez
33rd International Spring Seminar on Electronics Technology, ISSE 2010, 117-122, 2010
162010
Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly
P Mach, A Geczy, R Polanský, D Bušek
Journal of Materials Science: Materials in Electronics 30, 4895-4907, 2019
152019
Influence of vapor phase soldering fluid Galden on wetting forces (tombstone effect)
K Dušek, D Bušek, M Plaček, A Géczy, O Krammer, B Illés
Journal of Materials Processing Technology 251, 20-25, 2018
152018
Numerical simulation of electrochemical migration of Cu based on the Nernst-Plank equation
B Illés, B Medgyes, K Dušek, D Bušek, A Skwarek, A Géczy
International Journal of Heat and Mass Transfer 184, 122268, 2022
132022
Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing
O Krammer, B Gyarmati, A Szilágyi, R Storcz, L Jakab, B Illés, A Géczy, ...
Soldering & Surface Mount Technology 29 (1), 10-14, 2017
132017
Experimental 13.56 MHz RFID cards on biodegradable substrates
A Géczy, L Gál, L Dudás, G Horváth, B Kovács, D Nagy, I Hajdu
2015 38th International Spring Seminar on Electronics Technology (ISSE), 52-56, 2015
132015
Higher Education with Distance Learning during COVID-19 Pandemic-a Transitional Semester from the Viewpoint of Teachers
A Géczy, O Krammer, L Sujbert
2020 IEEE 26th International Symposium for Design and Technology in …, 2020
122020
Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system
B Illés, A Skwarek, A Géczy, L Jakab, D Bušek, K Dušek
Soldering & Surface Mount Technology 30 (2), 66-73, 2018
122018
Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs
D Straubinger, A Géczy, A Sipos, A Kiss, D Gyarmati, O Krammer, ...
Circuit World 45 (1), 37-44, 2019
112019
Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach
I Bozsóki, A Géczy, B Illés
International Journal of Heat and Mass Transfer 128, 562-569, 2019
112019
Investigating mechanical performance of PLA and CA biodegradable printed circuit boards
A Géczy, D Nagy, I Hajdu, Á Kmetty, B Szolnoki
2015 IEEE 21st International Symposium for Design and Technology in …, 2015
112015
Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components
D Straubinger, T Hurtony, A Géczy
Journal of Materials Research and Technology 21, 308-318, 2022
102022
Analysis of vapor phase soldering in comparison with conventional soldering technologies
Z Illyefalvi-Vitéz, A Geczy, R Batorfi, P Szöke
3rd Electronics System Integration Technology Conference ESTC, 1-5, 2010
102010
Novel PLA/Flax Based Biodegradable Printed Circuit Boards
A Géczy, A Csiszár, E Rozs, I Hajdu, B Medgyes, O Krammer, ...
2022 45th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2022
92022
Vapour phase soldering (VPS) technology: a review
B Illés, A Géczy, B Medgyes, G Harsányi
Soldering & Surface Mount Technology 31 (3), 146-156, 2018
92018
Identification and characterization of ß→ α-Sn transition in SnCu1 bulk alloy inoculated with InSb
A Skwarek, B Illés, B Horváth, A Géczy, P Zachariasz, D Bušek
Journal of Materials Science: Materials in Electronics 28, 16329-16335, 2017
92017
Investigations into the process of vapour phase soldering
A Géczy
Budapesti Műszaki és Gazdaságtudományi Egyetem, 2014
9*2014
Soldering tests with biodegradable printed circuit boards
A Geczy, T Garami, B Kovacs, D Nagy, L Gal, M Ruszinko, I Hajdu
2013 IEEE 19th International Symposium for Design and Technology in …, 2013
92013
Can ChatGPT Help in Electronics Research and Development? A Case Study with Applied Sensors
Z Tafferner, B Illés, O Krammer, A Géczy
Sensors 23 (10), 4879, 2023
82023
Applied Color Sensor Based Solution for Sorting in Food Industry Processing
MA Alaya, Z Tóth, A Géczy
Periodica Polytechnica Electrical Engineering and Computer Science 63 (1), 16-22, 2019
82019
