Andras Poppe
Andras Poppe
BME Elektronikus Eszközök Tanszéke
Verified email at eet.bme.hu - Homepage
Title
Cited by
Cited by
Year
Thermal management for LED applications
CJM Lasance, A Poppe
Springer, 2014
1642014
Thermal investigation of high power optical devices by transient testing
G Farkas, QV Vader, A Poppe, G Bognár
IEEE transactions on Components and Packaging Technologies 28 (1), 45-50, 2005
1412005
Electro-thermal and logi-thermal simulation of VLSI designs
V Székely, A Poppe, A Páhi, A Csendes, G Hajas, M Rencz
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 5 (3), 258-269, 1997
1081997
On the standardization of thermal characterization of LEDs
A Poppe, CJM Lasance
2009 25th Annual IEEE Semiconductor Thermal Measurement and Management …, 2009
792009
Electric and thermal transient effects in high power optical devices
G Farkas, S Haque, F Wall, PS Martin, A Poppe, Q van Voorst Vader, ...
Twentieth Annual IEEE Semiconductor Thermal Measurement and Management …, 2004
712004
Electro-thermal simulation: a realization by simultaneous iteration
V Székely, A Poppe, M Rencz, A Csendes, A Páhi
Microelectronics journal 28 (3), 247-262, 1997
70*1997
Thermal measurement and modeling of multi-die packages
A Poppe, Y Zhang, J Wilson, G Farkas, P Szabó, J Parry, M Rencz, ...
IEEE Transactions on components and packaging technologies 32 (2), 484-492, 2009
692009
Multi-domain compact modeling of LEDs: An overview of models and experimental data
A Poppe
Microelectronics Journal 46 (12), 1138-1151, 2015
662015
Multi-domain simulation and measurement of power LED-s and power LED assemblies
A Poppe, G Farkas, V Székely, G Horváth, M Rencz
Twenty-Second Annual IEEE Semiconductor Thermal Measurement and Management …, 2006
652006
THERMAN: a thermal simulation tool for IC chips, microstructures and PW boards
V Székely, A Poppe, M Rencz, M Rosental, T Teszéri
Microelectronics Reliability 40 (3), 517-524, 2000
602000
Increasing the accuracy of structure function based thermal material parameter measurements
M Rencz, A Poppe, E Kollár, S Ress, V Székely
IEEE Transactions on components and packaging technologies 28 (1), 51-57, 2005
572005
Simulation of LED based luminaires by using multi-domain compact models of LEDs and compact thermal models of their thermal environment
A Poppe
Microelectronics Reliability 72, 65-74, 2017
422017
Dynamic temperature measurements: tools providing a look into package and mount structures
A Poppe, V Székely
Electronics Cooling 8, 10-19, 2002
422002
New approaches in the transient thermal measurements
V Székely, S Ress, A Poppe, S Török, D Magyari, Z Benedek, K Torki, ...
Microelectronics Journal 31 (9-10), 727-733, 2000
422000
Nonlinear electro-thermal modeling and field-simulation of OLEDs for lighting applications I: Algorithmic fundamentals
L Pohl, E Kollár, A Poppe, Z Kohári
Microelectronics Journal 43 (9), 624-632, 2012
322012
Temperature dependent thermal resistance in power LED assemblies and a way to cope with it
A Poppe, G Molnár, T Temesvölgyi
Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM …, 2010
312010
High-aspect-ratio metal microchannel plates for microelectronic cooling applications
W Yu, MPY Desmulliez, A Drufke, M Leonard, RS Dhariwal, D Flynn, ...
Journal of Micromechanics and Microengineering 20 (2), 025004, 2009
312009
CAD and Foundries for Microsystems
JM Karam, B Courtois, H Boutamine, P Drake, A Poppe, V Székely, ...
