Andras Poppe
Andras Poppe
BME Elektronikus Eszközök Tanszéke
Verified email at eet.bme.hu - Homepage
Title
Cited by
Cited by
Year
Thermal management for LED applications
CJM Lasance, A Poppe
Springer, 2014
1862014
Thermal investigation of high power optical devices by transient testing
G Farkas, QV Vader, A Poppe, G Bognár
IEEE transactions on Components and Packaging Technologies 28 (1), 45-50, 2005
1452005
Electro-thermal and logi-thermal simulation of VLSI designs
V Szekely, A Poppe, A Páhi, A Csendes, G Hajas, M Rencz
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 5 (3), 258-269, 1997
1161997
On the standardization of thermal characterization of LEDs
A Poppe, CJM Lasance
2009 25th Annual IEEE Semiconductor Thermal Measurement and Management …, 2009
772009
Thermal measurement and modeling of multi-die packages
A Poppe, Y Zhang, J Wilson, G Farkas, P Szabó, J Parry, M Rencz, ...
IEEE Transactions on components and packaging technologies 32 (2), 484-492, 2009
732009
Electro-thermal simulation: a realization by simultaneous iteration
V Székely, A Poppe, M Rencz, A Csendes, A Páhi
Microelectronics journal 28 (3), 247-262, 1997
72*1997
Multi-domain compact modeling of LEDs: An overview of models and experimental data
A Poppe
Microelectronics Journal 46 (12), 1138-1151, 2015
712015
Electric and thermal transient effects in high power optical devices
G Farkas, S Haque, F Wall, PS Martin, A Poppe, Q van Voorst Vader, ...
Twentieth Annual IEEE Semiconductor Thermal Measurement and Management …, 2004
712004
Multi-domain simulation and measurement of power LED-s and power LED assemblies
A Poppe, G Farkas, V Székely, G Horváth, M Rencz
Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management …, 2006
692006
THERMAN: a thermal simulation tool for IC chips, microstructures and PW boards
V Székely, A Poppe, M Rencz, M Rosental, T Teszéri
Microelectronics Reliability 40 (3), 517-524, 2000
652000
Increasing the accuracy of structure function based thermal material parameter measurements
M Rencz, A Poppe, E Kollár, S Ress, V Székely
IEEE Transactions on components and packaging technologies 28 (1), 51-57, 2005
582005
Simulation of LED based luminaires by using multi-domain compact models of LEDs and compact thermal models of their thermal environment
A Poppe
Microelectronics Reliability 72, 65-74, 2017
502017
Dynamic temperature measurements: tools providing a look into package and mount structures
A Poppe, V Székely
Electronics Cooling 8, 10-19, 2002
452002
New approaches in the transient thermal measurements
V Székely, S Ress, A Poppe, S Török, D Magyari, Z Benedek, K Torki, ...
Microelectronics Journal 31 (9-10), 727-733, 2000
412000
Nonlinear electro-thermal modeling and field-simulation of OLEDs for lighting applications I: Algorithmic fundamentals
L Pohl, E Kollár, A Poppe, Z Kohári
Microelectronics Journal 43 (9), 624-632, 2012
342012
Temperature dependent thermal resistance in power LED assemblies and a way to cope with it
A Poppe, G Molnár, T Temesvölgyi
Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM …, 2010
342010
High-aspect-ratio metal microchannel plates for microelectronic cooling applications
W Yu, MPY Desmulliez, A Drufke, M Leonard, RS Dhariwal, D Flynn, ...
Journal of Micromechanics and Microengineering 20 (2), 025004, 2009
332009
New way for thermal transient testing [IC packaging]
V Székely, M Rencz, A Poppe, B Courtois
Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 1999
321999
Electrical, thermal and optical characterization of power LED assemblies
A Poppe, G Farkas, G Horváth
arXiv preprint arXiv:0709.1815, 2007
312007
CAD and Foundries for Microsystems
JM Karam, B Courtois, H Boutamine, P Drake, A Poppe, V Székely, ...