Effects of high current density on lead-free solder joints of chip-size passive SMD components
A Geczy, D Straubinger, A Kovacs, O Krammer, P Mach, G Harsányi
Soldering & Surface Mount Technology 30 (2), 74-80, 2018
82018
Studying heat transfer on inclined printed circuit boards during vapour phase soldering
A Geczy, D Nagy, B Illes, L Fazekas, O Krammer, D Busek
Soldering & Surface Mount Technology 29 (1), 34-41, 2017
82017
Investigating condensation heat transfer during vapour phase soldering on round-shaped PCB plates
A Géczy, B Illés, T Darnai
International Journal of Heat and Mass Transfer 86, 639-647, 2015
82015
Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment
D Straubinger, B Illés, D Busek, N Codreanu, A Géczy
Case Studies in Thermal Engineering 33, 102001, 2022
72022
Numerical Models of the Electrochemical Migration: a short review
A Gharaibeh, B Illés, A Géczy, B Medgyes
2020 IEEE 26th International Symposium for Design and Technology in …, 2020
72020
Aspects of additive copper deposition on biodegradable and environmentally friendly PCB substrates (PLA, CA, GPTE-DETDA)
L Gal, A Geczy, G Horvath, D Rigler, I Hajdu
2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-6, 2018
72018
Evaluation of Cloud-based Open Educational Resources for Teaching Microelectronics
A Bonyár, P Martinek, O Krammer, A Géczy, Z Illyefalvi-Vitéz, S Tzanova
2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-5, 2018
72018
Investigating Printed Circuit Board shrinkage during reflow soldering
A Géczy, M Fejős, L Tersztyánszky, A Kemler, A Szabó
Proceedings of the 2014 37th International Spring Seminar on Electronics …, 2014
72014
Optimizing laser soldering of SMD components: from theory to practice
R Bunea, P Svasta, Z Illyefalvi-Vitez, R Batorfi, A Geczy
2011 IEEE 17th International Symposium for Design and Technology in …, 2011
72011
Passenger detection in cars with small form-factor IR sensors (Grid-eye)
A Géczy, RDJ Melgar, A Bonyár, G Harsányi
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-6, 2020
62020
Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces
D Straubinger, I Bozsóki, B Illes, O Krammer, D Bušek, A Geczy
Soldering & Surface Mount Technology 32 (4), 247-252, 2020
62020
Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering
B Illés, A Géczy, O Krammer, K Dušek, D Bušek
International Journal of Heat and Mass Transfer 125, 202-209, 2018
62018
Investigating the effect of large SMD components on heating during vapour phase soldering
A Géczy, A Nagy, B Illes, Z Gyorgy, D Busek
2017 IEEE 23rd International Symposium for Design and Technology in …, 2017
62017
Thermocouple attachment methods for PCB profiling during Vapour Phase Soldering
A Géczy, B Kvanduk, B Illés, Z Illyefalvi-Vitéz
2012 IEEE 18th International Symposium for Design and Technology in …, 2012
62012
Investigating PCB traces for fine pitch applications
A Geczy, Z Illyefalvi-Vitez
2010 IEEE 16th International Symposium for Design and Technology in …, 2010
62010
Biodegradable and nanocomposite materials as printed circuit substrates: a mini-review
A Géczy, C Farkas, R Kovács, D Froš, P Veselý, A Bonyár
IEEE Open Journal of Nanotechnology, 2022
52022
Compact numerical modelling of transient condensate layer formation on small components during vapour phase soldering
I Bozsóki, B Illés, A Géczy
International Communications in Heat and Mass Transfer 135, 106071, 2022
52022
Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors
MA Alaya, B Illés, D Bušek, A Géczy
Applied Sciences 11 (4), 1755, 2021
52021
Wearable Smart Prototype for Personal Air Quality Monitoring
A Géczy, L Kuglics, L Jakab, G Harsányi
2020 IEEE 26th International Symposium for Design and Technology in …, 2020
52020
Effect of different thermocouple constructions on heat-level vapour phase soldering profiles