Proceedings of the 34th annual Design Automation Conference, 674-679, 1997
311997
Electrical, thermal and optical characterization of power LED assemblies
A Poppe, G Farkas, G Horváth
arXiv preprint arXiv:0709.1815, 2007
302007
Dynamic compact models of cooling mounts for fast board level design
G Farkas, A Poppe, E Kollár, P Stehouwer
Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2003
302003
Electro-thermal simulation for the prediction of chip operation within the package
M Rencz, V Székely, A Poppe, K Torki, B Courtois
Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2003
302003
New way for thermal transient testing [IC packaging]
V Székely, M Rencz, A Poppe, B Courtois
Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 1999
301999
Novel tools for thermal and electrical analysis of circuits
V Székely, A Poppe
281990
Emerging standard for thermal testing of power LEDs and its possible implementation
A Poppe, G Farkas, G Molnár, B Katona, T Temesvölgyi, JW He
Tenth International Conference on Solid State Lighting 7784, 778414, 2010
272010
Short time die attach characterization of LEDs for in-line testing application
P Szabó, M Rencz, G Farkas, A Poppe
2006 8th Electronics Packaging Technology Conference, 360-366, 2006
262006
Short time die attach characterization of LEDs for in-line testing application
M Rencz, A Poppe, P Szabó, G Farkas
IEEE Press, 2006
26*2006
A procedure to correct the error in the structure function based thermal measuring methods
M Rencz, A Poppe, E Kollár, S Ress, V Székely, B Courtois
Twentieth Annual IEEE Semiconductor Thermal Measurement and Management …, 2004
252004
Delphi4LED—from measurements to standardized multi-domain compact models of LED: A new european R&D project for predictive and efficient multi-domain modeling and simulation …
R Bornoff, V Hildenbrand, S Lugten, G Martin, C Marty, A Poppe, M Rencz, ...
2016 22nd International Workshop on Thermal Investigations of ICs and …, 2016
242016
Advancing the thermal stability of 3D ICs using logi-thermal simulation
G Nagy, P Horváth, L Pohl, A Poppe
Microelectronics Journal 46 (12), 1114-1120, 2015
242015
Boundary condition independent dynamic compact models of packages and heat sinks from thermal transient measurements
M Rencz, G Farkas, V Székely, A Poppe, B Courtois
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC …, 2003
242003
Thermal testing of LEDs
G Farkas, A Poppe
Thermal Management for LED Applications, 73-165, 2014
232014
New methods and supporting tools for the thermal transient testing of packages
M Rencz, V Székely, A Poppe, G Farkas, B Courtois
Proc. Intl. Conference on Advances in Packaging APACK, 407-411, 2001
232001
A step forward in multi-domain modeling of power LEDs
A Poppe
2012 28th Annual IEEE Semiconductor Thermal Measurement and Management …, 2012
222012
Ageing of LEDs: A comprehensive study based on the LM80 standard and thermal transient measurements
A Poppe, G Molnár, P Csuti, F Szabó, J Schanda
International Commission on Illumination (CIE), 2011
222011
On the standardisation of thermal characterisation of LEDs Part II: Problem definition and potential solutions
A Poppe, CJM Lasance
2008 14th International Workshop on Thermal Inveatigation of ICs and Systems …, 2008
222008
LED 3D thermal model calibration against measurement
R Bornoff, G Farkas, L Gaal, M Rencz, A Poppe
2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018
212018
Creating multi-port thermal network models of LED luminaires for application in system level multi-domain simulation using Spice-like solvers
A Poppe, J Hegedűs, A Szalai, R Bornoff, J Dyson
2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2016
212016
Electro-thermal and logi-thermal simulators aimed at the temperature-aware design of complex integrated circuits
A Poppe, G Horvath, G Nagy, M Rencz, V Székely
2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and …, 2008
212008
Nonlinear electro-thermal modeling and field-simulation of OLEDs for lighting applications II: Luminosity and failure analysis
Z Kohári, E Kollár, L Pohl, A Poppe
Microelectronics Journal 44 (11), 1011-1018, 2013
202013
A methodology for the generation of dynamic compact models of packages and heat sinks from thermal transient measurements
M Rencz, G Farkas, A Poppe, V Szekely, B Courtois
IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology …, 2003
202003
Inclusion of RC compact models of packages into board level thermal simulation tools
M Rencz, V Székely, A Poppe, B Courtois
Eighteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2002
202002
A general multi-domain LED model and its validation by means of AC thermal impedance
A Poppe, T Temesvölgyi
29th IEEE Semiconductor Thermal Measurement and Management Symposium, 137-142, 2013
192013
A fast algorithm for the layout based electro-thermal simulation
M Rencz, V Székely, A Poppe
2003 Design, Automation and Test in Europe Conference and Exhibition, 1032-1037, 2003
192003
A scalable multi-functional thermal test chip family: Design and evaluation
Z Benedek, B Courtois, G Farkas, E Kolla´ r, S Mir, A Poppe, M Rencz, ...