Proceedings of the 34th annual Design Automation Conference, 674-679, 1997
311997
Dynamic compact models of cooling mounts for fast board level design
G Farkas, A Poppe, E Kollár, P Stehouwer
Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2003
302003
Delphi4LED—From measurements to standardized multi-domain compact models of LED: A new European R&D project for predictive and efficient multi-domain modeling and simulation …
R Bornoff, V Hildenbrand, S Lugten, G Martin, C Marty, A Poppe, M Rencz, ...
2016 22nd International Workshop on Thermal Investigations of ICs and …, 2016
292016
Emerging standard for thermal testing of power LEDs and its possible implementation
A Poppe, G Farkas, G Molnár, B Katona, T Temesvölgyi, JW He
Tenth International Conference on Solid State Lighting 7784, 778414, 2010
292010
Electro-thermal simulation for the prediction of chip operation within the package
M Rencz, V Székely, A Poppe, K Torki, B Courtois
Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2003
292003
Advancing the thermal stability of 3D ICs using logi-thermal simulation
G Nagy, P Horváth, L Pohl, A Poppe
Microelectronics Journal 46 (12), 1114-1120, 2015
272015
Short time die attach characterization of LEDs for in-line testing application
P Szabó, M Rencz, G Farkas, A Poppe
2006 8th Electronics Packaging Technology Conference, 360-366, 2006
272006
Short time die attach characterization of LEDs for in-line testing application
M Rencz, A Poppe, P Szabó, G Farkas
IEEE Press, 2006
27*2006
Novel tools for thermal and electrical analysis of circuits
V Székely, A Poppe
261990
A procedure to correct the error in the structure function based thermal measuring methods
M Rencz, A Poppe, E Kollár, S Ress, V Székely, B Courtois
Twentieth Annual IEEE Semiconductor Thermal Measurement and Management …, 2004
252004
Thermal testing of LEDs
G Farkas, A Poppe
Thermal Management for LED Applications, 73-165, 2014
242014
Boundary condition independent dynamic compact models of packages and heat sinks from thermal transient measurements
M Rencz, G Farkas, V Székely, A Poppe, B Courtois
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC …, 2003
242003
Multi-domain modelling of LEDs for supporting virtual prototyping of luminaires
A Poppe, G Farkas, L Gaál, G Hantos, J Hegedüs, M Rencz
Energies 12 (10), 1909, 2019
232019
Creating multi-port thermal network models of LED luminaires for application in system level multi-domain simulation using Spice-like solvers
A Poppe, J Hegedűs, A Szalai, R Bornoff, J Dyson
2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2016
232016
A step forward in multi-domain modeling of power LEDs
A Poppe
2012 28th Annual IEEE Semiconductor Thermal Measurement and Management …, 2012
232012
Ageing of LEDs: A comprehensive study based on the LM80 standard and thermal transient measurements
A Poppe, G Molnár, P Csuti, F Szabó, J Schanda
International Commission on Illumination (CIE), 2011
232011
New methods and supporting tools for the thermal transient testing of packages
M Rencz, V Székely, A Poppe, G Farkas, B Courtois
Proc. Intl. Conference on Advances in Packaging APACK, 407-411, 2001
232001
LED 3D thermal model calibration against measurement
R Bornoff, G Farkas, L Gaal, M Rencz, A Poppe
2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018
222018
On the standardisation of thermal characterisation of LEDs Part II: Problem definition and potential solutions
A Poppe, CJM Lasance
2008 14th International Workshop on Thermal Inveatigation of ICs and Systems …, 2008
222008
Electro-thermal and logi-thermal simulators aimed at the temperature-aware design of complex integrated circuits
A Poppe, G Horvath, G Nagy, M Rencz, V Székely
2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and …, 2008
222008
Nonlinear electro-thermal modeling and field-simulation of OLEDs for lighting applications II: Luminosity and failure analysis
Z Kohári, E Kollár, L Pohl, A Poppe
Microelectronics Journal 44 (11), 1011-1018, 2013
212013
A general multi-domain LED model and its validation by means of AC thermal impedance
A Poppe, T Temesvölgyi
29th IEEE Semiconductor Thermal Measurement and Management Symposium, 137-142, 2013
212013
A Methodology for the Generation of dynamic Compact Models of packages and Heat Sinks from Thermal Transient measurements
M Rencz, G Farkas, A Poppe, V Szekely, B Courtois
IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology …, 2003
202003
Inclusion of RC compact models of packages into board level thermal simulation tools
M Rencz, V Székely, A Poppe, B Courtois
Eighteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2002
202002
Luminaire digital design flow with multi-domain digital twins of LEDs
G Martin, C Marty, R Bornoff, A Poppe, G Onushkin, M Rencz, J Yu
Energies 12 (12), 2389, 2019
192019
Issues in junction-to-case thermal characterization of power packages with large surface area
A Vass-Varnai, S Gao, Z Sarkany, J Kim, S Choi, G Farkas, A Poppe, ...
