Követés
David Busek
David Busek
CVUT Praha (CTU in Prague)
E-mail megerősítve itt: fel.cvut.cz
Cím
Hivatkozott rá
Hivatkozott rá
Év
Flux effect on void quantity and size in soldered joints
D Buąek, K Duąek, D Růľička, M Plaček, P Mach, J Urbánek, J Starý
Microelectronics Reliability 60, 135-140, 2016
742016
Solder joint quality evaluation based on heating factor
P Veselý, E Horynová, J Starý, D Buąek, K Duąek, V Zahradník, M Plaček, ...
Circuit World 44 (1), 37-44, 2018
382018
Analysis of no-clean flux spatter during the soldering process
P Veselý, D Buąek, O Krammer, K Duąek
Journal of materials processing technology 275, 116289, 2020
332020
Effects of substrate thermal properties on the heat transfer coefficient of vapour phase soldering
B Illés, A Géczy, A Skwarek, D Busek
International Journal of Heat and Mass Transfer 101, 69-75, 2016
282016
Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system
B Illés, A Skwarek, A Géczy, O Krammer, D Buąek
International Journal of heat and mass transfer 114, 613-620, 2017
272017
Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
K Duąek, D Buąek
Microelectronics Reliability 56, 162-169, 2016
252016
The effect of solder paste particle size on the thixotropic behaviour during stencil printing
O Krammer, B Gyarmati, A Szilágyi, B Illés, D Buąek, K Duąek
Journal of materials processing technology 262, 571-576, 2018
222018
The influence of the crystallographic structure of the intermetallic grains on tin whisker growth
B Illés, A Skwarek, J Ratajczak, K Duąek, D Buąek
Journal of Alloys and Compounds 785, 774-780, 2019
192019
Influence of vapor phase soldering fluid Galden on wetting forces (tombstone effect)
K Duąek, D Buąek, M Plaček, A Géczy, O Krammer, B Illés
Journal of Materials Processing Technology 251, 20-25, 2018
172018
Modelling of temperature distribution along PCB thickness in different substrates during reflow
D Straubinger, I Bozsóki, D Buąek, B Illés, A Géczy
Circuit World 46 (2), 85-92, 2020
162020
Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly
P Mach, A Geczy, R Polanský, D Buąek
Journal of Materials Science: Materials in Electronics 30, 4895-4907, 2019
162019
Effect of Cu substrate roughness and Sn layer thickness on whisker development from Sn thin-films
B Illés, T Hurtony, O Krammer, B Medgyes, K Duąek, D Buąek
Materials 12 (21), 3609, 2019
142019
Numerical simulation of electrochemical migration of Cu based on the Nernst-Plank equation
B Illés, B Medgyes, K Duąek, D Buąek, A Skwarek, A Géczy
International Journal of Heat and Mass Transfer 184, 122268, 2022
132022
Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system
B Illés, A Skwarek, A Géczy, L Jakab, D Buąek, K Duąek
Soldering & Surface Mount Technology 30 (2), 66-73, 2018
132018
Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy
B Illés, H Choi, T Hurtony, K Duąek, D Buąek, A Skwarek
Journal of Materials Research and Technology 20, 4231-4240, 2022
122022
Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs
D Straubinger, A Géczy, A Sipos, A Kiss, D Gyarmati, O Krammer, ...
Circuit World 45 (1), 37-44, 2019
112019
Investigating the attack angle of squeegees with different geometries
O Krammer, L Jakab, B Illes, D Buąek, IB Pelikánová
Soldering & Surface Mount Technology 30 (2), 112-117, 2017
112017
Mathematical modelling of temperature distribution in selected parts of fff printer during 3d printing process
T Tichý, O ©efl, P Veselý, K Duąek, D Buąek
Polymers 13 (23), 4213, 2021
102021
Kinetics of Sn whisker growth from Sn thin-films on Cu substrate
B Illés, O Krammer, T Hurtony, K Duąek, D Buąek, A Skwarek
Journal of Materials Science: Materials in Electronics 31, 16314-16323, 2020
102020
Correlations between mechanical and electrical parameters of modified electrically conductive adhesives
D Buąek, J ©elepová, P Mach
Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011
102011
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