J. Electron. Packag. 123 (4), 323-330, 2001
192001
Design issues of a multi-functional intelligent thermal test die
A Poppe, G Farkas, M Rencz, Z Benedek, L Pohl, V Székely, K Torki, S Mir, ...
Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2001
192001
3D extension of the SUNRED field solver
A Páhi, V Székely, M Rosenthal, M Rencz
Proceedings of the 1998 4th International Workshop on Thermal Investigations …, 1998
191998
Multi-domain modelling of LEDs for supporting virtual prototyping of luminaires
A Poppe, G Farkas, L Gaál, G Hantos, J Hegedüs, M Rencz
Energies 12 (10), 1909, 2019
182019
A methodology for the co-simulation of dynamic compact models of packages with the detailed models of boards
M Rencz, V Székely, A Poppe
IEEE transactions on components and packaging technologies 30 (3), 367-374, 2007
182007
Complex characterization of power LEDs: simultaneous measurement of photometric/radiometric and thermal properties
G Farkas, A Poppe, J Schanda, K Muray
International Commission on Illumination (CIE), 2004
182004
Issues in junction-to-case thermal characterization of power packages with large surface area
A Vass-Varnai, S Gao, Z Sarkany, J Kim, S Choi, G Farkas, A Poppe, ...
2010 26th Annual IEEE Semiconductor Thermal Measurement and Management …, 2010
172010
Electro-thermal co-simulation of ICs with runtime back-annotation capability
A Timár, G Bognár, A Poppe, M Rencz
2010 16th International Workshop on Thermal Investigations of ICs and …, 2010
162010
Challenges in LED thermal characterisation
CJM Lasance, A Poppe
EuroSimE 2009-10th International Conference on Thermal, Mechanical and Multi …, 2009
162009
An alternative method for electro-thermal circuit simulation
M Rencz, V Szekely, A Pahi, A Poppe
1999 Southwest Symposium on Mixed-Signal Design (Cat. No. 99EX286), 117-122, 1999
161999
Luminaire digital design flow with multi-domain digital twins of LEDs
G Martin, C Marty, R Bornoff, A Poppe, G Onushkin, M Rencz, J Yu
Energies 12 (12), 2389, 2019
142019
Comparison of two alternative junction temperature setting methods aimed for thermal and optical testing of high power LEDs
MC Bein, J Hegedüs, G Hantos, L Gaál, G Farkas, M Rencz, A Poppe
2017 23rd International Workshop on Thermal Investigations of ICs and …, 2017
142017
Delphi4LED-from measurements to standardized multi-domain compact models of light emitting diodes (LED)
G Martin, A Poppe, S Lungten, V Heikkinen, J Yu, M Rencz, R Bornoff
Electronics Cooling 22 (12), 20-23, 2016
142016
Package characterization: simulations or measurements?
A Poppe, A Vass-Varnai, G Farkas, M Rencz
2008 10th Electronics Packaging Technology Conference, 155-160, 2008
142008
Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling plate
MPY Desmulliez, AJ Pang, M Leonard, RS Dhariwal, W Yu, E Abraham, ...
