Követés
Attila Géczy
Cím
Hivatkozott rá
Hivatkozott rá
Év
Multi-physics modelling of a vapour phase soldering (VPS) system
B Illés, A Géczy
Applied Thermal Engineering 48, 54-62, 2012
482012
Investigating the dynamic changes of the vapour concentration in a Vapour Phase Soldering oven by simplified condensation modelling
B Illés, A Géczy
Applied Thermal Engineering 59 (1-2), 94-100, 2013
372013
Investigations on vapor phase soldering process in an experimental soldering station
A Géczy, Z Illyefalvi-Vitéz, P Szoke
Micro and Nanosystems 2 (3), 170-177, 2010
352010
Modeling method of heat transfer during Vapour Phase Soldering based on filmwise condensation theory
A Géczy, B Illés, Z Illyefalvi-Vitéz
International Journal of Heat and Mass Transfer 67, 1145-1150, 2013
282013
Effects of substrate thermal properties on the heat transfer coefficient of vapour phase soldering
B Illés, A Géczy, A Skwarek, D Busek
International Journal of Heat and Mass Transfer 101, 69-75, 2016
272016
Investigating heat transfer coefficient differences on printed circuit boards during vapour phase reflow soldering
A Géczy
International Journal of Heat and Mass Transfer 109, 167-174, 2017
252017
Numerical simulation of condensate layer formation during vapour phase soldering
B Illés, A Géczy
Applied Thermal Engineering 70 (1), 421-429, 2014
252014
A review on current eCall systems for autonomous car accident detection
A Bonyár, A Géczy, O Krammer, H Sántha, B Illés, J Kámán, Z Szalay, ...
2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-8, 2017
242017
Low temperature soldering on biopolymer (PLA) Printed Wiring Board substrate
A Géczy, V Léner, I Hajdu, Z Illyefalvi-Vitez
Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011
232011
Advances in producing functional circuits on biodegradable PCBs
B Kovács, A Géczy, G Horváth, I Hajdu, L Gál
Periodica Polytechnica Electrical Engineering and Computer Science 60 (4 …, 2016
222016
Conductive layer deposition and peel tests on biodegradable printed circuit boards
A Géczy, M Kovács, I Hajdu
2012 IEEE 18th International Symposium for Design and Technology in …, 2012
222012
Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system
B Illés, A Skwarek, A Géczy, O Krammer, D Bušek
International Journal of Heat and Mass Transfer 114, 613-620, 2017
212017
Determination of soil density by cone index data
G Pillinger, A Géczy, Z Hudoba, P Kiss
Journal of Terramechanics 77, 69-74, 2018
202018
Investigating the heat transfer on the top side of inclined printed circuit boards during vapour phase soldering
B Illés, A Géczy
Applied Thermal Engineering 103, 1398-1407, 2016
202016
Comparative study on proper thermocouple attachment for vapour phase soldering profiling
A Géczy, B Kvanduk, B Illes, G Harsányi
Soldering & Surface Mount Technology 28 (1), 7-12, 2016
202016
Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards
A Géczy, B Illés, Z Péter, Z Illyefalvi-Vitéz
Heat and Mass Transfer 51 (3), 335-342, 2015
202015
Characterization of vapour phase soldering process zone with pressure measurements
A Géczy, B Illés, Z Péter, Z Illyefalvi‐Vitéz
Soldering & Surface Mount Technology, 2013
202013
Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering
A Geczy, M Fejos, L Tersztyánszky
Soldering & Surface Mount Technology, 2015
182015
Soldering profile optimization for vapour phase reflow technology
A Geczy, P Szőke, Z Illyefalvi-Vitez, M Ruszinko, R Bunea
2011 IEEE 17th International Symposium for Design and Technology in …, 2011
182011
Package–on–package–review on a promising packaging technology
A Geczy, Z Illyefalvi-Vitez
33rd International Spring Seminar on Electronics Technology, ISSE 2010, 117-122, 2010
152010
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Cikkek 1–20