Attila Géczy
TitleCited byYear
Multi-physics modelling of a vapour phase soldering (VPS) system
B Illés, A Géczy
Applied Thermal Engineering 48, 54-62, 2012
352012
Investigations on vapor phase soldering process in an experimental soldering station
A Géczy, Z Illyefalvi-Vitéz, P Szoke
Micro and Nanosystems 2 (3), 170-177, 2010
332010
Investigating the dynamic changes of the vapour concentration in a Vapour Phase Soldering oven by simplified condensation modelling
B Illés, A Géczy
Applied Thermal Engineering 59 (1-2), 94-100, 2013
282013
Low temperature soldering on biopolymer (PLA) Printed Wiring Board substrate
A Géczy, V Léner, I Hajdu, Z Illyefalvi-Vitez
Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011
212011
Numerical simulation of condensate layer formation during vapour phase soldering
B Illés, A Géczy
Applied Thermal Engineering 70 (1), 421-429, 2014
202014
Modeling method of heat transfer during Vapour Phase Soldering based on filmwise condensation theory
A Géczy, B Illés, Z Illyefalvi-Vitéz
International Journal of Heat and Mass Transfer 67, 1145-1150, 2013
192013
Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards
A Géczy, B Illés, Z Péter, Z Illyefalvi-Vitéz
Heat and Mass Transfer 51 (3), 335-342, 2015
162015
Characterization of vapour phase soldering process zone with pressure measurements
A Géczy, B Illés, Z Péter, Z Illyefalvi-Vitéz
Soldering & Surface Mount Technology 25 (2), 99-106, 2013
162013
Conductive layer deposition and peel tests on biodegradable printed circuit boards
A Géczy, M Kovács, I Hajdu
2012 IEEE 18th International Symposium for Design and Technology in …, 2012
162012
Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system
B Illés, A Skwarek, A Géczy, O Krammer, D Bušek
International Journal of Heat and Mass Transfer 114, 613-620, 2017
152017
Advances in producing functional circuits on biodegradable PCBs
B Kovács, A Géczy, G Horváth, I Hajdu, L Gál
Periodica Polytechnica Electrical Engineering and Computer Science 60 (4 …, 2016
142016
Comparative study on proper thermocouple attachment for vapour phase soldering profiling
A Géczy, B Kvanduk, B Illes, G Harsányi
Soldering & Surface Mount Technology 28 (1), 7-12, 2016
142016
Soldering profile optimization for vapour phase reflow technology
A Geczy, P Szőke, Z Illyefalvi-Vitez, M Ruszinko, R Bunea
2011 IEEE 17th International Symposium for Design and Technology in …, 2011
142011
Investigating the heat transfer on the top side of inclined printed circuit boards during vapour phase soldering
B Illés, A Géczy
Applied Thermal Engineering 103, 1398-1407, 2016
132016
Package–on–package–review on a promising packaging technology
A Geczy, Z Illyefalvi-Vitez
33rd International Spring Seminar on Electronics Technology, ISSE 2010, 117-122, 2010
132010
Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering
A Geczy, M Fejos, L Tersztyánszky
Soldering & Surface Mount Technology 27 (2), 61-68, 2015
122015
Investigating heat transfer coefficient differences on printed circuit boards during vapour phase reflow soldering
A Géczy
International Journal of Heat and Mass Transfer 109, 167-174, 2017
112017
Influence of vapor phase soldering fluid Galden on wetting forces (tombstone effect)
K Dušek, D Bušek, M Plaček, A Géczy, O Krammer, B Illés
Journal of Materials Processing Technology 251, 20-25, 2018
92018
Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing
O Krammer, B Gyarmati, A Szilágyi, R Storcz, L Jakab, B Illés, A Géczy, ...