IEEE Transactions on Components and Packaging Technologies 32 (1), 20-29, 2008
142008
Studies on the possibilities of in-line die attach characterization of semiconductor devices
P Szabó, A Poppe, M Rencz
2007 9th Electronics Packaging Technology Conference, 779-784, 2007
142007
Vibration combined high Temperature Cycle Tests for capacitive MEMS accelerometers
Z Szucs, G Nagy, S Hodossy, M Rencz, A Poppe
2007 13th International Workshop on Thermal Investigation of ICs and Systems …, 2007
142007
Design flow for the development of optimized LED luminaires using multi-domain compact model simulations
C Marty, J Yu, G Martin, R Bornoff, A Poppe, D Fournier
2018 24rd International Workshop on Thermal Investigations of ICs and …, 2018
132018
Measurement issues in LED characterization for Delphi4LED style combined electrical-optical-thermal LED modeling
G Hantos, J Hegedüs, MC Bein, L Gaál, G Farkas, Z Sárkány, S Ress, ...
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-7, 2017
132017
Requirements specification for multi-domain LED compact model development in Delphi4LED
A Alexeev, R Bornoff, S Lungten, G Martin, G Onushkin, A Poppe, ...
2017 18th International Conference on Thermal, Mechanical and Multi-Physics …, 2017
132017
Smart SSL: Application of IoT/CPS design platforms in LED-based street-lighting luminaires
A Szalai, T Szabó, P Horváth, A Timár, A Poppe
2016 IEEE Lighting Conference of the Visegrad Countries (Lumen V4), 1-6, 2016
132016
Multi-domain modeling of power LEDs based on measured isothermal IVL characteristics
A Poppe, J Hegedüs, A Szalai
Proceedings of the CIE Lighting Quality & Energy Efficiency Conference …, 2016
132016
Methodology for thermal and electrical characterization of large area OLEDs
A Poppe, L Pohl, E Kollr, Z Kohári, H Lifka, C Tanase
2009 25th Annual IEEE Semiconductor Thermal Measurement and Management …, 2009
132009
SISSSI-A tool for dynamic electro-thermal simulation of analog VLSI cells
V Székely, A Pahi, A Poppe, M Rencz, A Csendes
Proceedings European Design and Test Conference. ED & TC 97, 617, 1997
131997
Assessment of isothermal electro-optical-thermal measurement procedures for LEDs
GA Onushkin, KJ Bosschaart, J Yu, HJ Van Aalderen, J Joly, G Martin, ...
2017 23rd International Workshop on Thermal Investigations of ICs and …, 2017
122017
Practical aspects of implementation of a multi-domain LED model
A Poppe, A Szalai
2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM …, 2014
122014
Diagnostics of LED-based streetlighting luminaires by means of thermal transient method
G Marosy, Z Kovács, G Molnár, A Poppe
2010 16th International Workshop on Thermal Investigations of ICs and …, 2010
122010
Thermal characterization of a radial micro-channel cooling plate
G Bognár, G Horvoth, Z Kohári, AJ Pang, MPY Desmulliez, A Poppe, ...
Semiconductor Thermal Measurement and Management IEEE Twenty First Annual …, 2005
122005
THERMODEL: A tool for thermal model generation, and application for MEMS
V Székely, M Rencz, A Poppe, B Courtois
Analog Integrated Circuits and Signal Processing 29 (1-2), 49-59, 2001
122001
Testing of Power LEDs: The Latest Thermal Testing Standards from JEDEC
A Poppe
Electronics Cooling Magazine, 0
12
LED Characterization within the Delphi4LED Project
G Farkas, L Gaál, M Bein, A Poppe, S Ress, M Rencz
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018
112018
Simulation framework for multilevel power estimation and timing analysis of digital systems allowing the consideration of thermal effects
G Nagy, A Poppe
2012 13th Latin American Test Workshop (LATW), 1-5, 2012
112012
Physics related modeling of power LEDs
K Paisnik, A Poppe, T Rang, G Rang
2012 13th Biennial Baltic Electronics Conference, 57-60, 2012
102012
Electro-thermal investigation of OLEDs
L Pohl, E Kollár, Z Kohári, A Poppe
2008 14th International Workshop on Thermal Inveatigation of ICs and Systems …, 2008
102008
Cross-verification of thermal characterization of a microcooler
Z Kohári, G Bognár, G Horváth, A Poppe, M Rencz, V Székely
102007
Thermal characterization and compact modeling of stacked die packages
P Szabo, A Poppe, G Farkas, V Szekely, B Courtois, M Rencz
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006
102006
Integration of a network solver and a field solver for the mixed-level thermal simulation of MEMS problems
M Rencz, V Szekely, A Poppe
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002 4755, 36-43, 2002
102002
Algorithmic extension of thermal field solvers: time constant analysis
V Székely, A Poppe, M Rencz
Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2000
102000
Electro-thermal simulation with the SISSI package
V Sze, A Pa, A Poppe, M Rencz
Analog Integrated Circuits and Signal Processing 21 (1), 21-31, 1999
101999
Structural analysis and modelling of packaged light emitting devices by thermal transient measurements at multiple boundaries
G Farkas, A Poppe, L Gaal, G Hantos, C Berenyi, M Rencz
2018 24rd International Workshop on Thermal Investigations of ICs and …, 2018
92018
Light output stabilisation of LED based streetlighting luminaires by adaptive current control
J Hegedüs, G Hantos, A Poppe
Microelectronics Reliability 79, 448-456, 2017
92017
Inter Laboratory Comparison of LED Measurements Aimed as Input for Multi-Domain Compact Model Development within a European-wide R&D Project
A Poppe, G Farkas, F Szabó, J Joly, J Thomé, J Yu, K Bosschaartl, ...
