| Thermal management for LED applications CJM Lasance, A Poppe Springer, 2014 | 277 | 2014 |
| Thermal investigation of high power optical devices by transient testing G Farkas, QV Vader, A Poppe, G Bognár IEEE transactions on Components and Packaging Technologies 28 (1), 45-50, 2005 | 159 | 2005 |
| Electro-thermal and logi-thermal simulation of VLSI designs V Szekely, A Poppe, A Páhi, A Csendes, G Hajas, M Rencz IEEE Transactions on Very Large Scale Integration (VLSI) Systems 5 (3), 258-269, 1997 | 117 | 1997 |
| Thermal measurement and modeling of multi-die packages A Poppe, Y Zhang, J Wilson, G Farkas, P Szabó, J Parry, M Rencz, ... IEEE Transactions on components and packaging technologies 32 (2), 484-492, 2009 | 102 | 2009 |
| Multi-domain compact modeling of LEDs: An overview of models and experimental data A Poppe Microelectronics Journal 46 (12), 1138-1151, 2015 | 89 | 2015 |
| On the standardization of thermal characterization of LEDs A Poppe, CJM Lasance 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management …, 2009 | 86 | 2009 |
| Multi-domain simulation and measurement of power LED-s and power LED assemblies A Poppe, G Farkas, V Székely, G Horváth, M Rencz Twenty-second annual IEEE semiconductor thermal measurement and management …, 2006 | 84 | 2006 |
| Simulation of LED based luminaires by using multi-domain compact models of LEDs and compact thermal models of their thermal environment A Poppe Microelectronics Reliability 72, 65-74, 2017 | 77 | 2017 |
| Increasing the accuracy of structure function based thermal material parameter measurements M Rencz, A Poppe, E Kollár, S Ress, V Székely IEEE Transactions on components and packaging technologies 28 (1), 51-57, 2005 | 73 | 2005 |
| Electric and thermal transient effects in high power optical devices G Farkas, S Haque, F Wall, PS Martin, A Poppe, Q van Voorst Vader, ... Twentieth Annual IEEE Semiconductor Thermal Measurement and Management …, 2004 | 72 | 2004 |
| Electro-thermal simulation: a realization by simultaneous iteration V Székely, A Poppe, M Rencz, A Csendes, A Páhi Microelectronics journal 28 (3), 247-262, 1997 | 71* | 1997 |
| THERMAN: a thermal simulation tool for IC chips, microstructures and PW boards V Székely, A Poppe, M Rencz, M Rosental, T Teszéri Microelectronics Reliability 40 (3), 517-524, 2000 | 67 | 2000 |
| Multi-domain modelling of LEDs for supporting virtual prototyping of luminaires A Poppe, G Farkas, L Gaál, G Hantos, J Hegedüs, M Rencz Energies 12 (10), 1909, 2019 | 54 | 2019 |
| Luminaire digital design flow with multi-domain digital twins of LEDs G Martin, C Marty, R Bornoff, A Poppe, G Onushkin, M Rencz, J Yu Energies 12 (12), 2389, 2019 | 46 | 2019 |
| Dynamic temperature measurements: tools providing a look into package and mount structures A Poppe, V Székely Electronics Cooling 8, 10-19, 2002 | 43 | 2002 |
| High-aspect-ratio metal microchannel plates for microelectronic cooling applications W Yu, MPY Desmulliez, A Drufke, M Leonard, RS Dhariwal, D Flynn, ... Journal of Micromechanics and Microengineering 20 (2), 025004, 2009 | 41 | 2009 |
| New approaches in the transient thermal measurements V Székely, S Ress, A Poppe, S Török, D Magyari, Z Benedek, K Torki, ... Microelectronics Journal 31 (9-10), 727-733, 2000 | 41 | 2000 |
| Temperature dependent thermal resistance in power LED assemblies and a way to cope with it A Poppe, G Molnár, T Temesvölgyi Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM …, 2010 | 40 | 2010 |
| Nonlinear electro-thermal modeling and field-simulation of OLEDs for lighting applications I: Algorithmic fundamentals L Pohl, E Kollár, A Poppe, Z Kohári Microelectronics Journal 43 (9), 624-632, 2012 | 36 | 2012 |
| Electrical, thermal and optical characterization of power LED assemblies A Poppe, G Farkas, G Horváth arXiv preprint arXiv:0709.1815, 2007 | 34 | 2007 |
| Short time die attach characterization of LEDs for in-line testing application M Rencz, A Poppe, P Szabó, G Farkas IEEE Press, 2006 | 34* | 2006 |
