| Investigation of microstructure and wetting behavior of Sn–3.0 Ag–0.5 Cu (SAC305) lead-free solder with additions of 1.0 wt% SiC on copper substrate MK Pal, G Gergely, D Koncz-Horváth, Z Gácsi Intermetallics 128, 106991, 2021 | 35 | 2021 |
| Characterization of the interface between ceramics reinforcement and lead-free solder matrix MK Pal, G Gergely, D Koncz-Horváth, Z Gácsi Surfaces and Interfaces 20, 100576, 2020 | 23 | 2020 |
| Investigation of the electroless nickel plated sic particles in sac305 solder matrix MK Pal, G Gergely, D Koncz-Horváth, Z Gácsi Powder Metallurgy and Metal Ceramics 58 (9), 529-537, 2020 | 23 | 2020 |
| Investigating the microstructural and mechanical properties of pure lead-free soldering materials (SAC305 & SAC405) PM Kumar, G Gergely, DK Horváth, Z Gácsi Powder Metall. Prog 18 (1), 49-57, 2018 | 20 | 2018 |
| Influence of ceramic particles on the microstructure and mechanical properties of SAC305 lead-free soldering material MP Kumar, G Gergely, D Koncz-Horvath, Z Gacsi Archives of Metallurgy and Materials 64 (2), 603-606, 2019 | 11 | 2019 |
| Microstructural investigations and mechanical properties of pure lead-free (Sn-3.0 Ag-0.5 Cu and Sn-4.0 Ag-0.5 Cu) solder alloy MK Pal, G Gergely, DK Horváth, Z Gácsi Metallurgical and Materials Engineering 24 (1), 27-36, 2018 | 10 | 2018 |
| Growth kinetics and IMCs layer analysis of SAC305 solder with the reinforcement of SiC during the isothermal aging condition MK Pal, G Gergely, Z Gácsi Journal of Materials Research and Technology 24, 8320-8331, 2023 | 8 | 2023 |
| Identification of optimum composition and mechanical properties of Al-Ni metal matrix composite MK Pal, SS Sandhu, R Kalia, A Ghosh Journal of Minerals and Materials Characterization and Engineering 3 (04), 326, 2015 | 8 | 2015 |
| Enhanced microstructure and mechanical properties of SiC particle reinforced aluminium alloy composite materials MK Pal, A Vikram, V Bajaj Acta Metallurgica Slovaca 25 (4), 253-258, 2019 | 7 | 2019 |
| Examination the effect of thermal shock test on SAC solder joints fabricated by THRS and multiwave soldering techniques D Koncz-Horvath, A Molnar, G Gergely, MK Pal, Z Gacsi Resolution and Discovery 4 (1), 1-6, 2019 | 5 | 2019 |
| Distribution and Microstructure Analysis of Ceramic Particles in the Lead‐Free Solder Matrix MK Pal, G Gergely, D Koncz‐Horváth, Z Gácsi Crystal Research and Technology 55 (12), 2000123, 2020 | 4 | 2020 |
| Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review MK Pal, V Bajaj Advanced Engineering Materials, 2300671, 2023 | 3 | 2023 |
| Morphological and mechanical evolution of α-Al2O3 reinforced MoCu alloy obtained by planetary ball milling D Pethő, T Kurusta, D Koncz-Horváth, F Kristály, T Mikó, MK Pal, Z Gácsi Journal of Manufacturing Processes 103, 1-10, 2023 | 2 | 2023 |
| Density and Dynamic Viscosity of Sn, Sn–Ag, and Sn–Ag–Cu Liquid Lead-Free Solder Alloys D Varanasi, MK Pal Powder Metallurgy and Metal Ceramics, 1-9, 2021 | 2 | 2021 |
| ANTAL KERPELY DOCTORAL SCHOOL OF MATERIALS SCIENCE & TECHNOLOGY MK Pal University of Miskolc, Hungary-3515 2021, 2021 | | 2021 |
Gergely GretaUniversity of Miskolc, Miskolci EgyetemVerified email at uni-miskolc.hu
