Követés
Attila Géczy
Cím
Hivatkozott rá
Hivatkozott rá
Év
Multi-physics modelling of a vapour phase soldering (VPS) system
B Illés, A Géczy
Applied Thermal Engineering 48, 54-62, 2012
492012
Monitoring multi-respiratory indices via a smart nanofibrous mask filter based on a triboelectric nanogenerator
H He, J Guo, B Illés, A Géczy, B Istók, V Hliva, D Török, JG Kovács, ...
Nano Energy 89, 106418, 2021
442021
Investigating the dynamic changes of the vapour concentration in a Vapour Phase Soldering oven by simplified condensation modelling
B Illés, A Géczy
Applied Thermal Engineering 59 (1-2), 94-100, 2013
372013
Investigations on vapor phase soldering process in an experimental soldering station
A Géczy, Z Illyefalvi-Vitéz, P Szoke
Micro and Nanosystems 2 (3), 170-177, 2010
362010
A review on current eCall systems for autonomous car accident detection
A Bonyár, A Géczy, O Krammer, H Sántha, B Illés, J Kámán, Z Szalay, ...
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-8, 2017
352017
Low temperature soldering on biopolymer (PLA) Printed Wiring Board substrate
A Géczy, V Léner, I Hajdu, Z Illyefalvi-Vitez
Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011
332011
Investigating heat transfer coefficient differences on printed circuit boards during vapour phase reflow soldering
A Géczy
International Journal of Heat and Mass Transfer 109, 167-174, 2017
302017
Effects of substrate thermal properties on the heat transfer coefficient of vapour phase soldering
B Illés, A Géczy, A Skwarek, D Busek
International Journal of Heat and Mass Transfer 101, 69-75, 2016
292016
Modeling method of heat transfer during Vapour Phase Soldering based on filmwise condensation theory
A Géczy, B Illés, Z Illyefalvi-Vitéz
International Journal of Heat and Mass Transfer 67, 1145-1150, 2013
292013
Determination of soil density by cone index data
G Pillinger, A Géczy, Z Hudoba, P Kiss
Journal of Terramechanics 77, 69-74, 2018
282018
Advances in producing functional circuits on biodegradable PCBs
B Kovács, A Géczy, G Horváth, I Hajdu, L Gál
Periodica Polytechnica Electrical Engineering and Computer Science 60 (4 …, 2016
282016
Comparative study on proper thermocouple attachment for vapour phase soldering profiling
A Géczy, B Kvanduk, B Illes, G Harsányi
Soldering & Surface Mount Technology 28 (1), 7-12, 2016
272016
Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system
B Illés, A Skwarek, A Géczy, O Krammer, D Bušek
International Journal of Heat and Mass Transfer 114, 613-620, 2017
252017
Numerical simulation of condensate layer formation during vapour phase soldering
B Illés, A Géczy
Applied Thermal Engineering 70 (1), 421-429, 2014
252014
Conductive layer deposition and peel tests on biodegradable printed circuit boards
A Géczy, M Kovács, I Hajdu
2012 IEEE 18th International Symposium for Design and Technology in …, 2012
252012
Investigating the heat transfer on the top side of inclined printed circuit boards during vapour phase soldering
B Illés, A Géczy
Applied Thermal Engineering 103, 1398-1407, 2016
222016
Characterization of vapour phase soldering process zone with pressure measurements
A Géczy, B Illés, Z Péter, Z Illyefalvi‐Vitéz
Soldering & Surface Mount Technology 25 (2), 99-106, 2013
222013
Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards
A Géczy, B Illés, Z Péter, Z Illyefalvi-Vitéz
Heat and Mass Transfer 51, 335-342, 2015
202015
Soldering profile optimization for vapour phase reflow technology
A Geczy, P Szőke, Z Illyefalvi-Vitez, M Ruszinko, R Bunea
2011 IEEE 17th International Symposium for Design and Technology in …, 2011
202011
Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering
A Geczy, M Fejos, L Tersztyánszky
Soldering & Surface Mount Technology 27 (2), 61-68, 2015
192015
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Cikkek 1–20