| Thermal testing of LEDs G Farkas, A Poppe Thermal Management for LED Applications, 73-165, 2014 | 32 | 2014 |
| CAD and Foundries for Microsystems JM Karam, B Courtois, H Boutamine, P Drake, A Poppe, V Székely, ... Proceedings of the 34th annual Design Automation Conference, 674-679, 1997 | 32 | 1997 |
| New way for thermal transient testing [IC packaging] V Székely, M Rencz, A Poppe, B Courtois Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 1999 | 31 | 1999 |
| Delphi4LED—From measurements to standardized multi-domain compact models of LED: A new European R&D project for predictive and efficient multi-domain modeling and simulation … R Bornoff, V Hildenbrand, S Lugten, G Martin, C Marty, A Poppe, M Rencz, ... 2016 22nd International Workshop on Thermal Investigations of ICs and …, 2016 | 30 | 2016 |
| A procedure to correct the error in the structure function based thermal measuring methods M Rencz, A Poppe, E Kollár, S Ress, V Székely, B Courtois Twentieth annual IEEE semiconductor thermal measurement and management …, 2004 | 30 | 2004 |
| Dynamic compact models of cooling mounts for fast board level design G Farkas, A Poppe, E Kollár, P Stehouwer Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2003 | 30 | 2003 |
| LED 3D thermal model calibration against measurement R Bornoff, G Farkas, L Gaal, M Rencz, A Poppe 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018 | 29 | 2018 |
| Smart SSL: Application of IoT/CPS design platforms in LED-based street-lighting luminaires A Szalai, T Szabó, P Horváth, A Timár, A Poppe 2016 IEEE Lighting Conference of the Visegrad Countries (Lumen V4), 1-6, 2016 | 29 | 2016 |
| Emerging standard for thermal testing of power LEDs and its possible implementation A Poppe, G Farkas, G Molnár, B Katona, T Temesvölgyi, JW He Tenth International Conference on Solid State Lighting 7784, 196-210, 2010 | 29 | 2010 |
| Electro-thermal simulation for the prediction of chip operation within the package M Rencz, V Székely, A Poppe, K Torki, B Courtois Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2003 | 29 | 2003 |
| Novel tools for thermal and electrical analysis of circuits V Székely, A Poppe Electrosoft 1 (4), 234-252, 1990 | 29 | 1990 |
| Advancing the thermal stability of 3D ICs using logi-thermal simulation G Nagy, P Horváth, L Pohl, A Poppe Microelectronics Journal 46 (12), 1114-1120, 2015 | 26 | 2015 |
| Nonlinear electro-thermal modeling and field-simulation of OLEDs for lighting applications II: Luminosity and failure analysis Z Kohári, E Kollár, L Pohl, A Poppe Microelectronics Journal 44 (11), 1011-1018, 2013 | 26 | 2013 |
| Ageing of LEDs: A comprehensive study based on the LM80 standard and thermal transient measurements A Poppe, G Molnár, P Csuti, F Szabó, J Schanda CIE 27th Session-Proceedings, CIE 197, 1-2, 2011 | 26 | 2011 |
| A step forward in multi-domain modeling of power LEDs A Poppe 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management …, 2012 | 25 | 2012 |
| New methods and supporting tools for the thermal transient testing of packages M Rencz, V Székely, A Poppe, G Farkas, B Courtois Proc. Intl. Conference on Advances in Packaging APACK, 407-411, 2001 | 25 | 2001 |
| On the standardisation of thermal characterisation of LEDs Part II: Problem definition and potential solutions A Poppe, CJM Lasance 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems …, 2008 | 24 | 2008 |
| A methodology for the co-simulation of dynamic compact models of packages with the detailed models of boards M Rencz, V Székely, A Poppe IEEE transactions on components and packaging technologies 30 (3), 367-374, 2007 | 24 | 2007 |
| Creating multi-port thermal network models of LED luminaires for application in system level multi-domain simulation using Spice-like solvers A Poppe, J Hegedűs, A Szalai, R Bornoff, J Dyson 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2016 | 23 | 2016 |
| Electro-thermal and logi-thermal simulators aimed at the temperature-aware design of complex integrated circuits A Poppe, G Horvath, G Nagy, M Rencz, V Székely 2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and …, 2008 | 23 | 2008 |