2010 26th Annual IEEE Semiconductor Thermal Measurement and Management …, 2010
192010
A methodology for the co-simulation of dynamic compact models of packages with the detailed models of boards
M Rencz, V Székely, A Poppe
IEEE transactions on components and packaging technologies 30 (3), 367-374, 2007
192007
A fast algorithm for the layout based electro-thermal simulation
M Rencz, V Székely, A Poppe
2003 Design, Automation and Test in Europe Conference and Exhibition, 1032-1037, 2003
192003
3D extension of the SUNRED field solver
A Páhi, V Székely, M Rosenthal, M Rencz
International workshop on thermal investigations of ICs and microstructures …, 1998
191998
Complex characterization of power LEDs: simultaneous measurement of photometric/radiometric and thermal properties
G Farkas, A Poppe, J Schanda, K Muray
Proc. CIE LED Conference, 92-95, 2004
182004
A scalable multi-functional thermal test chip family: Design and evaluation
Z Benedek, B Courtois, G Farkas, E Kolla´ r, S Mir, A Poppe, M Rencz, ...
J. Electron. Packag. 123 (4), 323-330, 2001
182001
An alternative method for electro-thermal circuit simulation
M Rencz, V Szekely, A Pahi, A Poppe
1999 Southwest Symposium on Mixed-Signal Design (Cat. No. 99EX286), 117-122, 1999
181999
Design flow for the development of optimized LED luminaires using multi-domain compact model simulations
C Marty, J Yu, G Martin, R Bornoff, A Poppe, D Fournier, E Morard
2018 24rd International Workshop on Thermal Investigations of ICs and …, 2018
172018
Smart SSL: Application of IoT/CPS design platforms in LED-based street-lighting luminaires
A Szalai, T Szabó, P Horváth, A Timár, A Poppe
2016 IEEE Lighting Conference of the Visegrad Countries (Lumen V4), 1-6, 2016
172016
Challenges in LED thermal characterisation
CJM Lasance, A Poppe
EuroSimE 2009-10th International Conference on Thermal, Mechanical and Multi …, 2009
172009
Design issues of a multi-functional intelligent thermal test die
A Poppe, G Farkas, M Rencz, Z Benedek, L Pohl, V Székely, K Torki, S Mir, ...
Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2001
172001
Requirements specification for multi-domain LED compact model development in Delphi4LED
A Alexeev, R Bornoff, S Lungten, G Martin, G Onushkin, A Poppe, ...
2017 18th International Conference on Thermal, Mechanical and Multi-Physics …, 2017
162017
Electro-thermal co-simulation of ICs with runtime back-annotation capability
A Timár, G Bognár, A Poppe, M Rencz
2010 16th International Workshop on Thermal Investigations of ICs and …, 2010
162010
SISSSI-a tool for dynamic electro-thermal simulation of analog VLSI cells
V Székely, A Pahi, A Poppe, M Rencz, A Csendes
Proceedings European Design and Test Conference. ED & TC 97, 617, 1997
161997
Delphi4LED-from measurements to standardized multi-domain compact models of light emitting diodes (LED)
G Martin, A Poppe, S Lungten, V Heikkinen, J Yu, M Rencz, R Bornoff
Electronics Cooling 22 (12), 20-23, 2016
152016
Package characterization: simulations or measurements?