Soldering & Surface Mount Technology 29 (1), 10-14, 2017
92017
Effects of substrate thermal properties on the heat transfer coefficient of vapour phase soldering
B Illés, A Géczy, A Skwarek, D Busek
International Journal of Heat and Mass Transfer 101, 69-75, 2016
92016
Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system
B Illés, A Skwarek, A Géczy, L Jakab, D Bušek, K Dušek
Soldering & Surface Mount Technology 30 (2), 66-73, 2018
82018
Studying heat transfer on inclined printed circuit boards during vapour phase soldering
A Geczy, D Nagy, B Illes, L Fazekas, O Krammer, D Busek
Soldering & Surface Mount Technology 29 (1), 34-41, 2017
82017
Experimental 13.56 MHz RFID cards on biodegradable substrates
A Géczy, L Gál, L Dudás, G Horváth, B Kovács, D Nagy, I Hajdu
2015 38th International Spring Seminar on Electronics Technology (ISSE), 52-56, 2015
82015
Analysis of vapor phase soldering in comparison with conventional soldering technologies
Z Illyefalvi-Vitéz, A Geczy, R Batorfi, P Szőke
3rd Electronics System Integration Technology Conference ESTC, 1-5, 2010
82010
Investigating condensation heat transfer during vapour phase soldering on round-shaped PCB plates
A Géczy, B Illés, T Darnai
International Journal of Heat and Mass Transfer 86, 639-647, 2015
62015
Optimizing solder joints on biodegradable PCBs with vapour phase soldering
A Géczy, L Gál, I Hajdu, B Kovács, D Nagy, M Ruszinkó
Proceedings of the 2014 37th International Spring Seminar on Electronics …, 2014
52014
Investigating PCB traces for fine pitch applications
A Geczy, Z Illyefalvi-Vitez
2010 IEEE 16th International Symposium for Design and Technology in …, 2010
52010
Determination of soil density by cone index data
G Pillinger, A Géczy, Z Hudoba, P Kiss
Journal of Terramechanics 77, 69-74, 2018
42018
Identification and characterization of ß→ α-Sn transition in SnCu1 bulk alloy inoculated with InSb
A Skwarek, B Illés, B Horváth, A Géczy, P Zachariasz, D Bušek
Journal of Materials Science: Materials in Electronics 28 (21), 16329-16335, 2017
42017
Investigating the effect of large SMD components on heating during vapour phase soldering
A Géczy, A Nagy, B Illes, Z Gyorgy, D Busek
2017 IEEE 23rd International Symposium for Design and Technology in …, 2017
42017
Investigations into the process of vapour phase soldering
A Géczy
Budapesti Műszaki és Gazdaságtudományi Egyetem, 2014
42014
Soldering tests with biodegradable printed circuit boards
A Geczy, T Garami, B Kovacs, D Nagy, L Gál, M Ruszinko, I Hajdu
2013 IEEE 19th International Symposium for Design and Technology in …, 2013
42013
Bumping technologies of fine-pitch BGA components
R Bátorfi, P Szőke, Z Oláh, A Géczy, M Ruszinkó, Z Illyefalvi-Vitéz
33rd International Spring Seminar on Electronics Technology, ISSE 2010, 107-112, 2010
42010
Evaluating vapor phase soldering for fine pitch BGA
A Géczy, R Batorfi, L Gal, Z Illyefalvi-Vitéz, P Szoke
33rd International Spring Seminar on Electronics Technology, ISSE 2010, 482-487, 2010
42010
Vapour phase soldering (VPS) technology: a review
B Illés, A Géczy, B Medgyes, G Harsányi
Soldering & Surface Mount Technology 31 (3), 146-156, 2019
32019
Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly
P Mach, A Geczy, R Polanský, D Bušek
Journal of Materials Science: Materials in Electronics 30 (5), 4895-4907, 2019
32019
Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach
I Bozsóki, A Géczy, B Illés
International Journal of Heat and Mass Transfer 128, 562-569, 2019
32019
A review on current eCall systems for autonomous car accident detection
A Bonyár, A Géczy, O Krammer, H Sántha, B Illés, J Kámán, Z Szalay, ...
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-8, 2017
32017
Numerical study of vapour concentration reduction in a vacuum vapour phase soldering oven
B Illés, A Skwarek, A Géczy, K Witek
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017
32017
Investigating mechanical performance of PLA and CA biodegradable printed circuit boards
A Géczy, D Nagy, I Hajdu, Á Kmetty, B Szolnoki
2015 IEEE 21st International Symposium for Design and Technology in …, 2015
32015
Reducing lead-free soldering failures caused by printed circuit board shrinkage
A Géczy, L Tersztyánszky, B Illes, A Kemler, A Szabó
2013 IEEE 19th International Symposium for Design and Technology in …, 2013
32013
3D thermal profiling of an experimental Vapour Phase Soldering Station
A Géczy, Z Péter, Z Illyefalvi-Vitéz
Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011
32011
Experimental investigations on the vapor phase soldering process
Z Illyefalvi-Vitéz, A Géczy, P Szőke, R Bátorfi, I Törzsök
2010 IEEE 16th International Symposium for Design and Technology in …, 2010
32010
Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering
B Illés, A Géczy, O Krammer, K Dušek, D Bušek
International Journal of Heat and Mass Transfer 125, 202-209, 2018
22018
Effects of high current density on lead-free solder joints of chip-size passive SMD components
A Geczy, D Straubinger, A Kovacs, O Krammer, P Mach, G Harsányi
Soldering & Surface Mount Technology 30 (2), 74-80, 2018
22018
Void separation efficiency of vacuum VPS technology on FR4 and LTCC substrates
B Illés, A Skwarek, A Géczy, D Szwagierczak, K Witek
2017 IEEE 23rd International Symposium for Design and Technology in …, 2017
22017
Building a cloud platform for education in microelectronics
P Martinek, Z Illyefalvi-Vitez, O Krammer, A Geczy, B Villanyi, B Illes, ...