MA Alaya, V Megyeri, D Bušek, G Harsányi, A Geczy
Soldering & Surface Mount Technology 32 (4), 253-259, 2020
52020
Pressure sensing: a novel method for characterizing the processing zone in vapour phase soldering systems
A Geczy, Z Peter, B Illes, Z Illyefalvi-Vitez
2012 35th International Spring Seminar on Electronics Technology, 55-58, 2012
52012
3D thermal profiling of an experimental Vapour Phase Soldering Station
A Géczy, Z Péter, Z Illyefalvi-Vitéz
Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011
52011
Sensor-based IoT monitoring of Electronics Manufacturing in University Lab Environment
A Géczy, L Kuglics, I Megyeri, R Gelbmann, G Harsányi
2021 IEEE 27th International Symposium for Design and Technology in …, 2021
42021
Introduction to Surface-Mount Technology
B Illés, O Krammer, A Géczy
Elsevier, 2020
42020
Application of Grid-Eye IR sensor for enhanced HMI and OSH purposes in Industry 4.0 reflow soldering environment
A Géczy, TD Mátyás, J Kámán
2020 43rd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2020
42020
Simulation of reflow-based heat transfer on different thermocouple constructions
D Straubinger, B Illés, R Berényi, A Géczy
2020 43rd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2020
42020
Challenges of SMT assembling on biodegradable PCB substrates
A Géczy, I Hajdu, L Gál, CN Barna, M Kovács, G Harsányi
2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019
42019
Void separation efficiency of vacuum VPS technology on FR4 and LTCC substrates
B Illés, A Skwarek, A Géczy, D Szwagierczak, K Witek
2017 IEEE 23rd International Symposium for Design and Technology in …, 2017
42017
Building a cloud platform for education in microelectronics
P Martinek, Z Illyefalvi-Vitez, O Krammer, A Geczy, B Villanyi, B Illes, ...
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017
42017
Numerical study of vapour concentration reduction in a vacuum vapour phase soldering oven
B Illés, A Skwarek, A Géczy, K Witek
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017
42017
Vapour phase soldering on flexible printed circuit boards
A Géczy, R Bátorfi, G Széles, Á Luhály, M Ruszinkó, R Berényi
2014 IEEE 20th International Symposium for Design and Technology in …, 2014
42014
Optimizing solder joints on biodegradable PCBs with vapour phase soldering
A Géczy, L Gál, I Hajdu, B Kovács, D Nagy, M Ruszinkó
Proceedings of the 2014 37th International Spring Seminar on Electronics …, 2014
42014
Reducing lead-free soldering failures caused by printed circuit board shrinkage
A Geczy, L Tersztyánszky, B Illes, A Kemler, A Szabó
2013 IEEE 19th International Symposium for Design and Technology in …, 2013
42013
Bumping technologies of fine-pitch BGA components
R Bátorfi, P Szöke, Z Oláh, A Géczy, M Ruszinkó, Z Illyefalvi-Vitéz
33rd International Spring Seminar on Electronics Technology, ISSE 2010, 107-112, 2010
42010
Evaluating vapor phase soldering for fine pitch BGA
A Géczy, R Batorfi, L Gal, Z Illyefalvi-Vitéz, P Szoke
33rd International Spring Seminar on Electronics Technology, ISSE 2010, 482-487, 2010
42010
Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints
K Dušek, P Veselý, D Bušek, A Petráč, A Géczy, B Illés, O Krammer
Materials 14 (24), 7909, 2021
32021
Effect of PCB Thickness and Height Position During Heat Level Type Vapour Phase Reflow Soldering
MA Alaya, A Géczy
2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2019
32019
Analytical Solution of Heat Distribution Inside a Printed Circuit Board During Vapour Phase Soldering
D Straubinger, I Bozsóki, B Illés, A Géczy
2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-5, 2019
32019
Investigating current density in the lead free solder joints of surface mounted resistors with experimental approach