| Boundary condition independent dynamic compact models of packages and heat sinks from thermal transient measurements M Rencz, G Farkas, V Székely, A Poppe, B Courtois Proceedings of the 5th Electronics Packaging Technology Conference (EPTC …, 2003 | 23 | 2003 |
| Inclusion of RC compact models of packages into board level thermal simulation tools M Rencz, V Szekely, A Poppe, B Courtois Eighteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2002 | 23 | 2002 |
| Lifetime modelling issues of power light emitting diodes J Hegedüs, G Hantos, A Poppe Energies 13 (13), 3370, 2020 | 22 | 2020 |
| Comparison of two alternative junction temperature setting methods aimed for thermal and optical testing of high power LEDs MC Bein, J Hegedüs, G Hantos, L Gaál, G Farkas, M Rencz, A Poppe 2017 23rd International Workshop on Thermal Investigations of ICs and …, 2017 | 22 | 2017 |
| Studies on the possibilities of in-line die attach characterization of semiconductor devices P Szabó, A Poppe, M Rencz 2007 9th Electronics Packaging Technology Conference, 779-784, 2007 | 22 | 2007 |
| THERMODEL: A tool for thermal model generation, and application for MEMS V Székely, M Rencz, A Poppe, B Courtois Analog integrated circuits and signal processing 29, 49-59, 2001 | 22 | 2001 |
| Design flow for the development of optimized LED luminaires using multi-domain compact model simulations C Marty, J Yu, G Martin, R Bornoff, A Poppe, D Fournier, E Morard 2018 24rd International Workshop on Thermal Investigations of ICs and …, 2018 | 21 | 2018 |
| Assessment of isothermal electro-optical-thermal measurement procedures for LEDs GA Onushkin, KJ Bosschaart, J Yu, HJ van Aalderen, J Joly, G Martin, ... 2017 23rd International Workshop on Thermal Investigations of ICs and …, 2017 | 21 | 2017 |
| Issues in junction-to-case thermal characterization of power packages with large surface area A Vass-Varnai, S Gao, Z Sarkany, J Kim, S Choi, G Farkas, A Poppe, ... 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management …, 2010 | 21 | 2010 |
| A scalable multi-functional thermal test chip family: Design and evaluation Z Benedek, B Courtois, G Farkas, E Kolla´ r, S Mir, A Poppe, M Rencz, ... J. Electron. Packag. 123 (4), 323-330, 2001 | 21 | 2001 |
| Vibration combined high Temperature Cycle Tests for capacitive MEMS accelerometers Z Szucs, G Nagy, S Hodossy, M Rencz, A Poppe 2007 13th International Workshop on Thermal Investigation of ICs and Systems …, 2007 | 20 | 2007 |
| A methodology for the generation of dynamic compact models of packages and heat sinks from thermal transient measurements M Rencz, G Farkas, A Poppe, V Szekely, B Courtois IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology …, 2003 | 20 | 2003 |
| Design issues of a multi-functional intelligent thermal test die A Poppe, G Farkas, M Rencz, Z Benedek, L Pohl, V Székely, K Torki, S Mir, ... Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2001 | 20 | 2001 |
| A general multi-domain LED model and its validation by means of AC thermal impedance A Poppe, T Temesvölgyi 29th IEEE Semiconductor Thermal Measurement and Management Symposium, 137-142, 2013 | 19 | 2013 |
| Issues of thermal testing of AC LEDs A Poppe, B Siegal, G Farkas 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management …, 2011 | 19 | 2011 |
| A fast algorithm for the layout based electro-thermal simulation M Rencz, V Székely, A Poppe 2003 Design, Automation and Test in Europe Conference and Exhibition, 1032-1037, 2003 | 19 | 2003 |
| An alternative method for electro-thermal circuit simulation M Rencz, V Szekely, A Pahi, A Poppe 1999 Southwest Symposium on Mixed-Signal Design (Cat. No. 99EX286), 117-122, 1999 | 19 | 1999 |
| Requirements specification for multi-domain LED compact model development in Delphi4LED A Alexeev, R Bornoff, S Lungten, G Martin, G Onushkin, A Poppe, ... 2017 18th International Conference on Thermal, Mechanical and Multi-Physics …, 2017 | 18 | 2017 |