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017
22017
Corrosion-induced tin whisker growth in electronic devices: a review
B Illés, B Horváth, A Géczy, O Krammer, K Dušek
Soldering & Surface Mount Technology 29 (1), 59-68, 2017
22017
Characterization of tin pest by electrical resistance measurement
A Skwarek, B Illés, A Géczy
2016 IEEE 22nd International Symposium for Design and Technology in …, 2016
22016
Vapour phase soldering on flexible printed circuit boards
A Géczy, R Bátorfi, G Széles, Á Luhály, M Ruszinkó, R Berényi
2014 IEEE 20th International Symposium for Design and Technology in …, 2014
22014
Investigating Printed Circuit Board shrinkage during reflow soldering
A Géczy, M Fejős, L Tersztyánszky, A Kemler, A Szabó
Proceedings of the 2014 37th International Spring Seminar on Electronics …, 2014
22014
Investigating whisker growth on immersion tin surface finishing
B Illés, B Horváth, B Lipák, A Géczy
2012 35th International Spring Seminar on Electronics Technology, 242-247, 2012
22012
Pressure sensing: a novel method for characterizing the processing zone in vapour phase soldering systems
A Geczy, Z Peter, B Illes, Z Illyefalvi-Vitez
2012 35th International Spring Seminar on Electronics Technology, 55-58, 2012
22012
Optimizing laser soldering of SMD components: from theory to practice
R Bunea, P Svasta, Z Illyefalvi-Vitez, R Batorfi, A Geczy
2011 IEEE 17th International Symposium for Design and Technology in …, 2011
22011
Board design optimization for fine pitch BGA components
A Geczy, Z Illyefalvi-Vitez
3rd Electronics System Integration Technology Conference ESTC, 1-6, 2010
22010
Applied Color Sensor Based Solution for Sorting in Food Industry Processing
MA Alaya, Z Tóth, A Géczy
Periodica Polytechnica Electrical Engineering and Computer Science 63 (1), 16-22, 2019
12019
Aspects of additive copper deposition on biodegradable and environmentally friendly PCB substrates (PLA, CA, GPTE-DETDA)
L Gal, A Geczy, G Horvath, D Rigler, I Hajdu
2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-6, 2018
12018
Alternative Inspection Methods of Vapour Phase Soldering Work Zone
A Geczy, MA Alaya, G Hantos, B Illes
2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-6, 2018
12018
Microelectronics education in Europe in 21stcentury
S Tzanova, A Géczy, O Krammer, P Martinek, Z Lyefalvi-Vitéz, ...
2018 IEEE Global Engineering Education Conference (EDUCON), 2025-2030, 2018
12018
Investigating current density in the lead free solder joints of surface mounted resistors with experimental approach
A Géczy, D Straubinger, T Hurtony, O Krammer, A Kovács
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017
12017
Investigations on heat transfer with different PCB substrates during vapour phase soldering
L Fazekas, D Nagy, A Géczy, D Busek
2016 IEEE 22nd International Symposium for Design and Technology in …, 2016
12016
Substrate influence on temperature distribution along the PCB during vapor phase soldering
D Bušek, L Fazekas, A Geczy, M Plaček
2016 39th International Spring Seminar on Electronics Technology (ISSE), 267-272, 2016
12016
Toward producing commercial electronics on biodegradable PCB substrates
A Géczy, L Gál, B Kovács, I Hajdu
2016 39th International Spring Seminar on Electronics Technology (ISSE), 37-42, 2016
12016
Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes
B Illés, O Krammer, A Géczy, T Garami
Soldering & Surface Mount Technology 28 (1), 2-6, 2016
12016
Condensation model of vapour phase soldering
B Illés, A Géczy
2012 IEEE 18th International Symposium for Design and Technology in …, 2012
12012
Effect of PCB Thickness and Height Position During Heat Level Type Vapour Phase Reflow Soldering
MA Alaya, A Géczy
2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2019
2019
Analytical Solution of Heat Distribution Inside a Printed Circuit Board During Vapour Phase Soldering
D Straubinger, I Bozsóki, B Illés, A Géczy
2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-5, 2019
2019
Wetting of different lead free solder alloys during vapour phase soldering
MA Alaya, L Gál, T Hurtony, B Medgyes, D Straubinger, AM Tareq, B Illés, ...
