Thermal challenges in next-generation electronic systems SV Garimella, AS Fleischer, JY Murthy, A Keshavarzi, R Prasher, C Patel, ... IEEE Transactions on Components and Packaging Technologies 31 (4), 801-815, 2008 | 500 | 2008 |
CCD-based thermoreflectance microscopy: principles and applications M Farzaneh, K Maize, D Lüerßen, JA Summers, PM Mayer, PE Raad, ... Journal of Physics D: Applied Physics 42 (14), 143001, 2009 | 312 | 2009 |
The surface marker and micro cell method S Chen, DB Johnson, PE Raad, D Fadda International Journal for Numerical Methods in Fluids 25 (7), 749-778, 1997 | 123 | 1997 |
Oman field survey after the December 2004 Indian Ocean tsunami EA Okal, HM Fritz, PE Raad, C Synolakis, Y Al-Shijbi, M Al-Saifi Earthquake Spectra 22 (3_suppl), 203-218, 2006 | 114 | 2006 |
Thermal transport properties of gold-covered thin-film silicon dioxide MG Burzo, PL Komarov, PE Raad IEEE Transactions on Components and Packaging Technologies 26 (1), 80-88, 2003 | 113 | 2003 |
Velocity boundary conditions for the simulation of free surface fluid flow S Chen, DB Johnson, PE Raad Journal of Computational Physics 116 (2), 262-276, 1995 | 107 | 1995 |
Performance of pin fin cast aluminum coldwalls, part 1: Friction factor correlations BE Short Jr, PE Raad, DC Price Journal of Thermophysics and Heat Transfer 16 (3), 389-396, 2002 | 106 | 2002 |
Noncontact transient temperature mapping of active electronic devices using the thermoreflectance method MG Burzo, PL Komarov, PE Raad IEEE transactions on components and packaging technologies 28 (4), 637-643, 2005 | 86 | 2005 |
Performance of pin fin cast aluminum coldwalls, part 2: Colburn j-factor correlations BE Short Jr, PE Raad, DC Price Journal of thermophysics and heat transfer 16 (3), 397-403, 2002 | 76 | 2002 |
GaN-On-Diamond HEMT Technology With TAVG = 176°C at PDC,max = 56 W/mm Measured by Transient Thermoreflectance Imaging MJ Tadjer, TJ Anderson, MG Ancona, PE Raad, P Komarov, T Bai, ... IEEE Electron Device Letters 40 (6), 881-884, 2019 | 71 | 2019 |
System and Method for Predicting the Behavior of a Component PE Raad, JS Wilson, DC Price US Patent 6,064,810, 2000 | 68 | 2000 |
A fractional-diffusion theory for calculating thermal properties of thin films from surface transient thermoreflectance measurements VV Kulish, JL Lage, PL Komarov, PE Raad J. heat Transfer 123 (6), 1133-1138, 2001 | 64 | 2001 |
The three-dimensional Eulerian–Lagrangian marker and micro cell method for the simulation of free surface flows PE Raad, R Bidoae Journal of Computational Physics 203 (2), 668-699, 2005 | 63 | 2005 |
Transient thermo-reflectance measurements of the thermal conductivity and interface resistance of metallized natural and isotopically-pure silicon PL Komarov, MG Burzo, G Kaytaz, PE Raad Microelectronics journal 34 (12), 1115-1118, 2003 | 60 | 2003 |
The introduction of micro cells to treat pressure in free surface fluid flow problems PE Raad, S Chen, DB Johnson | 55 | 1995 |
Technical brief: Thermo-reflectance thermography for submicron temperature measurements PE Raad, PL Komarov, MG Burzo Electronics Cooling 14 (1), 28, 2008 | 44 | 2008 |
Simulation of impacts of fluid free surfaces with solid boundaries DB Johnson, PE Raad, S Chen International journal for numerical methods in fluids 19 (2), 153-176, 1994 | 44 | 1994 |
Procedure for estimation and reporting of uncertainty due to discretization in CFD applications BC Ismail, G Urmila, JR Patrick, JF Christopher, C Hugh, PE Raad J. Fluids Eng 130 (7), 2008 | 43 | 2008 |
The surface marker method S Chen, DB Johnson, PE Raad Computational Modeling of Free and Moving Boundary Problems 1, 223-234, 1991 | 43 | 1991 |
Current Localization and Redistribution as the Basis of Discontinuous Current Controlled Negative Differential Resistance in NbOx SK Nandi, SK Nath, AE El‐Helou, S Li, X Liu, PE Raad, RG Elliman Advanced Functional Materials 29 (50), 1906731, 2019 | 42 | 2019 |