A Géczy, D Straubinger, T Hurtony, O Krammer, A Kovács
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017
32017
Investigations on heat transfer with different PCB substrates during vapour phase soldering
L Fazekas, D Nagy, A Géczy, D Busek
2016 IEEE 22nd International Symposium for Design and Technology in …, 2016
32016
Toward producing commercial electronics on biodegradable PCB substrates
A Géczy, L Gál, B Kovács, I Hajdu
2016 39th International Spring Seminar on Electronics Technology (ISSE), 37-42, 2016
32016
Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes
B Illés, O Krammer, A Géczy, T Garami
Soldering & Surface Mount Technology 28 (1), 2-6, 2016
32016
Modeling of condensation heating during Vapour Phase Soldering
A Geczy, B Illes, Z Illyefalvi-Vitez
Proceedings of the 36th International Spring Seminar on Electronics …, 2013
32013
Experimental investigations on the vapor phase soldering process
Z Illyefalvi-Vitéz, A Géczy, P Szöke, R Bátorfi, I Törzsök
2010 IEEE 16th International Symposium for Design and Technology in …, 2010
32010
Investigating shadowing and possible tombstoning caused by large SMD components during vapour phase reflow soldering
A Géczy, D Szalmási, D Straubinger, B Illés
2019 IEEE 25th International Symposium for Design and Technology in …, 2019
22019
Scaling of Components for Explicit Modelling of Heat Transfer during Vapour Phase Reflow Soldering
D Straubinger, I Bozsóki, L Gál, A Géczy
2019 IEEE 25th International Symposium for Design and Technology in …, 2019
22019
Soldering problems of large size SMD PET capacitors during vapour phase soldering process
B Illés, A Géczy, O Krammer, A Skwarek, K Witek
2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-6, 2018
22018
Alternative Inspection Methods of Vapour Phase Soldering Work Zone
A Geczy, MA Alaya, G Hantos, B Illes
2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-6, 2018
22018
Microelectronics education in Europe in 21stcentury
S Tzanova, A Géczy, O Krammer, P Martinek, Z Lyefalvi-Vitéz, ...
2018 IEEE Global Engineering Education Conference (EDUCON), 2025-2030, 2018
22018
Characterization of tin pest by electrical resistance measurement
A Skwarek, B Illés, A Géczy
2016 IEEE 22nd International Symposium for Design and Technology in …, 2016
22016
Substrate influence on temperature distribution along the PCB during vapor phase soldering
D Bušek, L Fazekas, A Geczy, M Plaček
2016 39th International Spring Seminar on Electronics Technology (ISSE), 267-272, 2016
22016
Investigating whisker growth on immersion tin surface finishing
B Illés, B Horváth, B Lipák, A Géczy
2012 35th International Spring Seminar on Electronics Technology, 242-247, 2012
22012
Board design optimization for fine pitch BGA components
A Geczy, Z Illyefalvi-Vitez
3rd Electronics System Integration Technology Conference ESTC, 1-6, 2010
22010
Overview of Different Approaches in Numerical Modelling of Reflow Soldering Applications
I Bozsóki, A Géczy, B Illés
Energies 16 (16), 5856, 2023
12023
Numerical modelling approaches to current reflow soldering applications: a brief overview
I Bozsóki, A Géczy, B Illés
2023 46th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2023
12023
Filtering Efficiency of Sustainable Textile Materials Applied in Personal Protective Face Mask Production during Pandemic
A Géczy, G Havellant, R Bátorfi, A Skwarek, K Dušek, D Bušek, B Illés
Materials 16 (3), 903, 2023
12023
Thermal and RF Characterization of Novel PLA/Flax Based Biodegradable Printed Circuit Boards
A Géczy, A Csiszár, P Xavier, N Corrao, D Rauly, R Kovács, AÉ Fehér, ...
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 329-333, 2022
12022
The system can't perform the operation now. Try again later.
Articles 1–100