| Electro-thermal co-simulation of ICs with runtime back-annotation capability A Timár, G Bognár, A Poppe, M Rencz 2010 16th International Workshop on Thermal Investigations of ICs and …, 2010 | 18 | 2010 |
| Challenges in LED thermal characterisation CJM Lasance, A Poppe EuroSimE 2009-10th International Conference on Thermal, Mechanical and Multi …, 2009 | 18 | 2009 |
| Complex characterization of power LEDs: simultaneous measurement of photometric/radiometric and thermal properties G Farkas, A Poppe, J Schanda, K Muray Proc. CIE LED Conference, 92-95, 2004 | 18 | 2004 |
| Different questions of today's LED thermal testing procedures G Hantos, J Hegedüs, A Poppe 2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2018 | 17 | 2018 |
| Inter laboratory comparison of LED measurements aimed as input for multi-domain compact model development within a European-wide R&D project A Poppe, G Farkas, F Szabó, J Joly, J Thomé, J Yu, K Bosschaartl, ... Proceedings of the Conference on “Smarter Lighting for Better Life” at the …, 2017 | 17 | 2017 |
| Testing of Power LEDs: The Latest Thermal Testing Standards from JEDEC A Poppe Electronics Cooling Magazine, 0 | 17* | |
| Suggestions for extending the scope of the transient dual interface method A Poppe, A Vass-Varnai, Z Sarkany, M Rencz, G Hantos, G Farkas 2021 27th International Workshop on Thermal Investigations of ICs and …, 2021 | 16 | 2021 |
| Light output stabilisation of LED based streetlighting luminaires by adaptive current control J Hegedüs, G Hantos, A Poppe Microelectronics Reliability 79, 448-456, 2017 | 16 | 2017 |
| Delphi4LED-from measurements to standardized multi-domain compact models of light emitting diodes (LED) G Martin, A Poppe, S Lungten, V Heikkinen, J Yu, M Rencz, R Bornoff Electron. Cool 22, 20-23, 2016 | 16 | 2016 |
| Thermal characterization of a radial micro-channel cooling plate G Bognár, G Horvoth, Z Kohári, AJ Pang, MPY Desmulliez, A Poppe, ... Semiconductor Thermal Measurement and Management IEEE Twenty First Annual …, 2005 | 16 | 2005 |
| SISSSI-a tool for dynamic electro-thermal simulation of analog VLSI cells V Székely, A Pahi, A Poppe, M Rencz, A Csendes Proceedings European Design and Test Conference. ED & TC 97, 617, 1997 | 16 | 1997 |
| Measurement issues in LED characterization for Delphi4LED style combined electrical-optical-thermal LED modeling G Hantos, J Hegedüs, MC Bein, L Gaál, G Farkas, Z Sárkány, S Ress, ... 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-7, 2017 | 15 | 2017 |
| Practical aspects of implementation of a multi-domain LED model A Poppe, A Szalai 2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM …, 2014 | 15 | 2014 |
| Methodology for thermal and electrical characterization of large area OLEDs A Poppe, L Pohl, E Kollr, Z Kohári, H Lifka, C Tanase 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management …, 2009 | 15 | 2009 |
| Package characterization: simulations or measurements? A Poppe, A Vass-Varnai, G Farkas, M Rencz 2008 10th Electronics Packaging Technology Conference, 155-160, 2008 | 15 | 2008 |
| Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling plate MPY Desmulliez, AJ Pang, M Leonard, RS Dhariwal, W Yu, E Abraham, ... IEEE Transactions on Components and Packaging Technologies 32 (1), 20-29, 2008 | 15 | 2008 |
| Algorithmic extension of thermal field solvers: Time constant analysis V Székely, A Poppe, M Rencz Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2000 | 15 | 2000 |
| Mixed detailed and compact multi-domain modeling to describe CoB LEDs L Pohl, G Hantos, J Hegedüs, M Németh, Z Kohári, A Poppe Energies 13 (16), 4051, 2020 | 14 | 2020 |
| Multi-domain modeling of power LEDs based on measured isothermal IVL characteristics A Poppe, J Hegedüs, A Szalai Proceedings of the CIE Lighting Quality & Energy Efficiency Conference …, 2016 | 14 | 2016 |
| LED characterization within the Delphi4LED project G Farkas, L Gaál, M Bein, A Poppe, S Ress, M Rencz 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 13 | 2018 |