2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2019
2019
Refined Approach on Controlling Heat Transfer in a Vapour Phase Soldering Oven
A Géczy, BP Kiss, AM Alaya, Z Illyefalvi-Vitéz
2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-5, 2019
2019
Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs
D Straubinger, A Géczy, A Sipos, A Kiss, D Gyarmati, O Krammer, ...
Circuit World 45 (1), 37-44, 2019
2019
Effect of PCB Thickness and Height Position During Heat Level Type Vapour Phase Reflow Soldering
M Amine Alaya, A Geczy
2019
Effect of Large SMDs on Tombstoning during Vapour Phase Reflow Soldering
A Géczy, D Szalmási, B Illés
2019
Soldering problems of large size SMD PET capacitors during vapour phase soldering process
B Illés, A Géczy, O Krammer, A Skwarek, K Witek
2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-6, 2018
2018
Evaluation of Cloud-based Open Educational Resources for Teaching Microelectronics
A Bonyár, P Martinek, O Krammer, A Géczy, Z Illyefalvi-Vitéz, S Tzanova
2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-5, 2018
2018
A gőzfázisú újraömlesztéses forrasztás megfigyelése újszerű alkalmazott szenzorikai módszerekkel
A Géczy, AA Mohamed, D Straubinger, G Hantos, I Bozsóki
Elektronikai Technológia és Gyártásinformatika 1 (2), 15-18, 2018
2018
Mechanical analysis of experimental sugar-based bioepoxy printed circuit boards
L Gál, A Géczy, I Hajdu
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017
2017
Kristályos szilícium alapú, vékony fotoaktív rétegű napelemszerkezetek hőmérsékletfüggő tulajdonságainak vizsgálata
B Plesz
Budapesti Műszaki és Gazdaságtudományi Egyetem, 2016
2016
Book of Abstracts: ISSE 2015, 38th International Spring Seminar on Electonics Technology
G Harsanyi, H Wohlrabe, M Franz, O Krammer, A Geczy, B Illes, J Nicolics
38th International Spring Seminar on Electronics Technology, 2015
2015
Modeling of condensation heating during Vapour Phase Soldering
A Geczy, B Illes, Z Illyefalvi-Vitez
Proceedings of the 36th International Spring Seminar on Electronics …, 2013
2013
Evaluation of solder joints formed by different Vapour Phase Soldering systems
Z Péter, A Géczy, D Rigler, M Ruszinkó, Z Illyefalvi-Vitéz
Proceedings of the 36th International Spring Seminar on Electronics …, 2013
2013
Investigating the dynamic changes of the vapour concentration in a vapour phase soldering oven by simplified condensation modeling
I Balázs, A Géczy
Applied thermal engineering, 94-100, 2013
2013
Thermocouple attachment methods for PCB profiling during Vapour Phase Soldering
A Géczy, B Kvanduk, B Illés, Z Illyefalvi-Vitéz
2012 IEEE 18th International Symposium for Design and Technology in …, 2012
2012
Pressure measurements in a batch type Vapour Phase Soldering Station
Z Péter, A Géczy, B Illés, Z Illyefalvi-Vitéz
2012 IEEE 18th International Symposium for Design and Technology in …, 2012
2012
Investigating the process zone of a Vapour Phase Soldering oven
A Géczy, BG Illés, Z Illyefalvi-Vitéz
2012
Optimization of breaking processes in LTCC manufacturing
E Horváth, A Erényi, A Géczy, G Harsányi
2011 IEEE 17th International Symposium for Design and Technology in …, 2011
2011
A nagy sűrűségű áramkörök PoP szereléstechnológiája
A Géczy
2011
Co-simulation and validation of valves for electro-pneumatic automotive systems
A Geczy, H Nemeth, T Kandar
2009 32nd International Spring Seminar on Electronics Technology, 1-5, 2009
2009
Egydimenziós nanostruktúrák előállítása
A Géczy
2009
Analysis of Criteria for and Benefits of Massive Open Online Courses (MOOCs)
Z Illyefalvi-Vitéz, A Bonyár, P Martinek, O Krammer, A Géczy, N Codreanu, ...
Farca~, c.
L Fazekas, A Fodor, L Frangu, L Gal, A Geczy, C Gerigan, A Ghilezan, ...
Peel Tests on Biodegradable Printed Circuit Boards
A Géczy, M Kovács, I Hajdu
Thermal Analysis of Starch for Realizing Embedded Channel in Low Temperature Co-Fired Ceramic Substrate
E Horváth, A Géczy, G Harsányi, BN Kim
RFID cards on biodegradable substrates–Realization aspects and future trends
A Géczy, G Horváth, L Dudás, L Gál, I Hajdu, G Harsányi
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