| Investigation of intermetallic compounds (IMCs) in electrochemically stripped solder joints with SEM T Hurtony, A Bonyár, P Gordon, G Harsányi Microelectronics Reliability 52 (6), 1138-1142, 2012 | 40 | 2012 |
| Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders O Krammer, T Garami, B Horváth, T Hurtony, B Medgyes, L Jakab Journal of Alloys and Compounds 634, 156-162, 2015 | 39 | 2015 |
| Application of ZnO nanoparticles in Sn99Ag0. 3Cu0. 7-based composite solder alloys A Skwarek, O Krammer, T Hurtony, P Ptak, K Górecki, S Wroński, ... Nanomaterials 11 (6), 1545, 2021 | 31 | 2021 |
| Microstructure Influence of SACX0307-TiO2 Composite Solder Joints on Thermal Properties of Power LED Assemblies A Skwarek, P Ptak, K Górecki, T Hurtony, B Illés Materials 13 (7), 1563, 2020 | 27 | 2020 |
| Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys B Illés, T Hurtony, B Medgyes Corrosion Science 99, 313-319, 2015 | 22 | 2015 |
| Characterization of the microstructure of tin-silver lead free solder T Hurtony, A Szakál, L Almásy, A Len, S Kugler, A Bonyár, P Gordon Journal of Alloys and Compounds 672, 13-19, 2016 | 19 | 2016 |
| Whisker growth from vacuum evaporated submicron Sn thin films B Illés, A Skwarek, R Bátorfi, J Ratajczak, A Czerwinski, O Krammer, ... Surface and Coatings Technology 311, 216-222, 2017 | 15 | 2017 |
| Effect of Cu substrate roughness and Sn layer thickness on whisker development from Sn thin-films B Illés, T Hurtony, O Krammer, B Medgyes, K Dušek, D Bušek Materials 12 (21), 3609, 2019 | 14 | 2019 |
| Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints A Skwarek, B Illés, P Górecki, A Pietruszka, J Tarasiuk, T Hurtony Journal of Materials Research and Technology 22, 403-412, 2023 | 13 | 2023 |
| Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy B Illés, H Choi, T Hurtony, K Dušek, D Bušek, A Skwarek Journal of Materials Research and Technology 20, 4231-4240, 2022 | 12 | 2022 |
| Microstructure comparison of soldered joints using electrochemical selective etching T Hurtony, A Bonyár, P Gordon Materials Science Forum 729, 367-372, 2013 | 12 | 2013 |
| Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components D Straubinger, T Hurtony, A Géczy Journal of Materials Research and Technology 21, 308-318, 2022 | 10 | 2022 |
| Kinetics of Sn whisker growth from Sn thin-films on Cu substrate B Illés, O Krammer, T Hurtony, K Dušek, D Bušek, A Skwarek Journal of Materials Science: Materials in Electronics 31, 16314-16323, 2020 | 10 | 2020 |
| Formation and distribution of Sn-Cu IMC in lead-free soldering process induced by laser heating T Hurtony, B Balogh, P Gordon Micro and Nanosystems 2 (3), 178-184, 2010 | 10 | 2010 |
| Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers B Illés, T Hurtony, B Medgyes, O Krammer, K Dusek, D Busek Vacuum 187, 110121, 2021 | 8 | 2021 |
| Mössbauer studies of β→ α phase transition in Sn-rich solder alloys P Zachariasz, A Skwarek, B Illés, J Żukrowski, T Hurtony, K Witek Microelectronics Reliability 82, 165-170, 2018 | 8 | 2018 |
| Assessment of distribution of pellets in tablets by non-destructive microfocus X-ray imaging and image analysis technique Z Csobán, B Kállai-Szabó, N Kállai-Szabó, T Takács, T Hurtony, P Gordon, ... Powder Technology 301, 228-233, 2016 | 8 | 2016 |
| Selective electrochemical etching for the investigation of solder joint microstructures A Bonyár, T Hurtony, G Harsányi 2012 35th International Spring Seminar on Electronics Technology, 89-94, 2012 | 7 | 2012 |
| Simulation and modeling of laser ablation T Hurtony 2008 31st International Spring Seminar on Electronics Technology, 452-457, 2008 | 7 | 2008 |
| Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates T Hurtony, O Krammer, B Illés, G Harsányi, D Bušek, K Dušek Materials 13 (22), 5251, 2020 | 4 | 2020 |
