Balázs Illés
Balázs Illés
E-mail megerősítve itt: ett.bme.hu
CímIdézteÉv
Electrochemical migration behaviour of Cu, Sn, Ag and Sn63/Pb37
B Medgyes, B Illés, G Harsányi
Journal of Materials Science: Materials in Electronics 23 (2), 551-556, 2012
602012
Multi-physics modelling of a vapour phase soldering (VPS) system
B Illés, A Géczy
Applied Thermal Engineering 48, 54-62, 2012
352012
In situ optical inspection of electrochemical migration during THB tests
B Medgyes, B Illés, R Berényi, G Harsányi
Journal of Materials Science: Materials in Electronics 22 (6), 694-700, 2011
342011
Effects of humidity on tin whisker growth—Investigated on Ni and Ag underplated layer construction
B Horváth, B Illés, T Shinohara, G Harsányi
Thin Solid Films 520 (1), 384-390, 2011
302011
Investigating the dynamic changes of the vapour concentration in a Vapour Phase Soldering oven by simplified condensation modelling
B Illés, A Géczy
Applied Thermal Engineering 59 (1-2), 94-100, 2013
292013
Tin whisker growth from micro-alloyed SAC solders in corrosive climate
B Illés, B Horváth
Journal of alloys and compounds 616, 116-121, 2014
282014
Numerical study of the gas flow velocity space in convection reflow oven
B Illes, I Bako
International Journal of Heat and Mass Transfer 70, 185-191, 2014
282014
Distribution of the heat transfer coefficient in convection reflow oven
B Illés
Applied Thermal Engineering 30 (13), 1523-1530, 2010
282010
Heating characteristics of convection reflow ovens
B Illés, G Harsányi
Applied Thermal Engineering 29 (11-12), 2166-2171, 2009
262009
Measuring heat transfer coefficient in convection reflow ovens
B Illés
Measurement 43 (9), 1134-1141, 2010
252010
Effect of strongly oxidizing environment on whisker growth form tin coating
B Illés, B Horváth, G Harsányi
Surface and Coatings Technology 205 (7), 2262-2266, 2010
232010
Investigating direction characteristics of the heat transfer coefficient in forced convection reflow oven
B Illés, G Harsányi
Experimental Thermal and Fluid Science 33 (4), 642-650, 2009
232009
Corrosion properties of tin–copper alloy coatings in aspect of tin whisker growth
B Horváth, T Shinohara, B Illés
Journal of alloys and compounds 577, 439-444, 2013
222013
Whisker growth on annealed and recrystallized tin platings
B Horváth, B Illés, T Shinohara, G Harsányi
Thin Solid Films 520 (17), 5733-5740, 2012
222012
3D thermal model to investigate component displacement phenomenon during reflow soldering
B Illés, G Harsányi
Microelectronics Reliability 48 (7), 1062-1068, 2008
222008
Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics
B Medgyes, B Horváth, B Illés, T Shinohara, A Tahara, G Harsányi, ...
Corrosion Science 92, 43-47, 2015
212015
Modeling method of heat transfer during Vapour Phase Soldering based on filmwise condensation theory
A Géczy, B Illés, Z Illyefalvi-Vitéz
International Journal of Heat and Mass Transfer 67, 1145-1150, 2013
212013
Whiskering behaviour of immersion tin surface coating
B Illés, B Horváth
Microelectronics Reliability 53 (5), 755-760, 2013
212013
Numerical simulation of condensate layer formation during vapour phase soldering
B Illés, A Géczy
Applied thermal engineering 70 (1), 421-429, 2014
202014
Present status of transition to Pb-free soldering
Z Illyefalvi-Vitéz, J Pinkola, G Harsányi, C Dominkovics, B Illés, ...
28th International Spring Seminar on Electronics Technology: Meeting the …, 2005
172005
A rendszer jelenleg nem tudja elvégezni a műveletet. Próbálkozzon újra később.
Cikkek 1–20