A Poppe, A Vass-Varnai, G Farkas, M Rencz
2008 10th Electronics Packaging Technology Conference, 155-160, 2008
152008
Studies on the possibilities of in-line die attach characterization of semiconductor devices
P Szabó, A Poppe, M Rencz
2007 9th Electronics Packaging Technology Conference, 779-784, 2007
152007
Measurement issues in LED characterization for Delphi4LED style combined electrical-optical-thermal LED modeling
G Hantos, J Hegedüs, MC Bein, L Gaál, G Farkas, Z Sárkány, S Ress, ...
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-7, 2017
142017
Comparison of two alternative junction temperature setting methods aimed for thermal and optical testing of high power LEDs
MC Bein, J Hegedüs, G Hantos, L Gaál, G Farkas, M Rencz, A Poppe
2017 23rd International Workshop on Thermal Investigations of ICs and …, 2017
142017
Assessment of isothermal electro-optical-thermal measurement procedures for LEDs
GA Onushkin, KJ Bosschaart, J Yu, HJ van Aalderen, J Joly, G Martin, ...
2017 23rd International Workshop on Thermal Investigations of ICs and …, 2017
142017
Practical aspects of implementation of a multi-domain LED model
A Poppe, A Szalai
2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM …, 2014
142014
Methodology for thermal and electrical characterization of large area OLEDs
A Poppe, L Pohl, E Kollr, Z Kohári, H Lifka, C Tanase
2009 25th Annual IEEE Semiconductor Thermal Measurement and Management …, 2009
142009
Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling plate
MPY Desmulliez, AJ Pang, M Leonard, RS Dhariwal, W Yu, E Abraham, ...
IEEE Transactions on Components and Packaging Technologies 32 (1), 20-29, 2008
142008
Vibration combined high Temperature Cycle Tests for capacitive MEMS accelerometers
Z Szucs, G Nagy, S Hodossy, M Rencz, A Poppe
2007 13th International Workshop on Thermal Investigation of ICs and Systems …, 2007
142007
Multi-domain modeling of power LEDs based on measured isothermal IVL characteristics
A Poppe, J Hegedüs, A Szalai
Proceedings of the CIE Lighting Quality & Energy Efficiency Conference …, 2016
132016
Diagnostics of LED-based streetlighting luminaires by means of thermal transient method
G Marosy, Z Kovács, G Molnár, A Poppe
2010 16th International Workshop on Thermal Investigations of ICs and …, 2010
132010
Thermal characterization of a radial micro-channel cooling plate
G Bognár, G Horvoth, Z Kohári, AJ Pang, MPY Desmulliez, A Poppe, ...
Semiconductor Thermal Measurement and Management IEEE Twenty First Annual …, 2005
132005
THERMODEL: A tool for thermal model generation, and application for MEMS
V Székely, M Rencz, A Poppe, B Courtois
Analog Integrated Circuits and Signal Processing 29 (1), 49-59, 2001
132001
Physics related modeling of power LEDs
K Paisnik, A Poppe, T Rang, G Rang
2012 13th Biennial Baltic Electronics Conference, 57-60, 2012
122012
Testing of Power LEDs: The Latest Thermal Testing Standards from JEDEC
A Poppe
Electronics Cooling Magazine, 0
12
LED Characterization within the Delphi4LED Project
G Farkas, L Gaál, M Bein, A Poppe, S Ress, M Rencz
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018
112018
Light output stabilisation of LED based streetlighting luminaires by adaptive current control
J Hegedüs, G Hantos, A Poppe
Microelectronics Reliability 79, 448-456, 2017
112017
Simulation framework for multilevel power estimation and timing analysis of digital systems allowing the consideration of thermal effects
G Nagy, A Poppe
2012 13th Latin American Test Workshop (LATW), 1-5, 2012
112012
Electro-thermal investigation of OLEDs
L Pohl, E Kollár, Z Kohári, A Poppe
2008 14th International Workshop on Thermal Inveatigation of ICs and Systems …, 2008
112008
Cross-verification of thermal characterization of a microcooler
Z Kohári, G Bognár, G Horváth, A Poppe, M Rencz, V Székely
102007
Thermal characterization and compact modeling of stacked die packages
P Szabo, A Poppe, G Farkas, V Szekely, B Courtois, M Rencz
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006
102006
Integration of a network solver and a field solver for the mixed-level thermal simulation of MEMS problems
M Rencz, V Szekely, A Poppe
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002 4755, 36-43, 2002
102002
Algorithmic extension of thermal field solvers: time constant analysis
V Székely, A Poppe, M Rencz
Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2000
102000
Electro-thermal simulation with the SISSI package
V Sze, A Pa, A Poppe, M Rencz
Analog Integrated Circuits and Signal Processing 21 (1), 21-31, 1999
101999
Micro-systems modeling at a system level
JM Karam, B Courtois, K Hofmann, A Poppe, M Rencz, M Glesner, ...