Proceedings of the Conference on “Smarter Lighting for Better Life” at the …, 2017
92017
Compact modeling approach for microchannel cooling aimed at high-level thermal analysis of 3D packaged ICs
M Németh, L Jani, A Poppe
2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS …, 2016
92016
Application of the transient dual interface method in test based modeling of heat-sinks aimed at socketable LED modules
A Poppe, G Hantos, J Hegedus
2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2015
92015
A novel simulation environment enabling multilevel power estimation of digital systems
G Nagy, A Poppe
Thermal Investigations of ICs and Systems (THERMINIC), 2011 17th …, 2011
92011
Issues of thermal testing of AC LEDs
A Poppe, B Siegal, G Farkas
2011 27th Annual IEEE Semiconductor Thermal Measurement and Management …, 2011
92011
Thermal characterization of multi-die packages
A Poppe, Y Zhang, G Farkas, H Wong, J Wilson, P Szabó
2006 8th Electronics Packaging Technology Conference, 500-505, 2006
92006
Experimental study of a radial micro-channel cooling plate
A Poppe, G Horváth, G Bognár, Z Kohári, MPY Desmulliez, M Rencz
2005 7th Electronic Packaging Technology Conference 2, 6 pp., 2005
92005
The Sissy electro-thermal simulation system-Based on modern software technologies
G Horváth, A Poppe
92005
Design of a scalable multi-functional thermal test die with direct and boundary scan access for programmed excitation and data measurement
A Poppe, G Farkas, M Rencz, Z Benedek, L Pohl, V Székely, K Torki, S Mir, ...
Proceedings of the 6th Therminic Workshop, 24-27, 2000
92000
Micro-systems modeling at a system level
JM Karam, B Courtois, K Hofmann, A Poppe, M Rencz, M Glesner, ...
APCHDL'96, 1996
91996
Embedded multi-domain LED model for adaptive dimming of streetlighting luminaires
J Hegedüs, G Hantos, A Poppe
2016 22nd International Workshop on Thermal Investigations of ICs and …, 2016
82016
Standardization of LED thermal characterization
A Poppe, CJM Lasance
Thermal Management for LED Applications, 197-264, 2014
82014
Solid State Physics Fundamentals of LED Thermal Behavior
J Li, J Wang, Z Liu, A Poppe
Thermal Management for LED Applications, 15-52, 2014
82014
Investigation of die-attach degradation using power cycling tests
Z Sarkany, A Vass-Varnai, M Rencz
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 780-784, 2013
82013
Electro-thermal modeling of large-surface OLED
E Kollár, I Zólomy, A Poppe
2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, 239-242, 2009
82009
An algorithm for the direct co-simulation of dynamic compact models of packages with the detailed thermal models of boards
M Rencz, V Szekely, A Poppe, B Courtois
4th Electronics Packaging Technology Conference, 2002., 293-298, 2002
82002
The system can't perform the operation now. Try again later.
Articles 1–100