Aerodynamic performance of a gliding swallowtail butterfly wing model H Park, K Bae, B Lee, WP Jeon, H Choi Experimental Mechanics 50, 1313-1321, 2010 | 36 | 2010 |
Semiconductor chip and stacked type semiconductor package having the same JH Kim, JH Son, B Do LEE, KJ Chun, WK Choi US Patent 9,390,997, 2016 | 15 | 2016 |
Performance of different layers of graphene as protective coating for copper wire B Lee, W Li Materials Letters 273, 127875, 2020 | 13 | 2020 |
Effects of process parameters on graphene growth via low-pressure chemical vapor deposition B Lee, W Chu, W Li Journal of Micro-and Nano-Manufacturing 8 (3), 031005, 2020 | 12 | 2020 |
Mechanical and thermal characterization of TSV multi-chip stacked packages for reliable 3D IC applications HY Son, T Oh, JW Hong, BD Lee, JH Shin, SH Kim, NS Kim 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 356-360, 2016 | 10 | 2016 |
Flow structures around a butterfly-shaped low-aspect-ratio wing B Lee, J Seong, H Park, H Choi Journal of Mechanical Science and Technology 28, 2669-2675, 2014 | 7 | 2014 |
Stack package and method for selecting chip in stack package DW Lee, YG Hwang, JH Son, TM Kang, CK Yoon, B Do LEE, YH Kim US Patent 8,810,309, 2014 | 5 | 2014 |
Stack package having flexible conductors TM Kang, YK Hwang, JH Son, DW Lee, B Do LEE, YH Kim US Patent 8,680,688, 2014 | 4 | 2014 |
Stack package having flexible conductors TM Kang, YK Hwang, JH Son, DW Lee, B Do LEE, YH Kim US Patent 8,288,873, 2012 | 4 | 2012 |
The Cooling Rate Effect on Graphene Synthesis Using Low Pressure Chemical Vapor Deposition B Lee, W Chu, W Li International Manufacturing Science and Engineering Conference 85079 …, 2021 | 1 | 2021 |
Effects of Twin Boundary and Precipitates on Board Level Reliability in Sn-Ag-Cu (SAC) Solder Joints through EBSD Analysis DJ Yoon, B Lee, J Kim, S Hyun, G Lee, K Lee 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1091-1094, 2023 | | 2023 |
Synthesis of High-Quality Graphene via Chemical Vapor Deposition B Lee The University of Texas at Austin, 2020 | | 2020 |
Thick graphene transfer and RIE etching for chip cooling W Choi, J Jeong, K Chun, B Do Lee 2013 IEEE International Conference of IEEE Region 10 (TENCON 2013), 1-4, 2013 | | 2013 |
Stack semiconductor package and method for manufacturing the same TM Kang, YK Hwang, JH Son, DW Lee, CK Yoon, B Do LEE, YH Kim US Patent 8,164,200, 2012 | | 2012 |
Vortical structures around a gliding swallowtail butterfly H Park, B Lee, J Seong, H Choi APS Division of Fluid Dynamics Meeting Abstracts 60, JF. 006, 2007 | | 2007 |
글라이딩하는 제비나비 날개형상의 공력특성연구 이병도, 박형민, 최해천 대한기계학회 춘추학술대회, 1874-1877, 2007 | | 2007 |
Aerodynamic Property of Swallowtail Butterfly Wing in Gliding BD Lee, HM Park, HC Choi Proceedings of the KSME Conference, 395-398, 2007 | | 2007 |