APCHDL'96, 1996
101996
Structural analysis and modelling of packaged light emitting devices by thermal transient measurements at multiple boundaries
G Farkas, A Poppe, L Gaal, G Hantos, C Berényi, M Rencz
2018 24rd International Workshop on Thermal Investigations of ICs and …, 2018
92018
Inter Laboratory Comparison of LED Measurements Aimed as Input for Multi-Domain Compact Model Development within a European-wide R&D Project
A Poppe, G Farkas, F Szabó, J Joly, J Thomé, J Yu, K Bosschaartl, ...
Proceedings of the Conference on “Smarter Lighting for Better Life” at the …, 2017
92017
Compact modeling approach for microchannel cooling aimed at high-level thermal analysis of 3D packaged ICs
M Németh, L Jani, A Poppe
2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS …, 2016
92016
Application of the transient dual interface method in test based modeling of heat-sinks aimed at socketable LED modules
A Poppe, G Hantos, J Hegedus
2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2015
92015
Investigation of die-attach degradation using power cycling tests
Z Sarkany, A Vass-Varnai, M Rencz
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 780-784, 2013
92013
A novel simulation environment enabling multilevel power estimation of digital systems
G Nagy, A Poppe
Thermal Investigations of ICs and Systems (THERMINIC), 2011 17th …, 2011
92011
Issues of thermal testing of AC LEDs
A Poppe, B Siegal, G Farkas
2011 27th Annual IEEE Semiconductor Thermal Measurement and Management …, 2011
92011
Thermal characterization of multi-die packages
A Poppe, Y Zhang, G Farkas, H Wong, J Wilson, P Szabó
2006 8th Electronics Packaging Technology Conference, 500-505, 2006
92006
Experimental study of a radial micro-channel cooling plate
A Poppe, G Horváth, G Bognár, Z Kohári, MPY Desmulliez, M Rencz
2005 7th Electronic Packaging Technology Conference 2, 6 pp., 2005
92005
The Sissy electro-thermal simulation system-Based on modern software technologies
G Horváth, A Poppe
THERMINIC 2005, 51-54, 2005
92005
Design of a scalable multi-functional thermal test die with direct and boundary scan access for programmed excitation and data measurement
A Poppe, G Farkas, M Rencz, Z Benedek, L Pohl, V Székely, K Torki, S Mir, ...
Proceedings of the 6th Therminic Workshop, 24-27, 2000
92000
Compact modeling approach for microchannel cooling and its validation
M Németh, G Takács, L Jani, A Poppe
Microsystem Technologies 24 (1), 419-431, 2018
82018
Lifetime isoflux control of LED based light sources
J Hegedüs, G Hantos, A Poppe
2017 23rd international workshop on thermal investigations of ICs and …, 2017
82017
Embedded multi-domain LED model for adaptive dimming of streetlighting luminaires
J Hegedüs, G Hantos, A Poppe
2016 22nd International Workshop on Thermal Investigations of ICs and …, 2016
82016
Standardization of LED thermal characterization
A Poppe, CJM Lasance
Thermal Management for LED Applications, 197-264, 2014
82014
Solid State Physics Fundamentals of LED Thermal Behavior
J Li, J Wang, Z Liu, A Poppe
Thermal Management for LED Applications, 15-52, 2014
82014
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