| Thermal characterization and compact modeling of stacked die packages P Szabo, A Poppe, G Farkas, V Szekely, B Courtois, M Rencz Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006 | 13 | 2006 |
| Diagnostics of LED-based streetlighting luminaires by means of thermal transient method G Marosy, Z Kovács, G Molnár, A Poppe 2010 16th International Workshop on Thermal Investigations of ICs and …, 2010 | 12 | 2010 |
| DELPHI style compact modeling of stacked die packages A Poppe, G Farkas, J Parry, P Szabo, M Rencz, V Szekely Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management …, 2007 | 12 | 2007 |
| Theory and practice of thermal transient testing of electronic components M Rencz, G Farkas, A Poppe Springer, 2022 | 11 | 2022 |
| AI-TWILIGHT: AI-digital TWIn for LIGHTing–a new European project G Martin, A Poppe, S Schöps, E Kraker, C Marty, W Soer, J Yu 2021 27th International Workshop on Thermal Investigations of ICs and …, 2021 | 11 | 2021 |
| Standardization of LED thermal characterization A Poppe, CJM Lasance Thermal Management for LED Applications, 197-264, 2013 | 11 | 2013 |
| Solid state physics fundamentals of LED thermal behavior J Li, J Wang, Z Liu, A Poppe Thermal management for LED applications, 15-52, 2013 | 11 | 2013 |
| Comparison of JEDEC dynamic and static test methods for the thermal characterization of power LEDs A Vass-Varnai, J Parry, G Toth, S Ress, G Farkas, A Poppe, M Rencz 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 594-597, 2012 | 11 | 2012 |
| Simulation framework for multilevel power estimation and timing analysis of digital systems allowing the consideration of thermal effects G Nagy, A Poppe 2012 13th Latin American Test Workshop (LATW), 1-5, 2012 | 11 | 2012 |
| Electro-thermal investigation of OLEDs L Pohl, E Kollar, Z Kohári, A Poppe 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems …, 2008 | 11 | 2008 |
| Cross-verification of Thermal Characterization of a Microcooler Z Kohári, G Bognár, G Horváth, A Poppe, M Rencz, V Székely | 11 | 2007 |
| The Sissy electro-thermal simulation system-Based on modern software technologies G Horváth, A Poppe THERMINIC 2005, 51-54, 2005 | 11 | 2005 |
| Electro-thermal simulation with the SISSI package V Sze´ kely, A Pa´ hi, A Poppe, M Rencz Analog Integrated Circuits and Signal Processing 21, 21-31, 1999 | 11 | 1999 |
| Micro-systems modeling at a system level JM Karam, B Courtois, K Hofmann, A Poppe, M Rencz, M Glesner, ... APCHDL'96, 1996 | 11 | 1996 |
| Structural analysis and modelling of packaged light emitting devices by thermal transient measurements at multiple boundaries G Farkas, A Poppe, L Gaal, G Hantos, C Berényi, M Rencz 2018 24rd International Workshop on Thermal Investigations of ICs and …, 2018 | 10 | 2018 |
| Embedded multi-domain LED model for adaptive dimming of streetlighting luminaires J Hegedüs, G Hantos, A Poppe 2016 22nd International Workshop on Thermal Investigations of ICs and …, 2016 | 10 | 2016 |
| Application of the transient dual interface method in test based modeling of heat-sinks aimed at socketable LED modules A Poppe, G Hantos, J Hegedus 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2015 | 10 | 2015 |
| Physics related modeling of power LEDs K Paisnik, A Poppe, T Rang, G Rang 2012 13th Biennial Baltic Electronics Conference, 57-60, 2012 | 10 | 2012 |
| Integration of a network solver and a field solver for the mixed-level thermal simulation of MEMS problems M Rencz, V Szekely, A Poppe Design, Test, Integration, and Packaging of MEMS/MOEMS 2002 4755, 36-43, 2002 | 10 | 2002 |
| Design of a scalable multi-functional thermal test die with direct and boundary scan access for programmed excitation and data measurement A Poppe, G Farkas, M Rencz, Z Benedek, L Pohl, V Székely, K Torki, S Mir, ... Proceedings of the 6th Therminic Workshop, 24-27, 2000 | 10 | 2000 |
| Compact modeling approach for microchannel cooling and its validation M Németh, G Takács, L Jani, A Poppe Microsystem Technologies 24, 419-431, 2018 | 9 | 2018 |
Márta RenczBudapest University of Technology and EconomicsVerified email at eet.bme.hu
